Abstract: An electronic apparatus includes a hinge device that connects a first chassis member and a second chassis member to be relatively rotatable, a rear cover component that is disposed to fill a space between a first end portion of the first chassis member and a second end portion of the second chassis member separated from each other in a first posture, and a sheet member that has flexibility, is provided to straddle between the rear cover component and an inner surface of the first chassis member and an inner surface of the second chassis member, and covers a gap between the rear cover component and the first end portion and a gap between the rear cover component and the second end portion.

Abstract: An electronic device includes: a housing that has a first principal surface, a second principal surface on an opposite side of the first principal surface, and a side surface connecting the first principal surface and the second principal surface; a fan disposed inside the housing; an air passage disposed inside the housing and through which air sent from the fan passes; and a fin disposed in the air passage. The air passage extends from the fan toward the side surface. The housing has a recess recessed from the second principal surface toward the first principal surface and extending toward the side surface, at a position overlapping with the air passage in a plan view. The recess has a recessed surface facing the first principal surface, and a recess side surface positioned nearer to the fin than the side surface is in an extending direction of the air passage.

Abstract: Systems and methods for providing and using a liner including one or more rigid over-molds for a chassis of a computing device cooled with a liquid fluid are disclosed. The liner may include a flexible membrane configured to be positioned in a chassis to form a liquid barrier that retains a liquid cooling fluid and one or more rigid over-molds configured to align components in fixed positions relative to other respective components or the chassis. The rigid over-molds may be located on the interior and/or the exterior of the liner to fixedly couple to components and/or the chassis. A set of over-molds may also be configured to enable insertion of connectors exterior to the liner, wherein a first rigid over-mold on the interior of the liner may be aligned with a second rigid over-mold on the exterior of the liner.

Abstract: A computing system includes a chassis, a water circulation network coupled to the chassis, a power distribution network coupled to the chassis, and one or more sleds removably coupled to the chassis. The water circulation network includes a cold water distribution network and a hot water collection network. Each sled of the one or more sleds includes a corresponding cold plate. Each sled is configured to slide along the chassis in two slide directions including a slide-close direction to reach a closed position and a slide-open direction to vacate the closed position. When in the closed position, each sled is configured to (a) bridge the hot water collection network and the cold water distribution network via the corresponding cold plate and (b) couple to the power distribution network.

Abstract: Autonomous driving computing systems in autonomous vehicles can include semiconductor chips with varying degrees of heat dissipation. The semiconductor chips are mounted on a printed circuit board, which together may be packaged in an enclosure assembly. The enclosure assembly may be mounted in the autonomous vehicle. Having a compact or low-profile enclosure assembly, and the harsh operating environment of the autonomous vehicle may pose a challenge for cooling the semiconductor chips and design of the enclosure assembly. Some cooling mechanisms can be difficult to manufacture, assemble, and/or service. An impeller-based intake subassembly can be combined with an air guidance plate that has a hollow structure that can direct air from the intake subassembly towards the printed circuit board through exhaust slots extending from the hollow structure, and air pathways to direct the air across the printed circuit board from the exhaust slots towards an impeller-based exhaust subassembly.

Abstract: A solid-state storage device is provided. The solid-state storage device includes a case, a solid-state storage module, and a heat dissipation unit. The case includes a receiving space. The solid-state storage module is disposed in the receiving space of the case. The heat dissipation unit is connected to the case. The heat dissipation unit covers the receiving space and is thermally connected to the solid-state storage module. The heat dissipation unit includes a working fluid, a cooling channel, and at least one heat conductive rib. The cooling channel extends into the heat dissipation unit. The working fluid travels in the cooling channel. The heat conductive rib extends into the cooling channel. The solid-state storage device satisfies the specification of SNIA SFF-TA-1008.

Abstract: A rotation connection mechanism includes a first plate, a second plate, a control structure, and a torsion structure. The control structure is configured to control the first plate and the second plate to switch between a first relative position and a second relative position. The first plate and the second plate are at the first relative position, and the first plate and the second plate form a plate. The first plate and the second plate are at the second relative position, and the first plate faces the second plate to have a target angle. The torsion structure is configured to provide torsion support at the first relative position and the second relative position, and provide a force for the control structure to control the first plate and the second plate to switch between the first relative position and the second relative position under an external force.

Abstract: A storage assembly includes a heat dissipation device and a storage. The heat dissipation device includes a thermally conductive block, a heat sink and a plurality of heat pipes. An end of each of the heat pipes is thermally coupled with the thermally conductive block, and another end of each of the heat pipes is thermally coupled with the heat sink. The storage is thermally coupled with the thermally conductive block.

Abstract: Disclosed is an electronic device includes a flexible circuit board passing via a first through-hole included in a first housing and a second through-hole included in a second housing, a first support bracket disposed to support the flexible circuit board while covering the first through-hole, a second support bracket disposed to support the flexible circuit board while covering the second through-hole, a first waterproof member disposed to face a partial area of the first through-hole from the first support bracket and inserted into the partial area of the first through-hole, a second waterproof member inserted into the remaining areas of the first through-hole, a third waterproof member disposed to face a partial area of the second through-hole from the second support bracket and inserted into the partial area of the second through-hole, a fourth waterproof member inserted into the remaining areas of the second through-hole.

Abstract: A solid-state storage device is provided. The solid-state storage device includes a case, a solid-state storage module and a heat dissipation unit. The case includes a receiving space. The solid-state storage module is disposed in the receiving space of the case. The heat dissipation unit is connected to the case. The heat dissipation unit covers the receiving space and is thermally connected to the solid-state storage module. The heat dissipation unit includes a working fluid and a cooling channel. The cooling channel extends in the heat dissipation unit. The working fluid travels through the cooling channel. The heat dissipation unit comprises a plurality of restriction stages. The restriction stages abut the solid-state storage module and restrict the solid-state storage module. The solid-state storage device satisfies the SNIA SFF-TA-1008 specification.

