Abstract: An encapsulant consisting of an epoxy resin composition and suitably used to encapsulate a semiconductor device which is to be surface-mounted contains(a) an epoxy resin,(b) a rubber-modified phenolic resin comprising a phenolic resin, and a methylmethacrylate-butadiene-styrene copolymer and a thermosetting silicon rubber dispersed in said phenolic resin,(c) a curing accelerator, and(d) a silica powder.
Abstract: Coating compositions which do not contain metal powders and which contain, as coloring component, 0.001 to 30% by weight of at least one organic pigment and/or of a polymer-soluble dye and/or of a pearlescent pigment and 0.001 to 30% by weight of molybdenum disulfide, based on the coating produced therewith, are suitable, for example, for coloring surfaces, especially metal surfaces.
Abstract: A glass or mineral fiber-filled polyester resin comprising a polyetherester or poly(etherimide ester) or a blend of one or both of a polyetherester or a poly(etherimide ester) with poly(butylene terephthalate) or poly(ethylene terephthalate). The composition must not have a matrix phase of poly(butylene terephthalate) or poly(ethylene terephthalate). The fiber has substantially no adhesion for the polyester base resin. The glass or mineral fibers effectively control the coefficient of linear thermal expansion of the polymer blend. The low adhesive fiber does not result in the reduction in toughness associated with conventional reinforcing adhesive fiber (which is coated with a coupling agent for the resin).
Abstract: A heat curable resin composition consists essentially of a thermosetting resin, a curing agent chemically reacting with the resin for curing the resin upon the application of a predetermined amount of heat for a predetermined period of time, and a chemically inert salt which is soluble in the resin for increasing the dielectric loss factor of the composition without a significant increase in viscosity of the composition to accelerate the dielectric heating rate.A method of preparing the heat curable resin composition includes the steps of mixing the thermosetting resin and curing agent which chemically reacts with the resin for curing the resin upon the application of a predetermined amount of heat for a predetermined period of time and dissolving a chemically inert salt in the resin and increasing the dielectric loss factor of the composition without a significant increase in viscosity of the composition.
Abstract: The present invention relates to a polycarbonate resin composition comprising:100 parts by weight of a polycarbonate resin;(A) 00.5 to 1 part by weight of an ester of saturated fatty acid having 10 to 30 carbon atoms and monohydric or polyhydric alcohol having 2 to 30 carbon atoms;(B) 0.05 to 1 part by weight of paraffin wax, and(C) 0 to 0.001 part by weight as a phosphorus atom of at least one phosphorus compound selected from the group consisting of phosphorus acid and phosphorous acid esters, wherein the total amount of the components (A) and (B) is 0.1 to 1 part by weight.The present invention further relates to a polycarbonate resin composition comprising:100 parts by weight of a polycarbonate resin;(D) 0.05 to 1 part by weight of .beta.-long side chain alcohol/behenic acid ester or long chain aliphatic alcohol; and(E) 0 to 0.001 part by weight as a phosphorus atom of at least one phosphorus compound selected from the group consisting of phosphorous acid and phosphorus acid esters.
Abstract: Glass fiber reinforced polyethylene terephthalate molding resin blends are provided which crystallize rapidly after being injection molded and which have engineering resin performance characteristics. In addition to polyethylene terephthalate and glass fibers, the blends contain an aliphatic polyester, an ionic hydrocarbon polymer, an antioxidant, and, optionally, polythylene and/or a polymeric epoxy compound. The blends can be flame retarded with a brominated polystyrene and an antimonate without substantial loss of, or change in, properties.
Abstract: A pre-cure resistant powder resin binder for waferboard/oriented strandboard manufacture is manufactured from spray drying a liquid resin composition containing a low advanced phenol-formaldehyde resin and a water soluble oxo compound of boron. The spray dryability of the low molecular weight phenol-formaldehyde resin is enhanced by the addition of the oxo boron compound.
Abstract: The present invention provides shaped articles incorporating mixed particulate metals comprising fine particles of a first metal or a compound thereof capable of releasing a metal ion having a first antimicrobial function, and a second metal having an ionization tendency different from that of the first metal or a compound thereof capable of releasing a metal ion having a second antimicrobial function, together with a polyester compound having specific properties, dispersed therein, and thus being capable of effectively releasing gradually over a long period a trace amount of the metal ions having an antimicrobial function from the particulate metals and maintaining an excellent antimicrobial function. The fibers according to the present invention also have excellent durability of the antimicrobial function and have excellent mildew resistance, in repeated washings and in service.
Abstract: The present invention is directed to branched polyesters derived from the reaction product of hydroxy stearic acid or hydroxy stearic alkoxylate, a guerbet alochol or guerbet alcohol alkoxylate, which product is further reacted with a polycarboxylic acid to provide the required branching in the polyester structure. The invention is also directed to the preparation, compositions and application of said internal plastic lubricants, particularly suited for use in forming of polycarbonate thermoplastics.
