Abstract: A display device according to an embodiment includes: a display panel including a first region and a second region; a chassis disposed on a rear surface of the display panel; a first exciter in contact with the first region and fixed to the chassis; and a second exciter in contact with the second region and fixed to the chassis. The chassis defines an opening disposed between the first exciter and the second exciter.

Abstract: A cooling device for cooling electronic components comprising a primary electronic component, and one or more secondary electronic components of a circuit board is provided. The cooling device comprises a first cooling component. The first cooling component comprises a first cooling member configured to contact a surface of the primary electronic component. The first cooling member is configured to be in fluid communication with a fluid to effect an operative convection cooling of the surface of the primary electronic component. The cooling device further comprises a second cooling component. The second cooling component comprises a second cooling member configured to contact a respective thermal surface of the one or more secondary electronic components to effect an operative conduction cooling of the one or more secondary electronic components. The second cooling member is thermally coupled to the first cooling member.

Abstract: An apparatus including: a base plate; a guide rail being disposed on the base plate; a sliding bar with a first side being disposed on the guide rail, wherein the sliding rail includes a wedge on a second side of the sliding bar opposite the first side; and a heat sink, wherein the base plate and the heat sink form a slot for insertion of a pluggable module at a front of the slot.

Abstract: Methods and systems for managing the operation of data processing systems are disclosed. A data processing system may include a computing device that may provide computer implemented services. To provide the computer implemented services, data processing system may include hardware components. The hardware components may be positioned with an enclosure. A multifunctional handle may be used to facilitate both repositioning of the data processing system and securing of the hardware components with the enclosure.

Abstract: An electronic device includes a first surface component, a heating device, and a first heat transfer assembly, where the first surface component includes a first surface, and the first surface forms an outer surface of the electronic device; the heating device is located on a side of the first surface component facing away from the first surface; and the first heat transfer assembly is located between the heating device and the first surface component, heat is conducted from the heating device to the first surface component through the first heat transfer assembly, a heat insulation structure is arranged in the first heat transfer assembly, and an orthographic projection of the heat insulation structure on the first surface overlaps with an orthographic projection of the heating device on the first surface.

Abstract: A plug-on neutral (PON) device includes a housing that defines a phase cooperation portion configured to physically cooperate with phase buses of a bus assembly. The phase cooperation portion is configured to be electrically isolated from the phase buses and stabilize the PON device when installed on the bus assembly. A neutral cooperation portion is configured to physically cooperate with the neutral bus and to physically stabilize the PON device when installed. An electrical connector disposed at the neutral cooperation portion is configured to electrically connect to the neutral bus at an external end and to electrically connect to a conductive current path at its internal end. A lug assembly has one or more conductive terminal lugs, each terminal lug configured to receive current from an external neutral source via an aperture in the lug end of the housing and to electrically connect to the current path.

Abstract: Quantum processing circuitry cooling systems are provided. The systems can include a first chamber maintained at a first pressure; a second chamber maintained at a second pressure; a cooler within the first chamber; and quantum processing circuitry within the second chamber, the circuitry being thermally coupled to the cooler. Cooling systems are provided that can include: a cooler configured to generate and/or store cryofluid; a device thermally coupled to the cooler; and a plurality of thermal couplings between the cooler and the device, at least one of the thermal couplings being a first conduit system configured to convey cryofluid between the cooler and the device, wherein the first conduit system includes a first heat exchanger within the cooler and is configured to receive the cryofluid from the device, cool the cryofluid using the heat exchanger and provide cooler cryofluid to the device. Methods for cooling quantum processing circuitry are provided.

Abstract: There are provided a printing section that performs printing on a medium; a control section that controls drive of the printing section; a power supply connector that supplies electric power to the control section; a first receptacle connector that is electrically coupled to a first external device; and a second receptacle connector that is electrically coupled to a second external device, a plug of a USB-Type-C cable is configured to be physically inserted into the second receptacle connector, the plug is configured not to be physically inserted into the power supply connector, an insertion port of the first receptacle connector is arranged along a first connector surface, and an insertion port of the second receptacle connector is arranged along a second connector surface.

Abstract: Provided is a power module capable of preventing an overflow situation of solder and a movement of the solder when a chip and a spacer are bonded to each substrate by a soldering process, thereby being capable of increasing bonding quality between components through the soldering process.

Abstract: A heat dissipating device includes a front-placed air duct (1) and a rear-placed air duct (2) that are sequentially arranged in the direction of the heat dissipating gas flow of the heat dissipating device and are communicated. First heat dissipating elements (4) and second heat dissipating elements (5) are located in different front-placed air sub-ducts (3) of the front-placed air duct (1), the heat-dissipation amount of the first heat dissipating elements (4) is greater than that of the second heat dissipating elements (5), and a blocking plate (6) is provided within a front-placed air sub-duct (3) and used for reducing the magnitude of the heat dissipating gas flow of the front-placed air sub-duct (3). A third heat dissipating element (7) is provided inside the rear-placed air duct (2), and a flow guiding hood (8) is provided between the front-placed air duct (1) and the rear-placed air duct (2).

Abstract: A shielding case includes a case body. The case body and the circuit board enclose a shielded region, and at least part of elements on the circuit board are capped inside the shielding case. The elements located inside the case body include a first component, where the first component has a step surface facing the case body. A reinforcing part is provided in a region on the case body corresponding to the step surface of the first component, where at least partial structure of the reinforcing part is located in a region on the case body facing to the step surface.

