Abstract: An electrical isolation device including a support with thickness E including two faces facing one another, referred to, respectively, as the two faces having a length L, a width l; on each face of the support, a plurality of voltage dividers is positioned extending over the length, each voltage divider including electrical components that are connected in series and arranged according to a first and a second stage, each first stage including a row of even components and a row of odd components, the rows being parallel, and adjacent, and the second stage corresponding to a linear arrangement of components.

Abstract: A method of manufacturing a divided laminated iron core, wherein the iron core laminae includes first iron core laminae and second iron core laminae, includes: a first connecting-portion punching step of punching each of connecting portions between divided iron core pieces constituting each first iron core lamina in a sheet steel strip; a second connecting-portion punching step of punching each of connecting portions between divided iron core pieces constituting each second iron core lamina; and a stacking step of stacking at least one of the first iron core laminae and at least one of the second iron core laminae and joining together the stacked iron core laminae, wherein the connecting portions between the divided iron core pieces of each first iron core lamina are configured to be separated more easily than the connecting portions between the divided iron core pieces of each second iron core lamina.

Abstract: A component mounting machine provided with multiple component transfer devices each have a mounting nozzle, a movable section and an XY driving mechanism and perform a component mounting operation, and a control device that controls component mounting operation and performs thermal correction processing that reduces influence of thermal deformation accompanying temperature change of at least one of the movable section and the XY driving mechanism, in which the control device has an implementation period determination section that individually determines an implementation period of the thermal correction processing for each of the component transfer devices based on operation circumstances of each component transfer device, and a thermal correction implementation section that simultaneously performs thermal correction processing for the multiple component transfer devices when it is determined that the implementation period of the thermal correction processing is reached for either of the component transfer de

Abstract: An apparatus, system, and method for automatically dispensing and embedding components into three-dimensional parts. In an example embodiment, a direct wire embedding head can be fixed on an automation motion system. The direct wire embedding head begins and terminates an embedded wire pattern on a layer or on a surface of a three-dimensional part in order to automatically create the embedded wire pattern. A sensor is located on an embedding surface wherein the embedded wire pattern is embedded. The sensor can measure the distance between the direct wire embedding head and the embedding surface. A predefined distance can be maintained to ensure successful embedding results for the embedded wire pattern by automatically adjusting a position of the direct wire embedding head in response to feedback from the sensor.

Abstract: A method for assembling a sensor assembly is provided. The method includes positioning one or more conduits within a case, and coupling one or more sensor components to the one or more conduits, with the sensor components including one or more of a driver, a first pick-off sensor, and a second pick-off sensor. A flexible circuit is positioned within the case, one or more sensor component flexures are coupled to extend from a body of the flexible circuit to a sensor component of the one or more sensor components.

Abstract: The present invention enables the manufacture of a small-sized high-density multi-layer printed circuit board. The manufacturing method for a multi-layer printed circuit board, according to the present invention, comprises: a step in which an electrical insulation layer is formed by heating a laminate comprising a substrate, a heat-curable resin composition layer provided on the substrate, and a release substrate provided on the heat-curable resin composition layer, thereby curing the heat-curable resin composition layer, and a step in which a via hole is formed in the electrical insulation layer by irradiating a laser from above the release substrate. In addition, in the present invention, the release substrate has a thickness of at least 80 ?m and is formed using a material having a glass transition temperature, the heat-curable resin composition layer has a volatile component-content of 7.

Abstract: There is described a method and apparatus for forming a core for an electrical machine, in which a stamped metal strip (4a, 4b) is wound onto a mandrel (22), to form a helical winding. The diameter of the mandrel is then increased to apply tension to the wound strip, while the coils of the wound strip are held between clamps (24, 25). The coils of the wound strip are then fixed relative one to another (50, 51), while the coil is held at the increased diameter. The diameter of the mandrel is then reduced to disengage the laminated core from the mandrel. To produce a rotor or stator for an electrical machine, electrical coils are mounted in slots formed in the inner or outer surface of the core. The rotor or stator may then be incorporated into an electrical machine such as a motor or generator.

Abstract: Disclosed aspects relate to connector structures and a card. A first connector structure is to join a first subset of a set of electrical connections. A second connector structure is to join a second subset of the set of electrical connections. The card manages the set of electrical connections and is located between the first and second connector structures to connect with the first and second connector structures.

Abstract: A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.

Abstract: A precise assembly mechanism contains: a control unit controlling a clamp unit, a loading unit, and a visual sensing unit to operate. The clamp unit includes a clamper and moves in a third direction Z, the loading unit includes a slider moving in a first direction X or a second direction Y, the holding tray moves in the first direction X or the second direction Y. The visual sensing unit includes a first sensor for identifying a position of an upper rim of each of at least one through orifice on a holding tray, a second sensor for identifying positions of a lower rim of each through orifice and a tip of each of multiple materials, a third sensor for determining a profile of each material in the second direction Y, and a fourth sensor configured to judge the profile of each material in the first direction X.

