Abstract: An apparatus is provided for supporting semiconductor wafer in a wafer processing system. The apparatus comprises at least two wafer support assemblies, defining respectively at least two wafer support levels and being mounted between opposing support beams; one or more supporting bases connected to or integral with each of the wafer support assemblies; and a motion unit coupled to the support beams.

Abstract: One embodiment disclosed relates to a chemical-mechanical polishing process. The process includes performing chemical-mechanical polishing on an entire wafer lot without look ahead polishing of a first article wafer. A normalized polish rate is determined, and a process time for a next wafer lot is predicted using the normalized polish rate. Another embodiment of the invention relates to a polishing apparatus for chemical-mechanical planarization of semiconductor wafers.

Abstract: A tube cleaning device having a pair of jaws pivotally mounted on a frame and having opposed abrading surfaces defining an abrasion cavity, a mandrel fixed to the frame and extending axially thru the cavity for slidably receiving a tube end to be cleaned, spring structure forcing the abrading surfaces toward each other and laterally toward the mandrel, and a rotator knob on the frame for rotating the device in either direction around a tube end positioned on the mandrel.

Abstract: A stabilizing collar for a concrete saw blade provides a rigid blade structure for smoother cutting operations, particularly in partially cured concrete. A pair of the present collars are secured to the blade shaft on each side of the blade, clamping the blade securely therebetween. Each collar has a slightly recessed central area and a raised toroidal rim therearound. Clamping the blade and collar assembly tightly on the shaft, compresses the recessed areas and clamps the rim portions of the collars tightly against the blade at some distance outward from the shaft, thereby providing a rigid assembly and essentially eliminating lateral vibration and flexing of the blade. This enables an otherwise conventional concrete saw to be used for cutting “green” concrete, i.e., relatively soft concrete which has only partially cured, without risk of spalling and breaking up of the edges of the cut due to blade vibration thereagainst.

Abstract: The apparatus and method for producing a substrate having a substrate surface by polishing the substrate surface, which includes a metallic wire. A polishing liquid is supplied a clearance between the substrate surface and the surface of a polishing pad. The polishing liquid includes an acid which dissolves the oxidized part of the substrate surface and is substantially free of solid abrasive powder. A relative movement is generated between the substrate surface and the polishing pad surface while the substrate surface is pressed against the polishing pad surface while the polishing liquid is supplied so that the dissolved oxidized part of the substrate surface can be removed from the substrate.

Abstract: This invention relates to apparatus and methods for z-axis control and collision detection and recovery for waterjet and abrasive-jet cutting systems. In one embodiment, an apparatus includes a linear rail, a slide member coupleable to a cutting head and slideably coupled to the linear rail, at least one actuator having a first end coupled to the slide member and a second end fixed with respect to the linear rail, a position sensor, and a controller. The actuator provides an adjustable support force that supports the weight of the cutting head, allowing the cutting head to be controllably positioned at a desired height above the workpiece. The actuator may include a pneumatic cylinder, or alternately, a linear motor.

Abstract: A metal bonded drilling and boring tool which can prevent the separation of abrasive grains during drilling and boring to maintain a stable working performance for a long period of time without the need for tool exchange. The tool includes a rod-shaped body having a substantially semispherical front end portion and numerous abrasive grains bonded to an outer circumferential surface of the rod-shaped body at the front end portion and at a portion having a given length from the front end portion by a bond member formed primarily of copper alloy. The bond member contains a material selected from the group consisting of Ti, Al, and a mixture thereof. The copper alloy is selected from the group consisting of bronze containing 10 to 33 wt % of Sn, brass containing 5 to 20 wt % of Zn, and aluminum bronze containing 5 to 20 wt % of Al.

Abstract: An imageable belt includes a seam that is finished using an abrasive finishing machine. The seam comprises a seam width with adhesive material disposed thereon. The finishing process includes an abrasive finishing media with a finishing surface and a backer bar. The backer bar comprises a backer bar radius. The backer bar surface is positioned against the belt inner surface so that the belt outer surface contacts the finishing surface to define a finishing contact arc with respect to the backer bar radius. A tension, feed rate and pressure are applied to the finishing media. Using the finishing machine, the seam is then finished to remove the adhesive material. The finishing process results in a seam that is imageable. In one embodiment, the backer bar radius is adjusted so that the finishing contact arc covers the seam width.

Abstract: The invention relates to a method for blast cleaning using ilmenite tailings particles between 10 mesh and 250 mesh as impact abrasive material. Ilmenite tailing particles are a waste product obtained in a beneficiation plant of an ilmenite ore (FeTiO3) metallurgical complex. The particles are preferably washed, dried, and screened before being used as impact abrasive material. They are separated in particle-size range to improve their efficiency for blast cleaning.

Abstract: A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.

Abstract: A device for polishing digital storage discs including a polishing plate rotatably driven about a vertical axis, the upper side of which has a polishing cloth, wherein the polishing cloth is interrupted by a ring-shaped recess concentric with the axis of the polishing plate, at least one circular load-applying plate from the planar lower side of which a projection centrally protrudes to appropriately engage the central hole of the storage disk, a roller holder which has at least one idling roller and one driven roller against which the circumference of said load-applying plate gets into engagement when said plate is carried along while lying on said polishing plate, a drive for said driven roller, and mechanism for feeding a polishing medium to said polishing cloth.

