Patents Examined by Mandeep S Buttar
  • Patent number: 11032939
    Abstract: An enclosure for an electronic system that is configured to act as a heat exchanger to remove heat from a cooling liquid that is circulated through the electronic system for cooling the electronic components thereof which are submerged in the cooling liquid in direct contact therewith. The enclosure uses an arrangement of a combination of external fins on one or more walls and fluid passages formed in one or more of the walls through which the cooling liquid is circulated for cooling. The fluid passages and the external fins are preferably formed on the same wall. The fins and the fluid passages can be formed on any number of walls of the enclosure.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: June 8, 2021
    Assignee: LiquidCool Solutions, Inc.
    Inventors: Rick Tufty, Steve Shafer
  • Patent number: 11026350
    Abstract: A modular computing system for a data center includes one or more data center modules including rack computer systems. An electrical module is coupled to the data center modules and provides electrical power to computer systems in the data center modules. The data center modules do not include any internal active cooling systems and cannot be coupled with any external active cooling systems. A data center module directs ambient air to flow into intake air plenums extending along intake sides of the rows of racks, through the rows of racks into exhaust plenums extending along exhaust sides of the rows of racks, and out into the ambient environment to cool computer systems in the racks. Directed airflow can be lateral, vertical, at least partially driven by air buoyancy gradients, at least partially induced by air moving devices internal to computer systems in the rows of racks, thereof, etc.
    Type: Grant
    Filed: September 15, 2017
    Date of Patent: June 1, 2021
    Assignee: Amazon Technologies, Inc.
    Inventors: Richard Chadwick Towner, Kraig Knight, John William Eichelberg, Peter George Ross
  • Patent number: 11019751
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to enable an active loading mechanism. The electronic device can include a heat source, a heat sink over the heat source, and an active loading mechanism coupled to the heat sink, where the heat sink is thermally decoupled from the heat source when the active loading mechanism is not activated and the heat sink is thermally coupled to the heat source when the active loading mechanism is activated. In an example, the active loading mechanism includes shape memory material and the shape memory material is activated when a temperature of the heat source satisfies a threshold temperature.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: May 25, 2021
    Assignee: Intel Corporation
    Inventors: Iwan Ricardo Grau, Erich Nolan Ewy
  • Patent number: 11013129
    Abstract: An electronic apparatus includes: a first cover having a first face portion that covers a plurality of parts built in the electronic apparatus, and a first peripheral face portion which provides a first portion of an outer peripheral face of the electronic apparatus; a second cover having a second face portion that covers the plurality of parts, and a second peripheral face portion which provides a second portion of the outer peripheral face of the electronic apparatus; a channel defined by a separation between the first cover and the second cover, where the first and second face portions are opposite to one another, a first peripheral edge of the first cover and a second peripheral edge of the second cover oppose one another and do not meet, thereby defining the separation between the first cover and the second cover; and a plurality of air vent holes located through at least one wall surface within the channel.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: May 18, 2021
    Assignee: Sony Interactive Entertainment Inc.
    Inventors: Yukito Inoue, Yasuhiro Ootori, Tetsu Sumii
  • Patent number: 11013154
    Abstract: Circuit films, a printed circuit board (PCB), and the like, are connected to a display panel. First and second heat dissipation members are coupled to a rear surface of the display panel to support and protect the circuit films, the PCB, and the like, while dissipating heat from driver ICs and the like.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: May 18, 2021
    Assignee: LG Display Co., Ltd.
    Inventors: Misook Kim, Daeyoung Jung
  • Patent number: 11013144
    Abstract: A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. Advantageously an absorption/desorption unit is employed having a carbon element and a controller configured to regulate the absorption unit.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: May 18, 2021
    Assignee: TMGCore, LLC
    Inventors: John David Enright, Jacob Mertel, Taylor Monnig, William Hadala
  • Patent number: 10980105
    Abstract: The present invention relates to a carrier (2) with a passive cooling function for a semiconductor component (3), having a main body (6) with a top side (7) and a bottom side (8) and at least one electrical component (13, 13a, 13b) that is embedded in the main body (6), wherein the carrier (2) has a first thermal via (14), which extends from the top side (7) of the main body (6) to the at least one electrical component (13, 13a, 13b), wherein the carrier (2) has a second thermal via (15), which extends from the at least one electrical component (13, 13a, 13b) to the bottom side (8) of the main body (6), and wherein the at least one embedded electrical component (13, 13a, 13b) is electrically contacted by the first and the second thermal via (14, 15).
