Abstract: A process is given for permitting the application to a substrate (2) of a microsystem or transducer (1) having a first partial surface (13), whose interaction with the environment is to be possible, and a second partial surface (14), which is to be protected against external influences. The substrate (2) is prepared, a passage point (20) being produced in said substrate (2). The microsystem (1) and substrate (2) are so mutually positioned that the first partial surface (13) faces the substrate (2) and that the passage point (20) in the substrate (2) and the first partial surface (13) come to rest opposite one another. Contacts (50, 51.1, 51.2) are produced by flip-chip technology. A sealing contact (51.1, 51.2) seals the second partial surface (14) against external influences. A gap (3) between the microsystem (1) and substrate (2) is filled with a filling material (30). A selective cover (24) over the passage point (20) keeps undesired external influences away from the first partial surface (13).

Abstract: A personal computing device comprises a chassis having a top and a bottom and a keyboard movably secured to the chassis. The keyboard includes a pair of laterally spaced arms with each arm having a connector that projects therefrom and confined within an elongated slot formed on the side of the chassis. This enables the keyboard to move between three different positions: (1) a closed position where the keyboard lies adjacent the top of the chassis, (2) an open position where the keyboard extends outwardly from the chassis, and (3) a stowed position where the keyboard lies adjacent the bottom of the chassis. Both the chassis and keyboard include IR ports that enable the keyboard to communicate with the chassis, thereby eliminating a wire connection between the chassis and keyboard.

Abstract: A cooling device has a heat sink for transferring a portion of heat generated by a heat generating component to a position different from the position of the heat generating component by heat conduction, a heat pipe for forcibly transferring at least a portion of the rest of the heat generated by the heat generating component to a position different from the position of the heat generating composition, and a forced-heat-radiating means for forcibly radiating the transferred heat from the heat radiating means.

Abstract: A method of preventing vibration loosening of a clamping screw 26 of a circuit protection apparatus 10 is provided. The circuit protection apparatus 10 has a conductor receiving member 28 including a conductor receiving opening 40 for receiving an electrical conductor 46 therein. The conductor receiving member 28 has an aperture 42 extending from a surface 50 thereof into communication with the conductor receiving opening 40. An overall extent of the aperture 42 includes threads. The method provides a clamping screw 26 having a threaded shaft 50. The threaded shaft 50 has a surface feature 52 in the threads thereof near an end 54 of the shaft.

Abstract: A mounting apparatus for mounting a data storage device in a computer housing includes a bracket, a securing means and a flexible plate. The bracket has a first face for supporting a data storage device, a second face opposite the first face and locking holes in its front portion. The securing means is mounted to a bottom of the data storage device and is moveable with the data storage device to be slid into the corresponding locking hole of the bracket. The flexible plate has a rear end securely fixed to the second face and a front end that has an operating portion extending out of the housing for being operable to move the front end away from the front portion of the bracket. The flexible plate further defines through holes for engaging with the locking holes to releasably block the sliding movement of the data storage device.

Abstract: A fixing apparatus of a data storing device comprises a lower case an upper case, and two combining elastic pieces. The left and right sides of this lower case each has a combining portion having a combining elastic piece thereon. The upper case is installed above the lower case; and two combining elastic pieces each has a buckling portion and a movable portion, the movable portion can drive the buckling portion, and the two combining elastic pieces is connected to left and right sides of the upper case. The data storing device can be disposed between the upper case and the lower case, and then the buckling portions of the combining elastic pieces connected to the left and right sides of the upper case are buckled to the combining holes of the lower case so that the data storing device is clamped and fixed between the upper case and lower case.

Abstract: A hinge engages a cam such that the hinge first rotates relative to the cam, then linearly engages the cam. Preferably, the hinge includes a guiding post that rides along a raised arched surface on the cam during the rotary motion of the hinge. Linear motion between the hinge and the cam preferably begins when the guiding post rides off the end of the arched surface. The rotary motion of the hinge is constrained by one or more engagement assemblies. In a preferred embodiment, one or more cams are mounted on a receiving structure and one or more hinges are mounted in corresponding locations on a detaching structure, where said detaching structure is physically separable from the receiving structure. Engagement between the one or more cams and the one or more corresponding hinges allows the detaching structure to first rotate relative to, then linearly engage, the receiving structure, providing for reliable blind mating between connectors on the detaching structure and connectors on the receiving structure.

