Abstract: There is provided a substrate holder. The substrate holder comprises a contact assembly; a first plate configured to hold a substrate between the contact assembly and the first plate; at least one first pin fixed to the contact assembly, extended toward a first plate side on outside of the substrate, and provided with a locked portion; a locking member placed on a side opposite to the contact assembly relative to the first plate and configured to be displaceable between a locked state and an unlocked state with respect to the locked portion of the first pin; and at least one first biasing member placed between the locking member and the first plate along an outer circumferential part of the substrate such as to separate the locking member and the first plate from each other and compressed between the locking member and the first plate in the locked state to bias the first plate toward the contact assembly.

Abstract: A process is provided comprising submerging a substrate in an electrochemical deposit bath having at least a metal salt and saccharin. In embodiments, the film is further treated with anodization, and in other cases chemical vapor deposition. Films are also provided formed by the disclosed processes. The films are nanoporous on at least a portion of a surface of the films. Also disclosed are electronic devices having the films disclosed, including lithium-ion batteries, storage devices, supercapacitors, electrodes, semiconductors, fuel cells, and/or combinations thereof.

Abstract: An electrodeposition composition comprising: (a) a source of copper ions; (b) an acid; (c) a suppressor; and (d) a leveler, wherein the leveler comprises a quaternized dipyridyl compound prepared by reacting a dipyridyl compound with a difunctional alkylating agent or a quaternized poly(epihalohydrin). The electrodeposition composition can be used in a process for forming a copper feature over a semiconductor substrate in wafer level packaging to electrodeposit a copper bump or pillar on an underbump structure of a semiconductor assembly.

Abstract: A printed wiring board production method that forms a base film and a conductive pattern on the base film by an additive method or a subtractive method, includes a plating process that electroplates the conductive pattern on a surface of the base film, wherein the plating process includes a shield plate arranging process that arranges a shield plate between an anode and a printed wiring board substrate that forms a cathode, and a substrate arranging process that arranges the printed wiring board substrate in a plating tank, and wherein a distance between the shield plate and the printed wiring board substrate is 50 mm or greater and 150 mm or less.

Abstract: According to one embodiment, there is provided a method for manufacturing a semiconductor device. The method includes metal electroplating on a surface of a first electrode formed on a first surface of a semiconductor substrate with a plating solution which contains aggregates of a supercritical fluid and a solution of a plating metal ion and an electrolyte. The first surface includes a recess. The surface is along with a shape of the recess. The recess has a first dimension and a second dimension, and assuming that an aspect ratio of the recess is given as a ratio of the second dimension to the first dimension, a median of a particle size distribution of the aggregates is greater than the first dimension.

Abstract: A processing device based on electrochemistry includes a platform, a power supply and at least one modeling mechanism which is arranged under the platform and movable with respect to the platform. The modeling mechanism includes a photoelectric wheel, a light source and a container in which an ionic liquid is stored. The photoelectric wheel is rotatable and partially immersed in the ionic liquid. The photoelectric wheel includes a transparent conductive layer and a photoconductive layer bound together from inside to outside. The transparent conductive layer is electrically connected to an electrode of the power supply, and the platform is electrically connected to the other electrode of the power supply. The light source is arranged inside the photoelectric wheel and emits a light beam to pass through the transparent conductive layer towards the platform to selectively irradiate the photoconductive layer.

Abstract: An electroplating apparatus includes a plating bath and a substrate in a horizontal direction. The electroplating apparatus further includes a plurality of cathodes on first and second sides of the substrate in a first direction on one surface of the substrate, and an anode above the substrate, the anode being spaced apart from the substrate and configured to be movable in the first direction.

Abstract: A method for plating a work piece includes forming a work piece, where the work piece includes first and second segments that are electrically isolated. The first segment is connected in a first circuit and the second segment is connected in a second circuit. The first circuit may include a first power source and the second circuit may include a second power source. The work piece and the first and second segments may be disposed in a common solution, and current may be applied in the first circuit and the second circuit to create first and second metal surfaces. The first and second metal surfaces may be made from the same base metal. The first and second metal surfaces may be created simultaneously, with the work piece and the first and second segments disposed in a common solution.

Abstract: A cationic electrodeposition paint composition comprising a cationic base-containing resin (A), a blocked polyisocyanate compound (B), and a modified imidazole (C) having a specific structure, wherein the cationic base-containing resin (A) is a cationic base-containing epoxy resin and/or a cationic base-containing acrylic resin.

Abstract: Disclosed are a substrate for a solar cell and a method for manufacturing the same. The method include putting negative and positive electrodes facing away from each other into suspension in which at least two different types of negatively charged cellulose nanofibers are dispersed; applying a voltage across the positive and negative electrodes such that the cellulose fibers are adsorbed onto a surface of the negative electrode; and drying the negative electrode having the cellulose fibers adsorbed thereon.

Abstract: The present invention relates to applying at least one ultra/mega sonic device and its reflection plate for forming standing wave in a metallization apparatus to achieve highly uniform metallic film deposition at a rate far greater than conventional film growth rate in electrolyte. In the present invention, the substrate is dynamically controlled so that the position of the substrate passing through the entire acoustic field with different power intensity in each motion cycle. This method guarantees each location of the substrate to receive the same amount of total sonic energy dose over the interval of the process time, and to accumulatively grow a uniform deposition thickness at a rapid rate.

