Abstract: An electronic element includes a substrate, a first input pad on a first surface of the substrate, at least one chip on the first surface of the substrate, and a first output pad on the first surface of the substrate. The first input pad, the at least one chip, and the first output pad are sequentially connected. The first input pad and the first output pad are in direct physical contact with the first surface of the substrate. A surface of the first input pad facing away from the substrate and a surface of the first output pad facing away from the substrate constitute a partial area of an outer surface of the electronic element.

Abstract: A heat dissipation device includes an air-guiding housing and a heat sink assembly. An air guiding channel running through in a first direction is defined by the air-guiding housing, an air outlet of the air guiding channel is configured to provide cooling air to at least one power supply unit. The air-guiding housing comprises a mounting surface located at an end of the air-guiding housing in a second direction, the first direction is perpendicular to the second direction. An electronic equipment having the heat dissipation device is also provided.

Abstract: A cooling system for a plurality of electrical components is described. The cooling system includes a blower to generate an air flow and a platform to mount the plurality of electrical components. The platform defines a plurality of passages. The cooling system further includes an arrangement including a plenum extending between the blower and the platform to direct the air flow towards and around the plurality of electrical components through the plurality of passages.

Abstract: A liquid cooling rack assembly for a computing system includes a first cabinet rack configured to receive within a plurality of computing devices with heat-generating electronic components; and a second cabinet rack configured to receive coolant components. The second cabinet rack has a plurality of movable trays, each tray of the plurality of movable trays being movable generally horizontally and independently of other trays of the plurality of movable trays. The liquid cooling rack assembly further includes a plurality of cooling pumps. Each pump of the plurality of cooling pumps is placed on a respective one of the plurality of movable trays, and each pump is independently serviceable from other pumps of the plurality of cooling pumps based on independent movement of a respective tray.

Abstract: A thermal management system for an automotive inverter includes an active discharge circuit in thermal communication with a DC link capacitor, a thermal interface material positioned between the active discharge circuit and the DC link capacitor such that heat generated from the active discharge circuit is transferred to the DC link capacitor, and a coolant channel for a cooling fluid extending between the DC link capacitor and a base plate of the automotive inverter, wherein the heat generated from the active discharge circuit of the automotive inverter is transferred from the DC link capacitor to dissipate the heat. A method to thermally manage heat dissipated from automotive inverter is also provided.

Abstract: A heat dissipation module comprises: a heating element; a heat dissipation member disposed on one side of the heating element and including a first plate and a second plate; a third plate disposed on one side of the heating element; and a heat transfer path for transferring the heat generated from the heating element to the heat dissipation member. The heat transfer path comprises: a first path disposed between the first plate and the second plate; a third path disposed within the third plate; and a plurality of unit heat transfer paths having a second path connecting the first path and the third path, wherein the respective second paths of the plurality of unit heat transfer paths are spaced apart from each other.

Abstract: A wireless charging device includes a casing, a wireless charging module, an air guide and a fan assembly. The casing has an interior space and an opening communicating with the interior space. The wireless charging module is disposed in the interior space. The wireless charging module has a through hole. The air guide is located in the interior space and penetrates through the through hole and the opening. The air guide and an inner surface of the opening are spaced apart from each other so as to form an inlet slot, the air guide has an inlet, a channel and an outlet, and the inlet communicates with the interior space through the channel, the outlet and the inlet slot. The fan assembly is disposed on the casing and drives air to pass through the inlet, the channel, the outlet and the inlet slot and enter into the interior space.

Abstract: A chassis architecture and a server comprising same. The chassis architecture includes: a PCIE module layer, a threading layer and a computing layer. The threading layer is provided with a plurality of first threading holes, allowing a passage of PCIE cables connected to PCIE modules; the upper surface of the threading layer is configured for bearing the PCIE cables; the computing layer is provided with a plurality of second threading holes, allowing a passage of the PCIE cables. Moreover, an upper surface of the threading layer is configured for bearing the PCIE cables, so that a plurality of PCIE modules may be arranged in one row, and thus each of the plurality of PCIE modules may meet the heat dissipation requirement thereof.

Abstract: An subterranean enclosure for retaining at least one networking component may include a shell forming a first chamber and a second chamber, a dielectric fluid adapted to be disposed in the first chamber, a mounting mechanism at least partially disposed within the first chamber, a coolant distribution line at least partially disposed within the first chamber, a coolant circulator at least partially disposed within the shell, and a heat exchanger operably coupled with the shell. The shell includes a plurality of sidewalls and is disposed in a subterranean environment. The heat exchanger is adapted to dissipate thermal energy from the dielectric fluid exiting the coolant circulator prior to the dielectric fluid entering the coolant distribution line, and extends outwardly from the shell.

Abstract: An air deflection plug-in unit includes a housing and a flow guiding structure. The housing is provided with a first air intake vent and a first air exhaust vent, and there is an included angle between planes on which the first air intake vent and the first air exhaust vent are located. The flow guiding structure is located in the housing. The flow guiding structure is configured to guide an airflow flowing into the first air intake vent to the first air exhaust vent. This disclosure can improve a heat dissipation capability of an electronic component.