Abstract: A data center in an environment has modules. Each module has a housing and an air mover. The housing contains processing devices that generate heat during operation. Each module has an air inlet on a first side of the housing and receives air from the environment. Each module also has an air outlet on a second side of the housing to exhaust air from the housing. At least three modules are spaced apart to form lateral spaces between adjacent modules. The modules form an interior region to receive the exhausted air of the modules. Each air mover generates a pressure differential between a top portion of the interior region and a bottom portion of the interior region using the exhausted air. The lateral spaces reduce the pressure differential between the top portion of the interior region and the bottom portion of the interior region.

Abstract: In one embodiment, a power electronics assembly includes a power device assembly further including an S-cell. The S-cell includes a first metal layer having a recess, a graphite layer bonded to the first metal layer, a second metal layer bonded to the graphite layer, and a ceramic layer, wherein the ceramic layer has a first metalized surface and a second metalized surface, and the first metalized surface is bonded to the second metal layer by a solder layer. The power electronics assembly further includes a power device disposed within the recess of the first metal layer, and a cold plate, wherein the second metalized surface of the ceramic layer is bonded to a surface of the cold plate.

Abstract: A vapor chamber and a mobile terminal are provided. The vapor chamber comprises a first cover plate, a second cover plate, a housing including the first cover plate and the second cover plate, wherein the first cover plate and the second cover plate are connected to form a sealed cavity, a cooling medium, a capillary structure disposed in the sealed cavity, and a supporting structure extending from an inner surface of the housing to an internal space of the housing. A material of the first cover plate and the second cover plate is a high-strength composite material, wherein the high-strength composite material comprises a first material layer and a second material layer. The vapor chamber has light weight, small thickness and structural strength.

Abstract: Display assemblies with condensation control are disclosed. A cover is positioned forward of an electronic display layer located within a housing. Fans and sensors are located at an airflow pathway extending within the housing. A controller receives readings from the sensors, determines which of the readings is, relatively, highest, and drives each of said fans based on the relatively highest one of the readings in accordance with a control scheme for each of the fans, where the control scheme is dependent upon the readings.

Abstract: A vehicle-mounted inverter skid wherein the bottom plate of a box body (100) is equipped with a plurality of support beams (105), and the height of the support beams (105) is less than the height of a support frame (104), such that the box body (100) is a sunken structure relative to the support frame (104), and the height dimension of the box body (100) is reduced by it being sunken in the direction of the support frame (104); a wire feed-in assembly of a wire feed-in unit (200) comprises a wire feed-in terminal (202) and a wire feed-in bracket (203); the wire feed-in bracket (203) is shaped like the Chinese character for a door, its top plate is provided with an wire feed-in hole (2031), and the wire feed-in terminal (202) is vertically insertedly disposed in the wire feed-in hole (2031) for fixing; the bottom plate of the box body (100) has a wire feed-in port (204) corresponding to the location of the wire feed-in hole (2031), such that the wire feed-in terminal (202) is arranged vertically, reducing the

Abstract: Power electronics device assemblies, circuit board assemblies, and power electronics assemblies are disclosed. In one embodiment, a power electronics device assembly includes an S-cell including a first metal layer comprising a first surface having a recess, a first graphite layer bonded to the first metal layer, a second metal layer bonded to the first graphite layer, a solder layer disposed on the second metal layer, and an electrically insulating layer bonded to the solder layer. The power electronics device assembly may further include a power electronics device disposed within the recess of the first surface of the first metal layer.

Abstract: A network switch device includes cooling fans to remove heat generated by its electronic circuitry during operation. Multiple cooling zones are provided in a network switch device to enable reduced cooling fan power consumption. The switch device includes a baffle positioned between a first zone and a second zone and across a circuit board. A first cooling fan provides a first airflow through the first zone and across a first portion of the circuit board positioned within the first zone. A second cooling fan provides a second airflow through a second zone of the housing and across a second portion of the circuit board positioned within the second zone. The baffle directs the first airflow away from the second zone and directs the second airflow away from the first zone. Fan speeds of fans in a cooling zone may be adjusted based on temperature sensors positioned in that zone.

Abstract: A power conversion device comprises: a housing having a space formed therein and including a first opening and a second opening; a fan coupled to the second opening and allowing air to flow in a first direction from the first opening toward the second opening; a first electronic component arranged in the space; a heat dissipation member arranged at the rear of the first electronic component with respect to a flow direction of air; a printed circuit board arranged on the heat dissipation member; and a second electronic component arranged under the printed circuit board to be in contact with the upper surface of the heat dissipation member.

Abstract: Disclosed herein is a computing center that includes a computing system disposed in a chamber. The computing system includes a plurality of cooling elements and a plurality of processors, each processor thermally coupled to a cooling element of the plurality of cooling elements. The computing also center includes at least one heat pump disposed in the chamber; at least one gas-liquid exchanger disposed in the chamber. The also computing center includes a hot liquid circuit coupling the plurality of cooling elements to the gas-liquid exchanger, the hot liquid circuit further comprising a hot liquid connection on a wall of the chamber and a cold liquid circuit coupling the heat pump to the gas-liquid exchanger, wherein the heat pump is configured to extract thermal energy from the cold liquid circuit and supply it to the hot liquid circuit.