Abstract: A chemical mechanical polishing (CMP) apparatus is provided. The CMP apparatus includes a first roller situated at a first point and a second roller situated at a second point. The first point is separate from the second point. Also included in the apparatus is a polishing pad strip having a first end secured to the first roller and a second end secured to the second roller. The first roller and the second roller are configured to reciprocate so that the polishing pad strip oscillates at least partially between the first point and the second point.

Abstract: Polishing pads having a surface morphology that results in a high degree of planarization efficiency when planarizing a wafer surface are disclosed. One conditioned polishing pad is non-porous and has a surface height distribution with a surface roughness Ra<3 microns. Another conditioned polishing pad is porous and has a surface height probability distribution with a pad surface height Ratio R?60%, or alternatively has an asymmetric surface height probability distribution characterized by an asymmetry factor A10?0.50. Methods of pad conditioning and planarizing a wafer using the polishing pads are also disclosed.

Abstract: A reusable mount for an abrasive device (14) including a nut (12) and a support unit (10). The nut (12) includes a threaded barrel (20) and a flange (22). The barrel extends through a central opening (15) in the abrasive device and the support unit it threadably attached by hand to the barrel to capture the abrasive device between the flange and the support unit. The assembled abrasive device and mount are then threadably secured to the spindle (70) of a power tool for use.

Abstract: The invention relates to equipment and related methods for producing concrete retaining wall blocks. The equipment and methods described herein can be used to enhance the effectiveness of splitting assemblies that utilize workpiece engaging members disposed to at least one side of a splitting line and which engage the workpiece as it is split into at least two pieces.

Abstract: A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, the apparatus (100) includes: (i) a platen (106) with a polishing surface (110); (ii) a head (116) adapted to hold the substrate (102) against the polishing surface; (iii) a mechanism to rotate the platen (106) during polishing; (iv) a dispenser (124) having nozzles (126, 128) to dispense slurry on the surface (110); and (v) a distributor (125) between the nozzles (126, 128) and the head (116). In one embodiment, the apparatus (100) further includes a wiper (180) between the head (116) and the distributor (125) to remove used slurry and polishing byproducts from the surface (110), thereby reducing agglomerations or deposits that can damage the substrate (102) and improving yield.

Abstract: An apparatus for processing a lens comprising: a means for supporting a lens that freely displaces towards a tool and comprises a holding shaft supporting the lens so that the lens freely rotates, and a means for detecting an angle that detects a rotation angle of the holding shaft; a means for positioning that moves to contact with and separated from the means for supporting a lens, wherein the means for positioning restricts displacement of the means for supporting the lens towards the tool at a position corresponding to a prescribed lens processing amount determined based on the rotation angle and the data describing a shape of a lens frame; a means for amplifying a relative displacement that amplifies a relative displacement between the means for supporting a lens and a means for positioning; and a means for detection that detects when processing conducted at the rotation angle is complete.

Abstract: A tool sharpener especially designed for sharpening drill bits is provided. The tool sharpener includes a grinding wheel subassembly, a tool holder subassembly, such as a drill chuck, an infeed stage subassembly, a cross feed stage subassembly, and a processor which is capable of controlling each of the subassemblies, and moving the subassemblies relative to the grinding wheel, in preprogrammed routines, to effect the sharpening of a tool such as a drill bit.

Abstract: A sharpener includes a motor driven shaft with at least one slidably mounted sharpening assembly consisting of a supporting hub structure mounted by its central bore hole on the shaft. The hub structure supports a symmetrically shaped rotating surface containing an ultra fine abrasive material. The rotating surface is pressed with a force of less than 0.2 lb. by a spring action to make sustained rotating abrading contact with a facet of a knife positioned by a knife guide to align the facet into contact with the surface containing the abrasive materials.

Abstract: A tool is provided which includes a chuck provided with abrasive elements in the form of pellets fixed thereto. Abrasive filler is arranged between the abrasive elements. The density and abrasive grit of the abrasive filler are in ranges of from 20 to 80% and from 1 to 50% with respect to the density and abrasive grit of the abrasive elements. A composition is provided which consists of epoxy resin, diamond-containing abrasive, a hardener, a filler and polyhydride siloxane. The polyhydride siloxane is used in order to form pores when reacting with the hardener during the production of the tool.

Abstract: A system and method are provided that maintains a high pH at the wafer surface through the entire polish process and then lowers the pH only when necessary in a controlled fashion after CMP and during the post-polish clean. A fluid having a high pH chemistry and, optionally, surfactants is used instead of deionized water to keep the wafer and polisher components wet and to clean the slurry residue from the polishing pad.

Abstract: A method for forming a tool having a smooth surface finish is disclosed. The method involves the step of first rotating a plurality of tools within an inner vessel at high speed relative to the outer vessel with a first abrasive. The first abrasive is then removed and a second abrasive is added to the vessel. The inner vessel is then rotated, again at high speed, with the second abrasive. The resulting tools have reduced surface anomalies.

Abstract: A method for separating a supply of material into distinct sections of material, while controlling the position and orientation of these distinct sections during further manipulation in a continuous process is disclosed. The method includes forming a line of weakness comprising perforations and scores extending substantially from the first edge to the second edge and applying a force substantially parallel to the length of the web sufficient to separate an individual sheet from the web at the line of weakness.