Abstract: A fan mounting arrangement (10) includes at least one mounting member (14). Each mounting member (14) includes a resilient outer element (19) and an inner element (18) made from a substantially rigid material. The mounting members (14) are all arranged to extend generally parallel to each other. Each mounting member (14) is adapted to be received in a corresponding mounting receptacle (31) associated with a fan housing (11). Once the fan (11) is placed over the mounting members (14) with each mounting member received in its respective mounting receptacle (31), a retaining arrangement retains the fan in the installed position on the mounting members. In this installed position, the resilient elements (19) absorb vibrations from the fan (11) to mechanically isolate the fan from the remainder of the system.

Abstract: The present invention proposes an extracting and positioning structure for a hard disk drive suitable to an industrial computer. In the present invention, two side frame boards to fix at least a hard disk drive are installed on a frame of a computer. Latticed partitioning plates are installed on the frame boards. The present invention has at least an extractable case with fixing bars installed at two sides thereof to fix a hard disk drive therein. A U-shaped plate is installed at each side of the front half section of the extractable case. Pivotal holes are respectively disposed at the top and bottom surfaces of the U-shape plate to pivotally connect a spindle protruding out of the top and bottom surfaces of a pivotal retaining element. A fixing shaft protruding out of the top and bottom surfaces at the other end of the pivotal retaining element. A slide lever is transversely arranged in the U-shaped plate at the front end of the extractable case.

Abstract: A fixing device of a disk driver comprises a first body, a second body and two fixing elastic pieces. The first body has a bottom plate, one side of the bottom plate is connected to lateral plate, and fixing pins protrude from an inner wall of the lateral plate. The second body has a bottom plate, one side of the bottom plate is connected to a lateral plate, and fixing pins protrudes from an inner wall of the lateral plate. Two fixing elastic piece connected to the lateral plates of the first body and the second body, one end of each fixing elastic piece is formed with a buckling portion and a movable portion. The first body and the second body are assembled movably. A disk driver is disposed on the first body and the second body so that the fixing pins of the first body and the second body are inserted into respective holes preset at the two sides of the disk driver.

Abstract: An electronic package and method of making the electronic package is provided. The package includes a semiconductor chip and an multi-layered interconnect structure. The semiconductor chip includes a plurality of contact members on one of its surfaces that are connected to the multi-layered interconnect structure by a plurality of solder connections. The multi-layered interconnect structure is adapted for electrically interconnecting the semiconductor chip to a circuitized substrate (eg., circuit board) with another plurality of solder connections and includes a thermally conductive layer being comprised of a material having a selected thickness and coefficient of thermal expansion to substantially prevent failure of the solder connections between said first plurality of electrically conductive members and the semiconductor chip.

Abstract: A method and apparatus for packaging an electronic device, such as an integrated circuit chip (8), includes an intermediate device carrier (6) with a substantially planar upper surface (16) and a plurality of bonding pads (18) for coupling the carrier to the integrated circuit chip. A ceramic ring (38) is attached to the upper surface of the device carrier and a thermally conductive cover plate (36) is attached to the ceramic ring to form an inner cavity for receiving the chip therein. The ceramic ring comprises a material with a coefficient of thermal expansion substantially similar to or as the same as the device carrier to minimize stress therebetween during thermal expansion or contraction of the package device. The thermally conductive cover plate provides a path for dissipating heat generated during electrical operations of the chip.

Abstract: The present invention provides a heat management system for controlling the temperature inside of an electronics cabinet. A first heat exchanger is provided that includes a cold plate that is thermally interconnected with the electronic systems and components in the cabinet. A channel is defined in the cold plate that supports a tube having an entrance opening, an exit opening, and is arranged in thermal communication with the electronic systems so as to form a passageway for a liquid coolant fluid to travel through the channel. A second heat exchanger is provided that includes a condenser arranged in fluid flow communication with the entrance opening and the exit opening of the channel and a plurality of fans arranged in confronting relation to the condenser. A third heat exchanger is provided that includes two stacks of substantially parallel plates arranged in two-plate assemblies.