Abstract: Resin compositions of polyethylene terephthalate, aliphatic polyester and, optionally, filler are provided which have rapid crystallization, broad crystallizing temperature range, and high heat distortion temperatures when molded.
Abstract: A non-asbestos friction material has a core group of fibers that is universally used in a plurality of friction material formulations to provide appropriate friction materials for different end uses. The universal core group is resistant to temperatures above 1000.degree. F. Friction materials made with the core group have the additional advantage of long wear. Polybenzimidazole (PBI) is an essential element of the core group of fibers because its friction level increases as the temperature increase. The other elements of the core group are aramid fibers, carbon fibers, and a high strength ceramic fiber.
Abstract: Hot melt adhesive compositions for bonding rigid polypropylene substrates comprise intimate blends of an amorphous copolyolefin copolymer, a polyolefin wax, a rosin-based ester resin and a polybutylene copolymer.
February 21, 1990
Date of Patent:
August 20, 1991
Findley Adhesives, Inc.
George Koprowicz, Patrick Czaplewski, Michael Kaczkowski
Abstract: Thermoplastic polyester compositions comprising at least two groups of polybutylene terephthalate with substantially different intrinsic viscosity values and conventional additives for molding having an improved thermal flow capability under molding conditions expressed in such indices as heat flow (m cal/sec), enthalphy change .DELTA.Hm(Joule/gr) at the solidification of fused polymer, crystalline fraction (Xc), and the time of growth to (sec) of the primary nuclei of embryonic crystalline. The polymer compositions of the present invention result in a larger size of crystalline than the case of independent, single polymer and this enables to carry out injection moulding at about 20 degrees lower cylinder temperature than usual molding practice without sacrificing mechanical and thermal properties of the product.
Abstract: An improved process for producing biphenylene sulfide comprising reacting difluorobiphenyl with an alkali metal sulfide in a polar organic compound. The resulting polymer has a high melting point and fiber composites formed therefrom have excellent mechanical properties.
Abstract: A silicone dispersion, having improved toughness and thixotropic characteristics, cures to an elastomer upon exposure to the air. The dispersion is particularly useful for spraying onto exposed electrical conductors to prevent their shorting out from contact with animals and birds. The dispersion contains a hydroxyl endblocked polydimethylsiloxane, aluminum trihydrate, moisture activated crosslinking agent and catalyst. In order to obtain thixotropy, it also contains a phenyl or 3,3,3 trifluoropropyl-containing hydroxyl endblocked polydiorganosiloxane and untreated fumed silica. The method of making the dispersion is also specified.
Abstract: A semiconductor sealing epoxy resin composition includes a flexibilizer which is a previous reactant between a denatured silicone oil having epoxy groups and a phenol novolak resin, a novolak type of epoxy resin, a hardening agent, an accelerator, a filler, a die lubricant, and a surface treatment agent. This composition has a heat and moisture resistance needs for a semiconductor sealing material, and as well as a low elastic modulus.
Abstract: The present invention is directed to an aqueously dispersed, ambient temperature curable composition containing(a) an epoxy resin which is rendered water-dispersible by chemically incorporated emulsifiers and/or by being admixed with external emulsifiers and(b) an isocyanate-terminated prepolymer(i) which is rendered water-dispersible by chemically incorporated emulsifiers and/or by being admixed with external emulsifiers,(ii) which is prepared from a mixture containing a polyisocyanate and a compound having a molecular weight of at least 500 and at least two hydroxyl groups and(iii) wherein the isocyanate groups are blocked with a phenolic compound.The present invention is also directed to a process for preparing polyurethanes by reacting the above blends with polyamines at ambient or elevated temperature and to the polyurethanes produced therefrom.
Abstract: The invention concerns a polyester film with improved abrasion resistance, dimensional stability, drawability and slip properties. The film is characterized by the fact that it contains 0.005 to 5.0% by weight of organic, preferably hardened or crosslinked, particles with narrow particle size distribution in a range between 0.01 and 5 microns, as well as a nucleating agent in an amount from 0.01 to 10% by weight, both values related to the weight of the polymers which form the film.
September 28, 1990
Date of Patent:
July 16, 1991
Hermann Dallmann, Werner Schaefer, Wolfgang Gawrisch, Hartmut Hensel
Abstract: An in situ polymerized thermplastic resin incorporating hollow glass spheres, which are incorporated during polymerization of the resin, and a method of making a concentrate of hollow glass spheres dispersed in a thermoplastic resin with minimal sphere fracture by adding the spheres during polymerization of the resin.
Abstract: An improved polymerizable composition for molding and the like including a monomer composition capable of free radical polymerization, a reactive extender which is a stabilized reaction product of an alkali metal silicate and a water soluble, unsaturated carboxylic acid and an inorganic filler, at least part of which includes a group II metal carbonate. The reactive extender and the process for producing same are also claimed.