Abstract: An immersed cooling system for cooling electronic devices includes a cooling tank accommodating coolant and multiple electronic devices and a liquid cooling circuit for circulating coolant, the electronic device includes key components and common components, the liquid cooling circuit includes cooling branches connected to the key components for cooling, the coolant in the cooling branches flows faster than the coolant in the cooling tank, which improves the heat dissipation effect of the key components and the utilization rate of the coolant by cooling the key components and the common components with different flow rates of coolant, reduces the energy consumption of the immersed cooling system and provides a more efficient thermal solution. An immersed cooling cabinet is also provided.

Abstract: A scrollable display apparatus includes a flexible display panel, at least one first detection component and one or more first processors. The flexible display panel includes a fixed display part and at least one scrollable display part. A first detection component is configured to detect location information of a scrollable display part. The one or more first processors are configured to: determine a current state of the scrollable display part according to the position information of the scrollable display part detected by the first detection component; if it is determined that the scrollable display part is in a start-unfolded state, control the fixed display part to display a plurality of extension selection messages; and in response to a control instruction corresponding to a selected extension selection message, control the scrollable display part to display extension display information corresponding to the selected extension selection message.

Abstract: A liquid cooling system for an information handling system includes multiple cold plates, multiple pumps, and a first support bracket. The multiple cold plates includes first, second, third, and fourth cold plates. The multiple pumps include first, second, third, and fourth pumps. The first pump is in physical communication with the first cold plate and the second pump is in physical communication with the second cold plate. The first support bracket is in physical communication with the first and second cold plates and with the first and second pumps. The first support bracket secures the first pump to the first cold plate and secures the second pump to the second cold plate.

Abstract: A slidable display device includes: a display panel; and a support member supporting the display panel. The support member includes a first portion maintaining a form and a second portion adjacent to the first portion and being transformable, the second portion includes a plurality of bars, and each of the plurality of bars includes an edge side including a first side, a second side connected to the first side and being inclined from the first side, a third side including two sides forming a step, a fourth side connecting between the two sides of the third side, a fifth side including two sides facing the third side and forming a step, and a sixth side connecting between the two sides of the fifth side.

Abstract: An electronic device includes: a display panel having an active region and a peripheral region adjacent to the active region; an electronic module disposed below the display panel; a first light-blocking element disposed on the display panel and overlapping the peripheral region; and a second light-blocking element disposed on the electronic module with the display panel interposed therebetween. A hole is at least partially surrounded by the active region is defined in a portion of the display panel. The second light blocking element is disposed in an area adjacent to the hole, when viewed in a plan view. The first light-blocking element has a first thickness and the second light-blocking element has a second thickness less than the first thickness.

Abstract: A thermal management apparatus, including: a blower, including: an impeller configured to direct airflow towards an egress; a base; and a cover, wherein the cover is coupled to the base to encase the impeller; a fin-stack configured to receive the airflow and transfer heat from the airflow, including: a plate having a perimeter; internal fins coupled to the plate and contained within the perimeter of the plate; and external fins extending external to the perimeter of the plate, wherein the fin-stack is coupled to the blower such that the external fins are positioned between the base and the cover, the external fins configured to distribute the airflow across the egress and the internal fins of the fin-stack.

Abstract: An electronic device has a hinge structure including a first fixed structure on which a first arc-shaped guide rail is formed, a second fixed structure on which a second arc-shaped guide rail is formed, a first rotating structure including a first coupling portion rotatably coupled to the first guide rail, a second rotating structure including a second coupling portion rotatably coupled to the second guide rail, and a torque structure which provides torque to the first rotating structure and the second rotating structure. The torque structure includes a cam structure formed on the first rotating structure and the second rotating structure, a cam member including a moving cam engaged with the cam structure, and an elastic member which is compressed or tensioned in response to linear movement of the cam member.

Abstract: A hinge and a mobile terminal to resolve poor use effect of a foldable electronic device. The hinge includes a main body, and a first folding assembly and a second folding assembly that are symmetrically disposed along the main body. When the first folding assembly and the second folding assembly are rotated toward each other, a length of the hinge can be extended, and an accommodation space for accommodating the flexible display can be formed. When the first folding assembly and the second folding assembly are rotated away from each other, the length of the hinge can be reduced, and a support surface for supporting the flexible display can be formed, so that the flexible display cannot be stretched, compressed, or the like during folding and unfolding, thereby improving the use effect and safety of the mobile terminal.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber that includes ionized fluid and an adjustable polarization layer coupled to the vapor chamber. The adjustable polarization layer can be used to direct a flow of the ionized fluid in the vapor chamber towards one or more heat sources. In some examples, the ionized fluid is ionized water and the adjustable polarization layer is polyester (PET) film that includes a plurality of electrode stripes.

Abstract: A server device includes a casing, a flow equalizing plate and a server. The casing has an accommodating space, a liquid inlet and a liquid outlet. The accommodating space accommodates a cooling liquid. The accommodating space is in fluid communication with the liquid inlet and the liquid outlet. The flow equalizing plate is detachably located in the accommodating space. The flow equalizing plate divides the accommodating space into an upper subspace and a lower subspace. The flow equalizing plate has through holes. The through holes are in fluid communication with the upper subspace and the lower subspace. The liquid inlet is in fluid communication with the lower subspace. The liquid outlet is in fluid communication with the upper subspace. The server is located in the upper subspace. The liquid inlet and the liquid outlet are in fluid communication with the server. Sizes of the through holes are different.