Abstract: An apparatus for manufacturing a thermoelectric module is provided. The apparatus includes a thermoelectric element interposed between a lower substrate that includes a lower electrode and an upper substrate that includes an upper electrode. Additionally, the apparatus includes a first block that is configured to support the lower substrate and a second block that is configured to move vertically with respect to the first block and support the upper substrate. A jig is configured to position the thermoelectric element in connection with the upper electrode and the lower electrode.

Abstract: A method for manufacturing an apparatus for measuring flow of a fluid flowing through a measuring tube of metal using the magneto-inductive principle, comprising the method steps as follows: securing first and second collars of metal externally on the measuring tube with an orientation perpendicular to the tube axis of the measuring tube; lining the measuring tube internally with an electrically non-conductive, elastic liner; and altering a measuring section of the measuring tube located at least partially between the first collar and the second collar by means of cold deformation in such a manner that the cross sectional area of the measuring section is reduced compared with the cross sectional area of an inflow section of the measuring tube located upstream from the measuring section and an outflow section of the measuring tube located downstream from the measuring section.

Abstract: A component mounting apparatus for mounting a component on a substrate includes a pair of chuck claws that sandwich and grip the component; and adapters that are detachably mounted on the chuck claws and grip the component in place of the chuck claws. The adapters are mounted on the chuck claws in accordance with the component that is an object to be mounted and the component is gripped by using the adapters.

Abstract: A method of forming a plurality of electronic component packages includes attaching electronic components to a carrier, wherein high aspect ratio spaces exist between the electronic components. A dielectric sheet is laminated around the electronic components thus filling the spaces and forming a package body. The spaces are completely and reliably filled by the dielectric sheet and thus the package body has an absence of voids. Further, an upper surface of the package body is planar, i.e., has an absence of ripples or other non-uniformities. Further, lamination of the dielectric sheet is performed with a low cost lamination system.

Abstract: A stator for a high efficiency motor and a manufacturing method of a stator for a high efficiency motor are disclosed. The method includes: preparing filling powder by coating a surface of soft magnetic powder with an insulating layer; providing a stator core partitioned into a center hole and inner spaces, the stator core including a yoke portion and a plurality of teeth; coiling coils around the plurality of teeth located in the inner spaces, respectively; and filling the inner spaces with a mixture of the filling powder and an adhesive, and curing the mixture of the filling powder and the adhesive.

Abstract: A component mounting related system is provided with a first component mounting related apparatus, a second component mounting related apparatus, an electric power source provided in the first component mounting related apparatus, a first power transmission line provided in the first component mounting related apparatus, a power transmission connector, and a second power transmission line. The electric power source supplies an electric power for actuating the first component mounting related apparatus. The first power transmission line transmits the electric power in the first component mounting related apparatus. The power transmission connector transmits the electric power transmitted by the first power transmission line to the second component mounting related apparatus. The second power transmission line transmit, in the second component mounting related apparatus, the electric power supplied from the first component mounting related apparatus through the power transmission connector.

Abstract: A manufacturing method comprising: a process S1 of forming a plate member which has a substantially annular scrap portion having a center hole through an axial direction and a core plate portion defining a portion of the core pieces arranged continuously with the scrap portion on a radially inner side of the scrap portion; a process S2 of forming a laminated body, which has the core pieces, by laminating the plate member; a process S3 of providing the laminated body and the shaft in a mold; a process S4 of forming a molding body by inserting a molten resin or a nonmagnetic material in the mold and forming the filling portion of which at least a portion is located between the core pieces; and a process S5 of separating the scrap portion and the core plate portion.

Abstract: A system and method of manufacture of an integrated circuit device system includes mounting a first elevated device on a first riser positioned adjacent to a base device. The first elevated device includes a first device overhang that extends over the base device. A second elevated device can be mounted on a second riser adjacent to the first riser to allow the attachment of a second elevated device mounted above the first elevated device to achieve higher component densities.

Abstract: A magnetic assembly includes a winding and a housing disposed about the winding. The housing includes an interior surface contoured to conform to the winding to facilitate heat transfer between the winding and the housing. A method of manufacturing a magnetic assembly includes forming a contoured interior surface on a housing and assembling a winding into the housing such that the interior surface of the housing conforms to the winding to facilitate heat transfer between the winding and the housing.

Abstract: A method for manufacturing a mode converter including a substrate that is a single member and includes a first main surface, a second main surface opposite to the first main surface, and a micro hole which is formed in the first main surface, grounding conductor layers that are formed on the first main surface and the second main surface, a plane circuit that is formed on the first main surface, and a pin that is formed so as to cover an inner surface of the micro hole and is electrically connected to the plane circuit, the method includes: irradiating the substrate with laser light to form a first modified portion to a desired depth from one main surface of the substrate; removing the first modified portion to form the micro hole; and filling the micro hole with a conductive material to form the pin.