Abstract: Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.

Abstract: A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. Two insulating layers are formed on the two metal layers. Two including upper and bottom conductive layers are formed on the two insulating layers. Then, the two insulating layers and the two conductive layers are laminated so that the two metal layers bonded to each other are embedded between the two insulating layers. A part of the two insulating layers and a part of the two conductive layers are removed to form a plurality of blind holes exposing the two metal layers. A conductive material is formed in the blind holes and on the remained two conductive layers. The sealed area of the two metal layers is separated to form two separated circuit substrates.

Abstract: Methods and apparatuses for transferring heat from stacked microfeature devices are disclosed herein. In one embodiment, a microfeature device assembly comprises a support member having terminals and a first microelectronic die having first external contacts carried by the support member. The first external contacts are operatively coupled to the terminals on the support member. The assembly also includes a second microelectronic die having integrated circuitry and second external contacts electrically coupled to the first external contacts. The first die is between the support member and the second die. The assembly can further include a heat transfer unit between the first die and the second die. The heat transfer unit includes a first heat transfer portion, a second heat transfer portion, and a gap between the first and second heat transfer portions such that the first external contacts and the second external contacts are aligned with the gap.

Abstract: A method of forming an interconnect substrate includes providing at least two unit cells, arranging the unit cells to form a desired circuit pattern, and joining the unit cells to form the interconnect substrate having the desired circuit pattern.

Abstract: Disclosed are a wire and a method for manufacturing the same. The method includes heating a solvent, adding a capping agent to the solvent, and forming a metallic wire by adding a metallic compound to the solvent. The solvent includes a first solvent having a first reduction power and a second solvent having a second reduction power greater than the first reduction power. The capping agent includes a first capping agent containing a polymer having a first molecular weight, and a second capping agent containing a polymer having a second molecular weight greater than the first molecular weight.

Abstract: A connector configured to make a contact with an electrical apparatus includes a contact formed of a metal material; and a housing that houses the contact. The contact includes an exposed part that is exposed outside the housing, a contact portion provided in the exposed part and configured to come into contact with an electrode of the electrical apparatus, and a projecting part provided in the exposed part and positioned between the contact portion and the housing. The housing includes an exterior wall that forms a surface of the housing that faces the electrode. The exterior wall and the projecting part are configured to be in contact with each other when the electrode and the contact portion come into contact with each other to establish an electrical connection between the contact and the electrode.

Abstract: Disclosed herein is a dispensing head that includes a motor, an air pump operably connected to and powered by the motor, and a first spindle connected to the air pump. The air pump is configured to create airflow in the first spindle. Further disclosed is a method of creating airflow in a dispensing head, and an assembly machine system having a dispensing head.

Abstract: A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.

Abstract: A computer system receives an initial multilayered ceramic package design. The computer system maintains a first selection of mesh line segments of the mesh line segments at a first width and adjusts a second selection of mesh line segments of the plurality of mesh line segments to a second width. The computer system controls fabrication of the multilayered ceramic package based on the modified multilayered ceramic package design.

Abstract: A method and system for manufacturing a superconducting material is described. In one embodiment, a layer of refractory cushion is placed over a spool. A first layer of superconducting cable is wound over the first layer of refractory cloth. The superconducting cable is reaction heat-treated on the spool. A first layer of refractory fabric can be placed over the layer of refractory cushion. One or more adjustment mechanisms can be disposed between the first layer of the superconducting cable and the spool.

Abstract: A connector assembly including a connector body with a spring clip including a first free end for engaging a side wall of an electrical box upon installation. During insertion of the connector body the first free end engages the knock-out hole perimeter and deforms so as to permit further insertion. Once the connector body is fully inserted, the spring clip cooperates with a lug on the connector body to hold the connector assembly onto the electrical box. Clamp mechanisms are provided to securing the connector assembly to a cable end.

Abstract: The invention relates to a method for positioning a light-shaping member, for example a reflector (1), relative to at least one light source (2), comprising the following steps: a) fitting the at least one light source (2) on a carrier plate (3); b) measuring the position of the at least one light source (2) on the carrier plate (3); c) fitting one or preferably more reference positions (4) on the carrier plate (3), wherein the position of the at least one reference position (4) is dependent on the position of the at least one light source (2); d) referencing, i.e. aligning, the light-shaping member to/with the reference position(s) (4) on the carrier plate (3); and e) securing the light-shaping member on the carrier plate (3) or in relation to the carrier plate (3).

