Abstract: An abrasive tool insert is formed from a substrate having an inner face that has a center. The inner face slopes outwardly and downwardly from the center. An annular face slopes downwardly and outwardly from the inner face. An abrasive layer, having a center and a periphery forming a cutting edge, is integrally formed on the substrate.

Abstract: A linear chemical mechanical planarization (CMP) belt pad includes a first portion comprised of a first pad material, e.g., polyurethane, and a second portion comprised of a second pad material, e.g., porous rubber. The first portion has a first end and a second end. The second portion is situated between the first and second ends of the first portion and extends substantially across a width of the belt pad. Alternatively, the second portion may be embedded in the first portion such that a peripheral surface of the second portion is surrounded by a surface of the first portion. A linear CMP system and a method for planarizing a wafer in a single linear CMP module also are described.

Abstract: The heaters in the respective thin-film magnetic head in the bar are electrically connected to its neighbors, and a variable resistor is connected to each of the heaters in parallel. The resistance of each of the variable resistors is varied depending on the amount that the medium-opposing surface (ABS) of the thin-film magnetic head is to project. Also, the medium-opposing surface of the thin-film magnetic head in the magnetic head bar is polished while energizing all the heaters by the same power supply.

Abstract: A super abrasive impregnated singulation saw blade is made by depositing grindable friable super abrasive particles while electro depositing or electroless depositing a strong binder metal such as nickel on a form or mandrel. The deposited super abrasive on the upper side protrudes from the side of the blade and are ground down to or near the binder metal to plannerize the sides of the saw blade and true and balance the saw blade. Post operations include electro polishing to expose equal amounts of super abrasive on the cutting edge or on all sides. Antifriction particles may be added in the side walls or deposited on the outside.

Abstract: A polishing apparatus comprises a polishing table having a polishing surface thereon, a top ring for pressing a workpiece to be polished against the polishing surface, and a dresser for dressing the polishing surface on the polishing table. The dresser comprises a dressing element provided on a surface of the dresser for dressing the polishing surface by sliding contact with the polishing surface, and an ejection nozzle provided on the surface of the dresser for ejecting a fluid supplied from a fluid source toward the polishing surface.

Abstract: Method and apparatus for sharpening a tool, such as a drill bit. A tool sharpener includes a tool holder subassembly which retains and presents the tool against a grinding wheel subassembly. A sensor locates a cutting edge of the tool while the tool is retained by the tool holder. A circuit, preferably comprising a programmable processor, determines a web thickness of the tool from the located cutting edge. The cutting edge is preferably located by detecting at least first and second points at different radii along the cutting edge. A cross-feed subassembly preferably moves the sensor into position, and the tool holder subassembly preferably rotates the tool to facilitate detection of each of the at least first and second points. The tool holder subassembly thereafter presents the tool against the grinding wheel subassembly in response to the determined web thickness of the tool.

Abstract: A method for inspecting the uniformity of the pressure applied between a conditioner and a polishing pad on a chemical mechanical polisher. A sheet of pressure sensitive material is placed between the conditioner and the polishing pad, and the conditioner is lowered onto the sheet of pressure sensitive material. A desired degree of pressure is applied between the conditioner and the polishing pad, thereby creating an impression in the sheet of pressure sensitive material, and the conditioner is lifted from the sheet of pressure sensitive material. The sheet of pressure sensitive material is inspected to determine the uniformity of the pressure applied between the conditioner and the polishing pad.

Abstract: A system with a tool-holding socket, which has a driver device that can be used to operationally connect an insert tool to a drive shaft, and has an insert tool, wherein the insert tool can be operationally connected to the driver device by at least one detent element which is supported so that can move in opposition to a spring element, engages in detent fashion in an operating position of the insert tool, and fixes the insert tool in a positively engaging fashion, wherein at least part of a mechanism for preventing a laterally inverted installation of the insert tool is formed at least onto the tool-holding socket.

Abstract: A method for preparing a wafer in a cleaning module is described. In this method, slurry is dispensed onto a surface of a wafer. Next, a chemical mechanical planarization (CMP) operation is conducted in the cleaning module by contacting a surface of a brush with the surface of the wafer. Subsequently, a cleaning operation is conducted in the cleaning module. A CMP pad and a CMP system also are described.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic substrate to flow off the polishing pad under the force of gravity. Two such polishing pads can be positioned opposite each other in a vertical orientation and can share either a common platen or a common substrate carrier. The polishing pads can be pre-attached to both a supply roll and a take-up roll to form a cartridge which can be easily removed from the apparatus and replaced with another cartridge.

Abstract: A method and apparatus for cleaning a web-based chemical-mechanical planarization (CMP) system. Specifically, a fluid spray bar is coupled to a frame assembly which may be mounted on a CMP system. The fluid spray bar will move along the frame assembly. As the fluid spray bar traverses the length of the frame assembly, a cleaning fluid is sprayed onto the web in order to clean the web between planarization cycles.