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: April 13, 2021
    Assignees: TDK Electroncis AG, AT&S Austria Technologie & Systemtechnik AG
    Inventors: Thomas Feichtinger, Oliver Dernovsek, Franz Rinner, Christian Vockenberger
  • Patent number: 10969842
    Abstract: A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using a pressure controlled vessel and pressure controller, the disclosed system may be operated at less than ambient pressure. Utilizing robotic arms and slot-in computing components located within chassis, a self-healing computing system may be created.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: April 6, 2021
    Assignee: TMGCore, LLC
    Inventors: John David Enright, Jacob Mertel
  • Patent number: 10973143
    Abstract: A system and method are provided for coordinating the installation and removal a motor control center subunit with the power connection and interruption thereof. A system of interlocks and indicators causes an operator to install a motor control center subunit into a motor control center, and connect supply and control power thereto, in a particular order. Embodiments of the invention may prevent actuation of line contacts of the bucket, and shield the line contacts, until the bucket is fully installed in the motor control center. Other embodiments also prevent circuit breaker closure until the line contacts are engaged with a bus of the motor control center.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: April 6, 2021
    Assignee: Eaton Intelligent Power Limited
    Inventors: Robert A. Morris, Scott E. McPherren, Daniel J. Leeman
  • Patent number: 10966335
    Abstract: A fin frame baseplate is disclosed. Specific implementations include a baseplate configured to be coupled to a substrate, a fin frame including a base portion coupled to the baseplate, and a plurality of fins extending from the base portion, the plurality of fins protruding from the base portion. The fin frame may include a plurality of openings therethrough.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: March 30, 2021
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Atapol Prajuckamol, Chee Hiong Chew, Yushuang Yao
  • Patent number: 10959349
    Abstract: Systems and methods for managing airflow for cooling computing devices (e.g. in a data center) in normal and cold environments are disclosed. In one embodiment, the method comprises positioning the computing devices on a plurality of racks with air barriers to create hot and cold aisles. The computing devices may be configured in a first mode to draw in cool air the cold aisles and exhaust heated air into the hot aisles. Temperatures in the cold aisles may be periodically measured. In response to temperatures below a predetermined threshold, one or more of the cold aisles may be converted into a temporary hot aisle by adjusting ventilation openings and configuring a subset of the computing devices to temporarily draw in warm air from the temporary hot aisle.
    Type: Grant
    Filed: November 11, 2020
    Date of Patent: March 23, 2021
    Assignee: Core Scientific, Inc.
    Inventor: Harsh Patel
  • Patent number: 10955883
    Abstract: A computing apparatus includes an enclosure to house computing nodes; a slot to receive a power supply unit that is to provide power to the computing nodes; and a cold plate assembly positioned in the slot. The cold plate assembly includes a first thermal exchange surface and a cooling loop. The first thermal exchange surface is inclined relative to a horizontal dimension of the slot and is to make thermal contact with a complementary thermal exchange surface of the power supply unit when the power supply unit is received by the slot, the complementary thermal exchange surface also being inclined relative to a horizontal dimension of the slot. The cooling loop is thermally coupled to the first interface and through which liquid coolant is to flow.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: March 23, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John Franz, Robert Mascia, Harvey Lunsman, Steven Dean, Michael Scott
  • Patent number: 10948956
    Abstract: In the embodiments of the present disclosure, a device having time division multiplexing capability of heat dissipation is provided, including: a first component and a second component arranged in different orientations; and a heat sink arranged to guide an air flow flowing through the heat sink to the first component and the second component respectively during different time periods. Therefore, the device having time division multiplexing capability of heat dissipation of the present disclosure may reduce the number of heat sinks in the device and thus, reduce the overall size of the device.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: March 16, 2021
    Assignee: Dell Products L.P.
    Inventors: Haifang Zhai, Hendry Xiaoping Wu, David Dong, Yujie Zhou
  • Patent number: 10938157
    Abstract: A connector assembly with latching provided by a rotating latch bar. The connector has a low height, with the rotating latch bar providing secure engagement between mated connectors of the connector assembly. The latch bar may be shaped to provide spring force that urges the mated connectors together. The connector assembly may be formed with a cable connector and a board connector. The low height of the board connector enables the connector to be mounted close to high speed electronic components, such as a processor, even if covered by a heat sink, as the connector may fit under the heat sink. The cable connector may be coupled, via a cable, to an I/O connector or other component remote from the high speed electronic component.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: March 2, 2021
    Assignees: Amphenol AssembleTech (Xiamen) Co., Ltd, Amphenol East Asia Ltd.
