Abstract: The present invention relates to methods for optimizing a production process having starting products, intermediate products and at least one final product. The present invention also relates to a digital storage medium and a computer program product that can be used in connection with the methods of the present invention.

Abstract: System and method for utilizing a drawing specification for motion control. A plurality of elements in a drawing specification may be automatically identified. The elements may include one or more lines, polygons, arcs, splines, alphanumeric characters, and/or ellipses. Additionally, the drawing specification may be a drawing or digital drafting file, e.g., an AutoCAD file, among others. An order of the plurality of elements may be automatically determined according to a sorting algorithm. The sorting algorithm may include a geometric and/or radial sorting algorithm. The radial sorting algorithm may specify the order of the elements according to nesting, e.g., nesting order and depth, and/or distance from the center of the drawing specification. Code may be automatically generated for implementing motion control based on the identified elements and the determined order. The generated code may include inserted operations such as raise, lower, and move operations, among others.

Abstract: The invention is a method for controlling an electrolytic process and plant, utilizing history data collected in the process as well as mathematical and heuristic models created on the basis of empirical knowledge, and by means of said models, there are defined indexes based on real-time process measurement parameters. The method makes use of real-time cell voltage measurements. On the basis of the obtained real-time indexes, there is achieved a correctly focused process control action at the correct point of time.

Abstract: Sites to be measured on a device that is to be fabricated using at least one fabrication process, are selected based on a pattern-dependent model of the process. A metrology tool to measure a parameter of a semiconductor device includes a control element to select sites for measurement based on a pattern dependent model of a process with respect to the device. Problematic areas, within a chip or die and within a wafer, are identified that result from process variation. The variation is identified and characterized, and the location of each site is stored. The sites may be manually entered into a metrology tool or the method will automatically generate a measurement plan. Process variation and electrical impact are used to direct the measurement of within-die and wafer-level integrated circuit locations.

Abstract: Utilizing the latest microprocessor technology, the digital moisture monitor controller along with its wide applications alternating current conduction moisture sensors and optional X10 multi sensor multi pump controller, controls moisture levels in all soils and all of today's hydroponics mediums.

Abstract: A technique of estimating electrical parameters of an earth formation accounts for spatial inhomogeneities and frequency dispersion. The results are achieved using a model which is evaluated to generate predicted values for a plurality of electrical signals measured in a borehole in an earth formation as a function of a first set of model electrical parameters, a second set of model electrical parameters and model spatial coordinates of boundaries between regions of the earth formation. Transformations are applied to the measured electrical signals and the predicted values. The electrical parameters and spatial coordinates are selected to cause approximate agreement between the transformed measurements and the transformed predicted values.

Abstract: The present invention discloses a method that recognizes and uses the grouping patterns of process material by different machines at different process steps to identify potential problem machines causing the excursion in semiconductor manufacturing. The excursion could be a yield problem at the final test or at any inline electrical testing, metrology measurement, or inspection at different process steps. The potential problematic machines are listed in order of most likely to be problematic.

Abstract: A vehicle service system having a vehicle service computer which is configured for communication with at least one on-board vehicle computer of a vehicle undergoing a vehicle service procedure via a vehicle fault tolerant communication bus, to retrieve or access information stored in a memory associated with the vehicle computer, to modify or store information in the vehicle computer associated memory, or to enable vehicle service system control of at least one vehicle component.

Abstract: A graphical user interface communicatively coupled with a non-contact measurement and alignment device enables user control over and display of the readings from the non-contact measurement and alignment device. In operation with a power tool, the graphical user interface provides a user with selectable control over the power tool through the computation and display of multiple power tool settings.

Abstract: An end-user load controller that can be used in an electrical energy supply system for controlling electrical energy to an end-user load is disclosed. The controller periodically evaluates whether the load should be on or off based on comparisons of load-operating information and system emergency information to predetermined criteria which is provided to the controller from time to time. The load is switched on or off depending upon the load-operating information as compared to the predetermine criteria. Also, the load is switched off depending on the system emergency information as compared to the predetermined criteria, regardless of the load-operating information.

Abstract: A method for monitoring performance of an advanced process control system for at least one process output includes calculating a variance of a prediction error for a processing performance and/or a probability for violating specification limits of the processing performance of the at least one process output. If the variance of the prediction error is calculated, the method also includes calculating a model health index. If the probability for violating specification limits is calculated, the method further includes calculating a process health index.

Abstract: A methodology for doing process control by using a heating apparatus comprising heating zones is revealed. First, a target CD (critical dimension) map is assigned. A baseline CD map corresponding to a substrate processed with the heating apparatus at a baseline setting is also obtained. An original CD map corresponding to a substrate processed at an original setting is obtained. For each heating zone, a perturbed CD map corresponding to a substrate processed at a perturbed setting is also obtained. The temperature distribution of the heating apparatus is adjusted according to the error CD map defined by the baseline CD map and the target CD map, basis functions defined by the original CD map and perturbed CD maps, and expansion coefficients expanding the error CD map with basis functions.