Abstract: The superfinishing apparatus according to the present invention includes a frame 51 for holding the entirety of the apparatus, a cam shaft 52 attached to the frame 51 so as to rotate freely, first and second eccentric cams 53, 54 which are attached to the cam shaft 52 and rotate with a phase difference of 180 degrees therebetween, a first vibrator 55 having a polygonal shape in its section which moves in a sliding manner in accordance with the rotation of the first eccentric cam 53, a second vibrator 57 having a polygonal shape in its section which is disposed so as to oppose to the first vibrator 55 through the cam shaft 52 and moves in a sliding manner in accordance with the rotation of the second eccentric cam 54, air bearings 59, 60 for supporting the first vibrator 55 and the second vibrator 57, and a superfinishing stone 61 attached to the first vibrator 55 or the second vibrator 57.

Abstract: The invention is based on a tool receiver for a grinder, in particular for a handheld angle grinder (10), having a carrier device (12, 14, 16, 182, 184, 300), via which an application tool (18, 32, 186, 188) can be actively connected to a drive shaft (54). It is proposed that the application tool (18, 32, 186, 188) be actively connectable to the carrier device (14, 16, 182, 184) via at least one detent element (24, 26, 190, 192, 194, 196, 198, 200, 302) movable against a spring force that snaps into place in an operating position of the application tool (18, 32, 186, 188) and immobilizes the application tool (18, 32, 186, 188) with positive engagement.

Abstract: The invention provides a bit (10) for use with a rotatable tool, said bit including: a shaft (12) having a rearward end adapted to be held by a chuck of the rotatable tool, and a forward end (18) having cutting tips formed thereon; a reaming head (14) including a body having a bore (16) adapted to receive the shaft therethrough in a sliding fit, the body having a plurality of cutting blades (26) formed on at least one peripheral surface thereof; the bore and/or the shaft having formations thereon such that when the rearing head has the shaft operatively located in the bore the reaming head is rotationally locked into the shaft; the reaming head and the shaft being separable from each other to allow either component to be replaced independently of the other.

Abstract: The present invention relates to a polishing apparatus for restoring an optical disk. The objects of the present invention are as follows: to obtain an equal pressure appropriately required for polishing; to correct the accuracy of parallelism between the rotation planes of an optical disk and a polishing sheet; to remove roundness formed on the outer edge of an optical disk and unevenness in polishing; and to prevent clogging of the surface of a polishing sheet by the active elimination of abrasive filings and an occurrence of scratches on the surface of an optical disk due to the clogging. For the purpose of achieving the above objects, in an apparatus for polishing an optical disk composed of a disk rotator A and a polishing mechanism B, the polishing mechanism B has an elastic mechanism D for elastically holding a polishing pad C, a polishing sheet of the polishing pad C has such an elasticity that the deformation amount ?x is 0.005 mm to 0.

Abstract: The wafer planarization apparatus comprises a processing part which holds a wafer through a protective sheet adhering to the obverse of the wafer and processes the reverse of the wafer, an inspecting device which inspects the wafer having been processed by the processing part, a frame adhering part which adheres a frame through a sheet to the reverse of the wafer having been inspected by the inspecting device, a peeling part which peels the protective sheet from the wafer to which the frame has been adhered, and a transporting device which transports the wafer between the processing part, the inspecting device, the frame adhering part, and the peeling part, so that the series of processing for the wafer can be systematized in line.

Abstract: A masonry cutter comprising a tripod having legs for straddling the masonry to be cut and a cutting assembly mounted between the legs. The cutting assembly comprises a cutting element, preferably a circular saw, and a means for operating the cutting element. The legs may be vertically adjustable. Adjustment of the legs permits changing the angle between a plane parallel to the cutting element and a plane parallel with the masonry to be cut. The tripod may be mounted to a frame by means of a pivot with a vertical pivot axis passing through the pivot. This allows the tripod legs to be positioned and the cutting assembly to be oriented so that the first and second axes are in a desired direction with reference to the masonry to be cut. In one embodiment, the masonry to be cut is a sidewalk slab and the apparatus is used to remove trip hazards from the sidewalk slab. The masonry cutter may be removably mounted to a vehicle.

Abstract: A sand-belt finishing machine includes a main frame, at least one grinding device, a conveyor platform mounted between the grinding device and the main frame, and a lift device mounted between the conveyor platform and the main frame for adjusting the position of the conveyor platform. The lift device includes a propeller shaft, a shaft, a support plate, a driving rod, and a slide rod. Thus, the distance between the grinding devices and the conveyor platform can be adjusted arbitrarily by the lift device, so that the grinding devices can be used to grind workpieces of different thickness.

Abstract: A clamp device is disclosed having a first member having a handle portion and a jaw portion. A second member has a handle portion and a jaw portion. The handle portion and jaw portion of the second member define a notch extending from an inner surface of the handle portion of the second member at least partially into the jaw portion of the second member, the second member being formed as a single piece. A pivot is pivotally coupling the first member and the second member intermediate their respective handle portion and jaw portion for opposed pivotal motion. An arcuate clamp bar has a first end coupled to the first member and a second end, an arc of the arcuate clamp bar being concentric with the pivot. A brake lever has an end pivotally coupled to the second member at the notch. The end contacts the jaw portion of the second member. The brake lever has an aperture with the arcuate clamp bar extending therethrough.