Abstract: An electrical cable having a plurality of conductors including a grounding conductor and at least one power-carrying conductor. The plurality of conductors disposed approximately in parallel within an outer jacket such that the electrical cable has a substantially elongated horizontal cross-section.

Abstract: A method for fabricating and installing an artificial impedance surface antenna (AISA) includes locating a substantially flat surface having a line of sight to a satellite or satellites of interest, determining an angle ?o between a normal to the substantially flat surface and a direction to the satellite or satellites of interest, selecting an antenna superstrate from a pre-fabbed stock of antenna superstrates, the selected antenna superstrate configured for having a peak radiation within two (2) degrees of the angle ?o, laminating the selected antenna superstrate to an antenna substrate to form the AISA, and mounting the AISA on the substantially flat surface.

Abstract: An assembly machine includes a plurality of track modules, each track module including a section of track, the plurality of track modules connectable to form a continuous circuitous track, the continuous circuitous track configured to receive a dispensing head, the dispensing head configured to rotate about the continuous circuitous track and at least partially assemble an unfinished product. The machine includes a first feeder module attached to a first length of the continuous circuitous track configured to feed a component to the dispensing head, and a first placement module attached to a second length of the continuous circuitous track configured to receive the unfinished product. The dispensing head is configured to place the component on the unfinished product. The assembly machine is reconfigurable by attaching or removing one or more of the plurality of track modules, the first feeder module and the first placement module.

Abstract: In accordance with one embodiment, an ignition coil assembly includes an ignition coil cover, a boot, and an ignition coil. The ignition coil cover includes a plurality of fins, an opening, and a channel. The boot includes a slotted opening and a centralized orifice and is configured to be disposed within the opening of the ignition coil cover. The ignition coil includes a seat and a tab. The ignition coil is configured to be disposed within the centralized orifice. The seat is capable of supporting the ignition coil within the centralized orifice of the boot. The tab is configured to be inserted into the slotted opening and the channel when the ignition coil is disposed within the centralized office and the boot is disposed within the opening.

Abstract: A blanking die apparatus includes a lower die in which a plurality of working stations are arranged, and an upper the which moves upward and downward with respect to the lower die. A progressively fed sheet is sequentially blanked or stamped out respectively in the working stations to form iron core pieces, and then to laminate the iron core pieces to form a laminated iron core. The lower die includes a lifter part which lifts the sheet from the lower die when the sheet is progressively fed. The lifter part first lifters installed in an outer peripheral area in each of the working stations, and second lifters installed on an upper surface of a blank die which has a blanking hole formed for blanking the iron core pieces in an external form, or on an upper surface of a blank die holder.

Abstract: An adjustable fixture used in the fabrication of cable assemblies including a base, an adjustable frame, and a cable support arrangement attached to the frame. The cable support arrangement configured to house a cable position template, and a plurality of cable fasteners for attaching a plurality of cables into positions indicated by the cable position template.

Abstract: A method for fabricating a radiating element containment and ground plane structure. The method includes positioning post components, wherein each of the post components has at least one channel. The method further includes positioning a ground plane component including insertion slots and post attachment points. The method also includes attaching the post components to the ground plane component such that each post component is electrically grounded to the ground plane component.

Abstract: A method for manufacturing a combined wiring board includes preparing multiple wiring boards, preparing a metal frame having opening portions which accommodate the boards, respectively, positioning the boards in the opening portions of the frame, respectively, and forming multiple crimped portions in the frame by plastic deformation such that the sidewalls of the boards bond to sidewalls of the opening portions in the frame. The preparing of the boards includes forming the sidewalls of the boards such that when the boards are positioned in the opening portions of the frame, the sidewalls of the boards form wide-space portions and narrow-space portions with respect to the sidewalls of the opening portions in the frame, and the forming of the crimped portions includes generating the deformation such that the sidewalls of the opening portions in the frame abut the narrow-space portions of the boards before the wide-space portions of the boards.