Abstract: A method of socket design and fabrication for Below-the-Knee (BK) amputees that utilizes manual measurements. This method, known as BK by Measurement, utilizes a manual measurement procedure where predetermined points are identified and measurements are taken of a patient's residual limb. These measurements are recorded and thereafter entered into a software package enabling customization by the fabrication facility. Prosthetic components fabricated in accordance with the present invention provide a custom fit, while not relying on more expensive digital imaging technology. The invention also provides a method and associated system for recording and retrieving fabrication and/or fitting data associated with a prosthetic component for use with a particular patient, which can include affixing to the prosthetic component a strip debossed with indicia unique to the particular patient or prosthetic component.

Abstract: In one aspect a factory automation system for a wafer fab is provided. The factory automation system comprises: a manufacturing execution system (“MES”) for providing lot information; a material control system (“MCS”) for providing dynamic traffic information; an automated material handling system (“AMHS”) for providing static route information; and a real-time dispatching (“RTD”) system to select a destination and a route for a wafer carrier in response to a transfer request. In another aspect a method of transferring a wafer lot within a wafer fabrication facility (“fab”) using a factory automation system is provided. The method comprises: receiving a transfer request to move the wafer lot from a first position to a second position within the fab; obtaining lot information, dynamic traffic information, and static traffic information; using the information to select a route between the first position and the second position; and executing the transfer using the selected route.

Abstract: A method of balancing workload using critical dates and including the following steps: (a) assigning a promised delivery date to orders received from customers; (b) identifying one or more tasks associated with each of the orders; (c) assigning an expedited date or a customer requested date to each of the tasks of some of the orders; (d) determining a work start date for each of the one or more tasks in each of the orders; (e) assigning a first priority to tasks having a work start date D; (f) assigning a second priority to tasks scheduled to begin on day D+n and having the expedited date; (g) assigning a third priority to tasks scheduled to begin on day D+n and having the customer requested date; (h) setting n equal to a value of 1; (i) working on tasks during a work shift based on order of priority, wherein work on a lower priority task is not commenced until work on all tasks with higher priorities has been completed; (j) increasing n by an increment of 1; and (k) repeating steps (g), (h), (i), (j) and (k)

Abstract: A method for reducing instantaneous current on startup is applicable to an electronic device with a management controller. The management controller is electrically connected to a startup processing module of the electronic device such that operations of fans equipped in the electronic device can be controlled via this electrical connection relationship. When the electronic device is turned on, operations of the fans in the electronic device are disabled by the startup processing module. Then, when power is detected by the management controller, the smallest amount of current possible for operations of the fans for heat-dissipating purpose is generated by the management controller. Finally, hardware components in the electronic device are initialized by the management controller. The above method solves the problem of system instability due to large instantaneous current on startup in the prior art.

Abstract: As an electrochemical cell stack gets older the internal resistances within the stack rise overtime as the materials that the stack is made of degrade. Consequently, an old and “worn” electrochemical cell stack draws less current at the same stack voltage and operating temperature as a new stack. When the current draw falls the electrochemical reaction rates also fall, as less energy is available to drive the electrochemical reactions. However, if the operating temperature of an older stack is controllable raised the current draw by an electrolyzer cell stack also rises, which in turn causes the reaction rates to rise again. Accordingly, in some embodiments, a balance-of-plant system is operable to regulate the current draw of an electrolyzer cell stack by first manipulating the operating temperature of the same electrolyzer cell stack.

Abstract: A method of generating a manufacturing process for producing an assembly and a computer system or systems implementing the method. The method generally includes the steps of: designing at least one assembly to be produced having at least two components to be engaged to one another such that the area where the components are to be engaged thereby defines at least one contact area; generating a representation, typically a three-dimensional representation, of the assembly; assigning a unique identifier to each individual component of the assembly or, when a group of more than one identical components is utilized in the assembly, assigning identical unique identifiers to each component of the group, thereby identifying each component as identical; assigning manufacturing instructions to the contact area; and generating manufacturing instructions for the manufacturing process based at least in part on the identifier and the contact area.

Abstract: A method of optimizing die placement on a wafer having an alignment mark with a computing system includes arranging a plurality of fields on the wafer in a first position. Dummies are inserted between at least one arranged field and the alignment mark and inserted adjacent to the wafer edge. The total number of dies manufacturable on the wafer at the first position is determined. The wafer position is shifted to a second position relative to the position of the plurality of fields, and the total number of dies manufacturable on the wafer at the second position is determined. The total number of manufacturable dies from each of the first and the second positions is compared, and the positions having the higher number of manufacturable die are candidates of optimal die placement position. Then the total number of fields, the total number of dummies, and the total number of shared dummies are evaluated to decide the optimal die placement position.

Abstract: Systems and methods for authoring and playing back lighting programs that include a plurality of lighting sequences for controlling a plurality of lights. One aspect stores the lighting program in a data format that represents a final data stream capable of directly controlling the plurality of lights. Another aspect allows execution of the lighting program to be modified in response to external stimuli.