Abstract: A component shim 310 is used with printed circuit boards 306 and heat spreaders 314, for example, where each of the printed circuit board 300 and heat spreader 314 has a surface 304, 312 that are in different spaced apart planes. A component 300 has one lead attached to the surface 304 of the printed circuit board 306. The component shim 310 has a conductive section 320 with an upper attachment layer 326 and a lower attachment layer 332 secured to opposed sides 322, 324 of the conductive section 320. The upper attachment layer 326 is secured to a bottom 308 of the component 300 and the lower attachment layer 332 is secured to a surface 312 of the heat spreader 314. The total thickness of the conductive section 320 and upper and lower attachment layers 326, 332 of the component shim 310 is substantially equal to a distance from the bottom 308 of the component 300 to the surface 312 of the heat spreader 314.

Abstract: A multi-chip module cooling device is provided which equally and efficiently reduces the rises in temperature of LSI chips, and which is superior in the productivity of multi-chip modules, such as their capability to be assembled and disassembled. A multi-chip module includes semiconductor devices and a sealing top plate for removing the heat generated by them. The sealing top plate has a number of parallel cooling channels and a number of cross grooves extending partially across the cooling channels. The cooling channels arc covered with a cooling channel cover, which is provided with turbulent promoters on an inner wall thereof. When the cooling channel cover is placed over the sealing top plate, the turbulent promoters engage with the cross grooves. The turbulent promoters are positioned midway between adjacent semiconductor devices.

Abstract: An apparatus for mounting a system component in a chassis includes an electrically conductive chassis having a grounding frame mounted therein and electrically connected thereto. An access opening extends through the grounding frame. The access opening is defined by opposed longitudinal edges. An elongated contact member is attached to the grounding frame adjacent to each longitudinal edge of the access opening. Each one of the contact members is resiliently deflectable about a pivot axis adjacent the corresponding longitudinal edge. Discontinuities and obstructions along the edge portions of the expansion device do not engage and damage the contact members. Furthermore, a substantially continuous EMI gasket is provided along substantially the entire edge of the expansion card, improving the reliability of the ground between the chassis and the expansion device and reducing electromagnetic emissions.

Abstract: A storage box for hard disk drive (HDD) is provided. The storage box includes an outer frame, a first holder, a second holder, a cooling module and a back panel board. The first and second holders are opposite and for supporting the HDD. The cooling module, for cooling the HDD, is fixed in the storage box via the second holder and the outer frame. The cooling air is drawn into the storage box by the cooling module. The back panel board is electrically connected to the cooling module. The back panel board has an outlet positioned relative to the cooling module. The cooling air is flowed through surface of the HDD and a heat sink of the cooling module, and then exhausted from the outlet of the back panel board.

Abstract: Breaker switch arranged on a wall (4) of an electric device (9) including a receptacle (20), containing a thermofusible composition (25) having a softening point &thgr;1, and a flexible metal strip (10) interposed between two studs (2a, 2b) fixed by one end to the wall (4) extending above the receptacle (20) and being provided in its free portion with means (14, 18-19) for the anchoring thereof in said thermofusible composition to bend the strip (10) against the two studs (2a, 2b). The receptacle (20) is advantageously extended by a heat probe (27) going to the core of the device (9). When the temperature of the device (9) exceeds &thgr;1 the anchoring means (14) are released from the thermofusible composition by the elastic return force of the strip (10) thereby opening the contact between the studs (2a, 2b). Application to a battery, in particular of the lithium-ion type.

Abstract: The present invention provides for an apparatus and method for securing a computer component in a computer system. Some embodiments include single or multiple panels hinged to a chassis of the computer system. A panel of some embodiments may carry or otherwise secure components of the computer system. One such component that may be carried by a panel is a computer power supply.

Abstract: A combined electromagnetic interference (EMI) shield and heat dissipation is comprised of a five-sided receptacle coupled to a heat spreading plate. The receptacle is composed of a shield material having an insulated interior coating. A compact, low profile assembly to house the motherboard of notebook computer achieves a significant reduction in vertical thickness by combining the functions of an EMI shield and heat dissipation structure.