Abstract: An image capturing apparatus includes an image capturing element, a first circuit board to mount the image capturing element on the first circuit board, a second circuit board facing the first circuit board, a fan, and a first flexible board electrically connect the first circuit board and the second circuit board. The image capturing element moves within a movable range in a direction different from an optical axis direction. The first flexible board is bent in an area that overlaps with the movable range of the image capturing element in the optical axis direction. When viewed from a direction orthogonal to an optical axis, an orientation of an exhaust opening of the fan is arranged toward an inner surface of a bending portion of the first flexible board closest to the first circuit board at a center position of the movable range of the image capturing element.

Abstract: An assembly is described. An assembly can include a housing comprising a first compartment and a plurality of vents letting air flow into and out. The assembly can further include a first ECU positioned within the first compartment, the first ECU comprising a first inlet letting air flow into the first ECU. The assembly can further include a second ECU positioned within the first compartment, the second ECU comprising a second inlet letting air flow into the second ECU. The assembly can further include a first plenum positioned between the first ECU and the second ECU and comprising a second compartment. The assembly can further include a first air duct forming a first channel letting air from a first vent of the plurality of vents into the second compartment, wherein the first plenum further comprises a second vent positioned to align with the first inlet of the first ECU.

Abstract: A mechanical assembly includes a power semiconductor device located inside of a mechanical enclosure, and a magnetic component located outside of the mechanical enclosure and operably connected to the power semiconductor device. The power semiconductor device and the magnetic component are cooled via a common air pathway outside of the mechanical enclosure. A power converter includes a powered semiconductor device located inside of a mechanical enclosure, the power semiconductor device configured to convert DC input power to AC output power, and an inductor located outside of the mechanical enclosure and operably connected to the power semiconductor device. The power semiconductor device and the magnetic component are cooled via a common air pathway outside of the mechanical enclosure.

Abstract: A rack system for housing an electronic device comprising: an immersion case configured to provide housing to the electronic device, and to receive an immersion cooling liquid, wherein the immersion case includes a drainage opening, wherein the drainage opening is configured to remove at least a part of the immersion cooling liquid from the immersion case, based on a user actuated action, during a de-racking operation of the immersion case; and a rack frame configured to slidably accommodate racking and de-racking operations of the immersion case.

Abstract: A package assembly includes a substrate, an electronic component and a cover. The electronic component and the cover are disposed on the substrate, wherein the electronic component is located within a chamber between the cover and the substrate. A cooling liquid may be filled in a heat dissipation space of the cover, so as to dissipate the heat generated by the electronic component. Furthermore, the cooling liquid may be filled in the chamber where the electronic component is located, so as to directly dissipate the heat generated by the electronic component.

Abstract: Particular embodiments described herein provide for a flexible vapor chamber with shape memory material for an electronic device. In an example, the electronic device can include a flexible vapor chamber and shape memory material coupled to the shape memory material. When the shape memory material is activated, the shape memory material moves a portion of the flexible vapor chamber to a position that helps with heat dissipation of heat collected by the flexible vapor chamber.

Abstract: A cooling device for cooling a heat generating component, wherein the cooling device comprises a heat sink and at least one heat pipe that is in thermal contact with the heat sink, wherein the at least one heat pipe comprises a thermal contact area that is configured for thermal contact with a heat generating component, and the at least one heat pipe is configured in a shape that provides mechanical spring properties. Such a heat generating component may comprise a pluggable module. Also disclosed is a receptacle assembly comprising a frame having an interior cavity configured for accommodating a heat generating component and having an opening for receiving the heat generating component, characterized in that it comprises a cooling device. Disclosed is also a system comprising a receptacle assembly, and a printed board assembly (PBA) comprising a receptacle assembly.

Abstract: A cooling apparatus of a power module includes a guide provided inside a manifold cover to control a flow of a cooling fluid, wherein the cooling fluid circulated inside the manifold cover forms a vertical turbulent flow by the guide so that cooling efficiency of the power module is secured only using an internal structure of the manifold cover. Thus, heat dissipation performance is improved without a separate fin plate or a separate nozzle injection device.

Abstract: A power electronics assembly includes a circuit board assembly including a first electrically insulating layer, an electrically insulating substrate, a laminate panel provided between the first electrically insulating layer and the electrically insulating substrate, and one or more electrically conductive layers provided within the electrically insulating substrate. The laminate panel includes a power electronics device assembly including an S-cell and a power electronics device. The S-cell includes a graphite layer and a metal layer encasing the graphite layer. A recess is formed in an outer surface of the metal layer and the power electronics device is disposed within the recess of the outer surface of the S-cell.

Abstract: A cage for containing a liquid immersible computer hardware component includes a base portion and two elongate portions extending in a depth direction from the base portion. The elongate portions define a socket adjacent to the base portion in the depth direction and between the elongate portions in a lateral direction. The base portion defines a depth extension below the socket in the depth direction and the elongate portions define lateral extensions on either side of the socket. The cage also includes a power adaptor for conveying power from an intake at an outer edge of the cage to the component when the component is received in the socket.

Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.

Abstract: A data center rack assembly includes a rack, an electronic device, and an adjustable air duct. The rack includes a frame defining opposite first and second rack sides spaced apart in a longitudinal direction. The electronic device presents an intake side configured to receive air therethrough for passage into the electronic device. The electronic device is mounted to the frame such that the intake side is disposed intermediately between the rack sides and is spaced from the first rack side to define a longitudinal dimension therebetween. The duct includes relatively shiftable first and second duct sections that extend in the longitudinal direction to cooperatively present an adjustable longitudinal duct length, and a drive mechanism operably coupled to the first and second sections to control relative shifting of the sections in the longitudinal direction to thereby adjust the longitudinal duct length to correspond with the longitudinal dimension.

Abstract: An electronic system includes an air vent, a heat sink, a fan, and an acoustic filter. The acoustic filter is disposed between the air vent and the heat sink and includes a sound-receiving opening, a sound-emitting opening, an expansion chamber, a neck channel, and a resonant chamber. The neck channel includes a first opening and a second opening whose surface is perpendicular to the surface of the sound-receiving opening. The first opening is in communication with the expansion chamber. The resonant chamber is connected to the second opening. Fan noise that enters the resonant chamber via the neck tube is dampened by reflective acoustic waves generated by the resonant chamber.

Abstract: A networking hardware system includes a housing; a board located in the housing and comprising a plurality of components; a liquid cooled heat exchanger; and one or more fans disposed near the liquid cooled heat exchanger and configured to provide cool airflow from the liquid cooled heat exchanger to any of the plurality of components. The housing can be substantially sealed from an external environment and includes no air intake thereon, removing a need for higher powered fans and for air filtering for dust. The housing can include a faceplate with no air intake thereon, providing increased density for ports on the faceplate.

Abstract: An environmental control unit (ECU) such as a heat pump includes a housing having a divider panel. The divider panel is surrounded by a sidewall and segregates an interior space of the housing into an air-handling portion and a condensing portion. The ECU includes a blower disposed in the air-handling portion, a heat exchanger disposed in the air-handling portion, a compressor disposed in the condensing portion and a fluid circuit including a refrigerant line that connects the heat exchanger to the compressor. In addition, the ECU includes an electronics box that is mounted on the divider panel and houses a control board, the electronics box being provided with two independent modes of cooling. The first mode includes convective cooling via air flow generated by the blower, and the second mode includes conductive cooling via a cooling plate that is cooled by the refrigerant line.

Abstract: A power adapter and a manufacturing method thereof are provided. The power adapter includes a housing, a circuit board assembly, and a first heat dissipation part. There is accommodation space inside the housing, a line interface is disposed at a first end of the housing, and a power connector is disposed at a second end of the housing. The circuit board assembly is disposed in the accommodation space, and the circuit board assembly is electrically connected to the line interface and the power connector. The first heat dissipation part coats the outside of the circuit board assembly, and there is a gap between an outer wall of the first heat dissipation part and an inner wall of the housing.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, one or more heat sources over the substrate, one or more heat pipes thermally coupled to the one or more heat sources, a heat spreader coupled to the one or more heat pipes, where the heat spreader is in-plane with the heat pipe, and one or more loading mechanisms coupled to at least a portion of the one or more heat pipes and to the substrate. The one or more loading mechanisms are in-plane with the spreader and the one or more heat pipes.

Abstract: Various types of electronic devices may be mounted in a chassis in order to facilitate interfacing with the devices, containing the devices, provide cooling systems which may remove heat from the electronic devices, etc. Delivering adequate cooling air flow to each electronic device in a chassis may be an important issue for the proper functioning, lifetime, or other characteristics of electronic devices contained in a chassis. Some electronic devices may be particularly challenging to cool due to various design characteristics. Other electronic devices may have other requirements that are not well served by existing chassis designs. For example, some electronic devices may benefit from additional electrical and/or thermal connections. Embodiments presented herein describe a novel design for a modular card cage accessory that may be configured to modify air flow and/or to meet particular requirements of an electronic device in a chassis, among various possibilities.

Abstract: A method of thermal management of a computing device includes immersing a first electronic component of the computing device in a first working fluid contained in a first volume, immersing a second electronic component of the computing device in a second working fluid contained in a second volume, and changing a pressure in the first volume to alter a boiling temperature of the first working fluid in the first volume.

Abstract: Hardware for cooling server memory arrays. In one embodiment, a server motherboard is provided on which a packaged data processing unit is mounted and electrically connected to metal traces formed thereon. Memory slots are also mounted on the server motherboard and electrically connected to metal traces formed thereon. Memory modules are received in the memory slots, respectively. A plurality of cooling devices are thermally connected to the plurality of memory modules, respectively. The plurality of the cooling devices are assembled in a cooling apparatus, which provides structural and thermal function for the cooling devices.