Abstract: Apparatus and associated methods relate to a passively cooling computing device (PCCD). For example, a PCCD may include a heat generating electronic components including a processor and a memory. The PCCD may also include a passive cooling structure disposed between the HGECs and a cooling region of the computing device. For example, the passive cooling structure may include an anisotropic surface configured to passively induce air vorticity in response to a thermal gradient. The passive cooling structure may also include a microchannel substructure comprising tubules. For example, when heat energy may be generated from the HGECs, the volume around the HGECs may be in fluid communication with the cooling region by convection generated by a pressure differential and air flow induced by the anisotropic surface texture. Various embodiments may advantageously provide a heat efficient portable computer device.

Abstract: This disclosure relates to an adjustable heat source simulation assembly includes at least one first simulation heater, a second simulation heater and a power output module. The at least one first simulation heater and the second simulation heater are configured to be disposed in a server chassis. The power output module is electrically connected to the at least one first simulation heater and the second simulation heater so as to control heating power of the at least one first simulation heater and the second simulation heater.

Abstract: A system is shown for cooling components of an inverter. In one example, an inverter comprises a first compartment including a direct current (DC) link capacitor that is electrically coupled to a discharge resistor; and a thermal pad in contact with the DC link capacitor; a cooling system configured to circulate coolant through a housing adjacent to the thermal pad; and a noise filtering ferrite element coupled to a DC bus bar. A cooling plate may be further included between the DC link capacitor and the thermal pad and during a during a first condition when the inverter is operating, heat is transferred from the DC link capacitor to the cooling system; and during a second condition when the inverter is not operating, heat is reduced in the DC link capacitor by discharging electricity stored in the DC link capacitor via the discharge resistor.

Abstract: The disclosure relates to an electronic device with active cooling. In order to make a compact design of an electronic device possible and furthermore ensure a high level of ESD/EMC protection and a high level of IP protection, it is proposed according to the disclosure that a housing of the electronic device is connected to a main body of a fan. When the main body and housing are in a connected state, an opening to the interior of the housing is closed off. The main body is furthermore connected to a bushing on which the fan rotor is mounted for rotation. In the connected state, a chamber is furthermore formed which is separated from the interior of the housing and in which the fan rotor is arranged. Here, the chamber forms a housing for the fan rotor.

Abstract: A display device according to an embodiment includes: a display panel including a first region and a second region; a chassis disposed on a rear surface of the display panel; a first exciter in contact with the first region and fixed to the chassis; and a second exciter in contact with the second region and fixed to the chassis. The chassis defines an opening disposed between the first exciter and the second exciter.

Abstract: A cooling device for cooling electronic components comprising a primary electronic component, and one or more secondary electronic components of a circuit board is provided. The cooling device comprises a first cooling component. The first cooling component comprises a first cooling member configured to contact a surface of the primary electronic component. The first cooling member is configured to be in fluid communication with a fluid to effect an operative convection cooling of the surface of the primary electronic component. The cooling device further comprises a second cooling component. The second cooling component comprises a second cooling member configured to contact a respective thermal surface of the one or more secondary electronic components to effect an operative conduction cooling of the one or more secondary electronic components. The second cooling member is thermally coupled to the first cooling member.

Abstract: An apparatus including: a base plate; a guide rail being disposed on the base plate; a sliding bar with a first side being disposed on the guide rail, wherein the sliding rail includes a wedge on a second side of the sliding bar opposite the first side; and a heat sink, wherein the base plate and the heat sink form a slot for insertion of a pluggable module at a front of the slot.

Abstract: Methods and systems for managing the operation of data processing systems are disclosed. A data processing system may include a computing device that may provide computer implemented services. To provide the computer implemented services, data processing system may include hardware components. The hardware components may be positioned with an enclosure. A multifunctional handle may be used to facilitate both repositioning of the data processing system and securing of the hardware components with the enclosure.

Abstract: Provided is a power module capable of preventing an overflow situation of solder and a movement of the solder when a chip and a spacer are bonded to each substrate by a soldering process, thereby being capable of increasing bonding quality between components through the soldering process.

Abstract: A plug-on neutral (PON) device includes a housing that defines a phase cooperation portion configured to physically cooperate with phase buses of a bus assembly. The phase cooperation portion is configured to be electrically isolated from the phase buses and stabilize the PON device when installed on the bus assembly. A neutral cooperation portion is configured to physically cooperate with the neutral bus and to physically stabilize the PON device when installed. An electrical connector disposed at the neutral cooperation portion is configured to electrically connect to the neutral bus at an external end and to electrically connect to a conductive current path at its internal end. A lug assembly has one or more conductive terminal lugs, each terminal lug configured to receive current from an external neutral source via an aperture in the lug end of the housing and to electrically connect to the current path.