Abstract: The present invention relates to a process for electroplating an adhesive composition onto at least one conductive element, in which the conductive element is placed in contact with the adhesive composition comprising: a phosphate salt and a resin based on: a compound A1, compound A1 being chosen from a compound A11 comprising at least two functions, one of these functions being a hydroxymethyl function and the other being an aldehyde function or a hydroxymethyl function, or a compound A12 comprising at least one aldehyde function, or a mixture of a compound A11 and of a compound A12; and a phenol A21. A potential difference is applied between the conductive element and the adhesive composition to coat the conductive element with an adhesive layer.

Abstract: A method of manufacturing a metal mask includes providing a growth substrate with a conductive surface. Then, a cover pattern is formed on the conductive surface, which has at least one opening and an insulated surface touching the conductive surface. Next, using the cover pattern as a mask, a first electroforming is performed to form a mold part on the conductive surface. The mold part fills the opening and has a conductive pattern surface touching the conductive surface. The conductive pattern surface is flush with the insulated surface. After the first electroforming, the growth substrate is removed, while the cover pattern and the mold part are reserved. After removing the growth substrate, a second electroforming is performed to the conductive pattern surface of the mold part to form a metal pattern. Afterwards, the mold part and the cover pattern are removed from the metal pattern.

Abstract: Stacked magnetic cores that can achieve high density with a small footprint, as well as methods of fabricating and using the same, are provided. A stacked magnetic core can be fabricated by depositing nanomagnetic films with control in composition and nanostructure via a continuous electroplating process. The magnetic films are interspersed with thin adhesive films (that can be insulating) in an automated roll-to-roll process. That is, the magnetic films and adhesive films are disposed in an alternating fashion. The adhesive films can keep the magnetic films completely electrically isolated from each other, while also adhering adjacent magnetic films to each other.

Abstract: A cobalt electroplating composition may include (a) cobalt ions; and (b) an ammonium compound of formula (NR1R2R3H+)nXn?, wherein R1, R2, R3 are independently H or linear or branched C1 to C6 alkyl, X is one or more n valent inorganic or organic counter ion(s), and n is an integer from 1, 2, or 3.

Abstract: Exemplary substrate locking system, device, apparatus and method for chemical and/or electrolytic surface treatment of a substrate in a process fluid can be provided. For example, it is possible to provide a first element, a second element and a locking unit. The first element and the second element can be configured to hold the substrate between each other. The locking unit can be configured to lock the first element and the second element with each other. The locking unit can comprise a magnet control device and a magnet. The magnet can be arranged at or near the first element and/or the second element. The magnet control device can be configured to control a magnetic force between the first element and the second element.

Abstract: Articles comprising a substrate and a coating are described. In some examples, the coating is disposed on at least one region of the surface and comprises at least one hydrophobic layer. In some instances, the hydrophobic layer comprises a composite comprising a single metallic element or metallic compound and at least one type of surface-modified inorganic particles to provide a metal-based matrix. In certain examples, the at least one type of surface-modified inorganic particles within the metal-based matrix is embedded within the metal-based matrix and is separate from the single metallic element or metallic compound in the metal-based matrix. Processes for producing the coatings and articles are also described.

Abstract: EL The present invention provides a system for electrodepositing a plurality of electrolytes onto a substrate in a single deposition chamber to form an article, in which the system comprises a removable substrate; a deposition chamber containing the substrate in which the chamber has an inlet and an outlet and in which the chamber comprises at least one anode with connection to a source of electrical current; a plurality of electrolyte reservoirs for an electrolyte solution connected to the deposition chamber through the inlet; and a rinse medium reservoir connected to the deposition chamber through the inlet. Also provided is a system comprising a cradle to form an article, methods using the systems of the invention, and composite materials and devices prepared by the methods of the invention.

Abstract: A hydrogel is formed by a reaction which is induced, in an electrolytic solution, by an electrode product electrochemically generated by electrodes installed in the electrolytic solution. An apparatus including an electrolytic tank with a bottom surface on which a two-dimensional array of working electrodes is provided and a counter electrode installed in the electrolytic tank is prepared. An electrolytic solution containing a dissolved substance that causes electrolytic deposition of a hydrogel is housed in the electrolytic tank. By applying a predetermined voltage to one or more selected working electrodes of the two-dimensional array, a hydrogel with a two-dimensional pattern corresponding to the arrangement of the selected working electrodes is formed.

Abstract: The present disclosure relates to a method of electroplating of a silver-graphene composite onto a substrate. The method comprises preparing a plating bath comprising: a dissolved water soluble silver salt, dispersed graphene flakes, and an aqueous electrolyte comprising a silver complexing agent, a cationic surfactant, and a pH adjusting compound. The zeta potential of the graphene-electrolyte interface in the plating bath is adjusted to be positive and within the range of 10-30 mV by means of the cationic surfactant and the pH adjusting compound. The method also comprises applying a negative electric potential on the substrate surface such that electrophoresis of the graphene flakes occurs and said flakes are co-deposited with the silver during electroplating thereof to form a silver-graphene composite coating on the substrate surface.