    Inventors: Wen Chu Yang, Hang Li, Shujian Wang, Hui Tang, Zhenxing Liu, Xiyin Zhou, Lo-Wen Lu, Wen Te Hsu
  • Patent number: 10932394
    Abstract: An electronic housing assembly includes a polymeric housing base and a metallic heat sink secured to the housing base with a snap-fit engagement. A printed circuit board is positioned within a cavity in the housing assembly and is protected within the housing by an environmental seal. The electronic housing assembly allows for expansion and contraction between the heat sink and the housing while maintaining the integrity of the seal.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: February 23, 2021
    Assignee: Parker-Hannifin Corporation
    Inventor: Peter Z. Torok
  • Patent number: 10932396
    Abstract: Provided herein are a heat sink module of an inverter module to power an electric vehicle. The heats sink module can include a heat sink body having a plurality of mounting holes, a fluid inlet and a fluid outlet. The heats sink module can include a cooling channel that can be fluidly coupled with the fluid inlet and the fluid outlet. The heats sink module can include an insulator plate having a first surface and a second surface. The second surface of the insulator plate can couple with a joining surface of the heat sink body to seal the cooling channel. The heats sink module can include a heat sink lid disposed over the insulator plate. The heat sink lid can have a plurality of mounting feet to couple with the mounting holes of the heat sink body to secure the heat sink lid to the heat sink body.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: February 23, 2021
    Assignee: SF Motors, Inc.
    Inventors: Yunan Song, Colin Haag, Zhong Nie, Duanyang Wang, Yifan Tang
  • Patent number: 10921869
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include one or more heat sources, a heat pipe embedded in a chassis of the electronic device, where the heat pipe is thermally coupled to the one or more heat sources to collect heat from the one or more heat sources, and a thermal cooling device, where the thermal cooling device is thermally coupled to the heat pipe and can dissipate heat collected from the heat pipe using air from outside the chassis. In an example, the heat pipe is an oscillating heat pipe and has a thickness between about two (2) millimeters to about twelve (12) millimeters.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: February 16, 2021
    Assignee: Intel Corporation
    Inventors: Mark Carbone, Juha Tapani Paavola, Nicholas R. Weber
  • Patent number: 10925182
    Abstract: A dual heat transfer assembly includes upper and lower heat transfer elements received in a separator channel of a port separator of a receptacle cage. The upper heat transfer element includes an upper thermal interface extending into an upper module channel to interface with an upper pluggable module. The lower heat transfer element includes a lower thermal interface extending into a lower module channel of the receptacle cage to interface with a lower pluggable module. The heat transfer elements include inner ends located in the separator channel. The heat transfer elements include biasing members engaging the heat transfer elements and biasing the heat transfer elements into thermal engagement with the pluggable modules.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: February 16, 2021
    Assignee: TE CONNECTIVITY CORPORATION
    Inventor: Alex Michael Sharf
  • Patent number: 10888019
    Abstract: An electronic device includes a board to which a heat generation component is attached, a heat sink that radiates heat generated by the heat generation component, a cooling target component that is between the board and the heat sink and is attached to the board, and a duct that takes in a part of a cooling air flow for cooling at least the heat sink and introduces the cooling air flow which is taken in to the cooling target component, thereby sufficiently cooling the cooling target component that is between the heat sink increased in size and the board and is positioned on a side to which the cooling air flow being applied to the heat sink flows away from the heat sink.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: January 5, 2021
    Assignee: NEC CORPORATION
    Inventor: Tomoyuki Mitsui
  • Patent number: 10881030
    Abstract: An example electrical and liquid coolant midplane includes an electrical midplane having a ring bus bar assembly, a liquid coolant manifold, and a heat transfer device. The ring bus bar assembly is to receive power from power supply units of the computing system and provide the power to computing components installed in the computing system. The liquid coolant manifold includes four segments connected together as a rectangular ring, the liquid coolant manifold including first liquid connectors facing in a first direction and second liquid connectors facing in a second direction opposite the first direction. The heat transfer device is in contact with the ring bus bar assembly and one of the segments of the liquid coolant manifold, to thermally couple the ring bus bar assembly with the manifold to provide liquid cooling to the ring bus bar assembly.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: December 29, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Harvey J. Lunsman, Steven Dean, Mike Kubisiak, Michael Scott, Robert Mascia