Abstract: A grinding wheel including: (a) an annular core body which includes a multiplicity of aggregate particles and a resin bond that holds said aggregate particles together; (b) an abrasive layer which is disposed radially outwardly of said annular core body and which includes a multiplicity of abrasive grains and a vitrified bond that holds said abrasive grains together; and (c) an impermeable coating which is formed of a synthetic resin, and which is disposed on said annular core body.

Abstract: The invention concerns a cylindric drum for a sanding/polishing tool which in its drum surface is provided with a number of undercut axial grooves for mounting one or more axially displaceable sanding elements, where an annular groove has been provided either in the drum surface or a shaft perpendicularly to the rotational axis of the cylindric drum and along the periphery of either the surface of the drum or the surface of the shaft, that a stop means has been arranged for accommodation in the annular groove in an axially fixed position, where at least a part of the stop means abuts on end faces of the moldings of the sanding elements mounted in the axial undercut grooves.

Abstract: An abrasive article for a grinder having a motor-driven, externally-threaded spindle. The abrasive article includes a molded abrasive disk with an integrally molded fastener. The molded abrasive disk includes abrasive particles disbursed in a binder. The molded abrasive disk has a first major surface, a second major surface and an integrally molded fastener. The fastener has a body portion with an aperture and first and second ends, an outwardly extending flange with a front surface at the first end, and an inwardly extending flange including a single internal thread at the second end. The fastener is molded into the molded abrasive disk so that the front surface does not extend above the first major surface.

Abstract: A piezoelectric quartz plate having reduced frequency deviation as a function of temperature, wherein the quartz plate is cut at an angle described by: T f = ? 3.9 + 6.5 ? ? cos 2 ? ? ? + ? 1 2 ? [ c 66 ? T c 66 ? sin 2 ? ? + c 44 ? T c 44 ? cos 2 ? ? + T c 14 ? c 14 ? sin ? ? 2 ? ? ? c 66 ? sin 2 ? ? + c 44 ? cos 2 ? ? + c 14 ? sin ? ? 2 ? ? ? ] + ? [ a ? · ( sin ? ( ? · ? + ? ? ) + sin ? ( ? · ? + ? ? ) 2 ) ] + ? where quartz plate thickness is chosen in accordance with a desired frequency. This useful behavior can be manipulated such that a quartz plate is designed to counteract frequency shifts over temperature excursion of other electrical components found in typical oscillator circuits.

Abstract: A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves, slurry delivery pump and controller for controlling the operation and flow rate of the slurry delivery pump. While a wafer is being polished by a CMP polisher, the controller continuously operates the pump. On the other hand, while the polisher is idling, the controller starts and stops the pump intermittently at regular intervals. No stirrer like a propeller is inserted into the slurry bottle, but the slurry is stirred up by spraying the slurry through the spray nozzle.

Abstract: Disclosed is a surface finishing pad (59) having a dust extraction aperture (60). The pad may have multiple finishing areas (63) or a number of pads may be mounted to a mounting plate (48, 62) that is driven by orbital drive means. The dust extraction apertures align (60) with vacuum ports through which dust may be carried away from a surface undergoing finishing. The mounting plate (48) may have a plurality of channels (46) to direct dust to vacuum ports for extraction. The pad and the machine disclosed, which uses the pads, allows large areas to be finished without dust clogging the pads.

Abstract: A method and polishing system for planarizing a substrate having one or more materials formed thereon. The method generally includes positioning the substrate in proximity with a polishing pad, dispensing a polishing fluid to the polishing pad, the polishing fluid being subjected to carbonation prior to being dispensed to the polishing pad, and polishing the substrate. The polishing system generally includes a polishing platen having a polishing pad disposed thereon and in proximity to the substrate, a controller configured to cause the polishing pad to contact the substrate, and a polishing fluid delivery system to deliver a polishing fluid to the polishing pad, the polishing fluid delivery system including a carbonation system.

Abstract: A method for preventing de-lamination of semiconductor wafer film stacks during a linear belt-type chemical mechanical planarization (CMP) process is provided. The method implements a pulsed polishing head rotation during a CMP process to maintain a slurry distribution across the width of a belt pad. The slurry distribution is maintained in a manner that prevents de-lamination of a wafer film having weak adhesion characteristics. Thus, the pulsed polishing head rotation implemented by the method reduces de-lamination of low-K material film layers during the CMP process.

Abstract: A grinding method comprises steps of simultaneously grinding plural grinding portions of a workpiece by plural grinding wheels T1, T2 moved individually each other, and terminating said grinding by a predetermined grinding wheel T1 prior to a termination of said grinding by the other grinding wheel T2. Whereby, a content of the grinding by each grinding wheel T1, T2 can be same. A grinding condition in each grinding by each grinding wheel T1, T2 can be changed in accordance with a measuring result of the grinding portion in the grinding.