Abstract: A dust and chip removal device for sanding hand power tools has a storage container securable to a hand power tool, a transport channel via which dust and chips are directed into the storage container, a retaining element preventing the dust and chips from flowing back out of the storage container, the retaining element having at least one passage, an elastic element which has a holding force closing the at least one passage, the passage being openable automatically against the holding force at starting at a certain delivery pressure, while the elastic element automatically closes the passage below a certain delivery pressure, and a channel having cross-sectional area which tapers toward the passage.

Abstract: A ultra fine particle film forming apparatus is provided which is capable of forming a ultra fine particle film which has ultra fine particles sufficiently bonded together, sufficient density, flat surface and uniform density. A planarized ultra fine particle film forming method for forming a planarized ultra fine particle film from a deposited film of ultra fine particles formed by supplying the ultra fine particles to a substrate, the method comprising one or more of a planarizing step of planarizing a surface of the deposited film of the ultra fine particles supplied to the substrate.

Abstract: There are provided a polishing apparatus and a polishing method capable of performing polishing a work (such as a wafer) with high efficiency and high precision, a novel work holding plate effectively holding a work and an adhering method for a work capable of adhering the work on the work holding plate with high precision. The polishing apparatus comprises: a polishing table(29); and a work holding plate(38), wherein a work held on the work holding plate(38) is polished supplying a polishing agent solution(41) in the apparatus, and in polishing action, an amount of deformation of the polishing table(29) in a direction normal to an upper surface thereof with respect to the upper surface thereof and/or an amount of deformation of the work holding plate(38) in a direction normal to a work holding surface thereof is restricted to 100 &mgr;m or less by forming the polishing table(29) in one-piece, contriving flow paths of cooling water and others.

Abstract: A slurry removal control mechanism for a CMP polisher is provided. After slurry dispense has been terminated, a high pressure fluid spray removes the slurry from the polishing pad, while the plated causes the pad to rotate at a high rpm rate, thus clearing the slurry from contact with the wafer. Additionally, there is provided a slurry dispense bar including high pressure spray nozzles for providing a high pressure spray upon slurry dispense termination.

Abstract: A polishing apparatus for polishing a substrate comprises a turntable having a polishing surface, a substrate holder for holding a substrate and bringing the substrate into contact under pressure with the polishing surface, a dresser including a dresser tool adapted to be brought into contact under a pressure with the polishing surface to dress or condition the polishing surface and a pressure device connected to the dresser for moving the dresser between a raised position where the dresser is spaced away from the polishing surface and a dressing position where the dresser rests on the polishing surface such that the dresser tool is in contact with the polishing surface under a pressure exerted by the weight of the dresser itself, the pressure device including a member for applying an upward force to the dresser to decrease the pressure.

Abstract: Apparatus and method for producing and metering dry ice pellets and particles selectively from the same apparatus with out modification, by appropriate reversal of a production wheel and accompanying selection of dry ice in the form of block or of pellets for a supply to the production wheel.

Abstract: A polish head for Chemical Mechanical Polishing includes a backing film of silicone on a rigid support element, preferably, of amorphous ceramic. The silicone backing film is fabricated by molding, thereby enabling an appropriate cross-sectional shape for specific polishing needs. The head provides a uniform polishing of a semiconductor wafer.

Abstract: A compound miter saw includes a table on which a workpiece is placed, a miter saw unit supporting a saw blade, and a housing pivotally supporting the miter saw unit related to the table in such a manner that the miter saw unit is at least laterally pivotable. Further, the miter saw includes a bevel mechanism for selectively determining the lateral position of the miter saw unit at any of a plurality of pivoted positions, including a vertical position where the saw blade is positioned substantially vertically relative to the table, and leftward and rightward pivoted positions where the blade is inclined laterally leftwardly and laterally rightwardly from the vertical position. The bevel mechanism includes a movable rod and three fixed stop members, the rod being operable to move between a first rod position abutting one of the fixed stop members and a second rod position not abutting the one of the fixed stop members so as to permit the lateral pivotal movement of the miter saw unit.

Abstract: An apparatus for clamping a workpiece in a machine. The apparatus comprises an inner nose portion being rotatable about an axis of rotation and comprising a plurality of mounting surfaces, and, an outer ring portion rotatable about the axis of rotation and comprising at least one clamp operable between an unclamped position and a clamped position. In the unclamped position, the inner nose portion is rotationally positionable about the axis relative to the clamp such that a workpiece positioned against the mounting surfaces may be oriented relative to the clamp to a position at which with the clamp being operated to the clamped position, the workpiece is clamped against the mounting surfaces. The clamping results in a coupling of the inner nose portion and the outer ring portion whereby with a clamped workpiece, the inner nose portion and the outer ring portion are rotatable together and are positionable about the axis.