Abstract: An inverter and a heat radiation structure thereof are provided. The heat radiation structure of the inverter includes a heat radiator for radiating heat from a heating element of the inverter, and a heat radiation fan for air-cooling the heat radiator. The heat radiator includes multiple heat radiation fins able to be air-cooled. The number of the heat radiator is at least two, and two adjacent heat radiators are a first heat radiator and a second heat radiator respectively. The heat radiation fan is provided between the first heat radiator and the second heat radiator, and the heat radiation fan is located on the tops of the heat radiation fins. In the heat radiation structure of the inverter, the heat radiation fan is capable of cooling the first heat radiator and the second heat radiator at the same time.

Abstract: An outdoor display apparatus comprises a case including an inlet and an outlet, a display module disposed inside the case and including a display panel on which an image seen through at least a portion of the case is displayed, and a heat exchanger. The heat exchanger comprises a first portion located on a first flow path formed to circulate air to the display module, a second portion to receive heat from the first portion, and located on a second flow path on which outside air is heat-exchanged with air, and a phase change material provided to circulate between the first and second portions, and provided to change a phase from a fluid to a gas. The case comprises a partition wall provided to isolate the first flow path and the second flow path from each other, and the first portion and the second portion are disposed obliquely.

Abstract: A power conversion device includes: a housing; and a cover coupled to the housing, the cover includes a plate portion, a heat conduction portion coupled to the plate portion, and a refrigerant pipe, the plate portion includes a first groove in which the refrigerant pipe is disposed, and the depth of one end of the first groove is smaller than that of the other end.

Abstract: A thermal management system for cooling electronics includes an immersion tank, a working fluid in the immersion tank, a heat exchanger, a first fluid conduit, and a second fluid conduit. The heat exchanger is configured to transfer thermal energy from the working fluid to ambient air to cool the working fluid. The first fluid conduit provides fluid communication from the immersion tank to the heat exchanger, and the second fluid conduit provides fluid communication from the heat exchanger to a spray nozzle to spray working fluid into the immersion tank.

Abstract: An electronic component heat dissipation apparatus and methods having a heat dissipation housing. The heat dissipation housing having an external wall and an internal wall defining outer chamber therebetween. The internal wall defines an internal chamber having an airflow inlet opening and an airflow outlet opening. The housing is aligned with at least one electronic component so as to define a thermal chimney through the internal chamber for the flow of heated air. The external wall has at least one external air opening configured to allow external air into the outer chamber. The internal wall has a plurality of heat dissipation nozzles. Each heat dissipation nozzle has an external air inlet opening located within the internal wall and an external air outlet opening located within the internal chamber. The diameter of the external air inlet opening is greater than the diameter of the external air outlet opening.

Abstract: A pressure relief valve for a two-phase immersion cooling system is configured to support fluid flow rates up to 500 cfm, 550 cfm, 600 cfm, or even 2000 cfm. This, in turn, allows the cooling system to support computing systems with a power density greater than 250 kW. This is accomplished by the valve having a relatively large passage (e.g., 2-6 inch diameter), a relatively large spring (e.g., 1.5-1.7 inch diameter), and a guide rod rigidly coupled to the poppet and slidably coupled to a guide plate. The valve may be used as an outlet valve and coupled to an adsorbent chamber to reduce the loss of coolant from the system as air is vented to an ambient environment. The valve may be used as an inlet valve and coupled to an adsorbent chamber to reduce the intake of water vapor as air from the ambient environment flows into the system.

Abstract: A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid cool the computer components. Advantageously, a pH indicator is employed to monitor the acidity of the dielectric fluid via, for example, a color change.

Abstract: A coolant management unit includes a server supply manifold, a server return manifold, a power distribution, and a controller. A server supply manifold is to receive cooling fluid from a cooling fluid source. The server supply manifold is to distribute the cooling fluid to server blades. The server return manifold is to receive vapor from the one or more server blades. The cooling fluid is two-phase cooling fluid to extract heat from one or more servers and to evaporate into the vapor into the server return manifold, and the vapor is transmitted to an external condenser via the rack return manifold to be condensed back to a liquid form. A power distribution bus is configured to distribute power to the one or more servers. A controller is configured to control a fluid pump coupled to the server supply manifold based on one or more signals received from different sensors.

Abstract: Described herein are radio tray assemblies that include space for a specific radio and its power supply and that additionally provide cooling and power conversion and control functionalities. The disclosed radio tray assemblies are designed to have a form factor compatible with legacy radio systems (e.g., MIDS-LVT) while enabling installation of a new radio system (e.g., MIDS-JTRS). The disclosed radio tray assemblies are configured so that the radio and its power supply are secured to a tray so that the radio and power supply are side-by-side and parallel lengthwise. A cooling module or assembly of the disclosed radio tray assemblies is disposed immediately behind the radio and its power supply and is configured to cool these units using forced air cooling directed lengthwise through the radio and its power supply. A power converter and controller module converts input power into the power required by the radio power supply.

Abstract: Embodiments disclosed herein include electronic packages and thermal solutions for such electronic packages. In an embodiment, an electronic package comprises, a package substrate with a first surface, a second surface opposite from the first surface, and a sidewall surface connecting the first surface to the second surface. In an embodiment, the electronic package further comprises a heat spreader, where a first portion of the heat spreader is attached to the first surface of the package substrate and a second portion of the heat spreader is attached to the second surface of the package substrate. In an embodiment, a third portion of the heat spreader adjacent to the sidewall surface of the package substrate connects the first portion of the heat spreader to the second portion of the heat spreader.

Abstract: The disclosure provides a system, for designing and developing immersion cooling in data centers. The system includes an internet technology (IT) tank that houses a computing device immersed in a two phase coolant; an aisle, in which the immersion tank is disposed, that captures a first vaporized portion of the two phase coolant escaped from the immersion tank; a condenser that transforms the first vaporized portion of the two phase coolant that escaped from the immersion tank into a first liquid portion of the two phase coolant; a second condenser captures and condenses a second portion of vapor; and a liquid distributor manages the cooling fluid and coolant fluid for the IT tank and two condensers.

Abstract: The disclosure provides a system, for designing and developing immersion cooling in data centers. The system includes multiple aisles that perform different functions. One of the aisles includes space for housing immersion tanks in which components of the data center may be positioned to be cooled. A second aisle allows the immersion tanks to be placed in the other aisle and for backside access. A third aisle transfers vapor from the aisle housing the immersion tanks to a vapor return unit to condense the vapor. A distribution unit distributes the coolant to cool the components of the data center is designed at the second aisle. The aisles and other units can be modularized to allow for deployment to meet different types of data center requirements.

Abstract: According to one embodiment, a server chassis for immersion cooling includes a chassis frame having a chassis base and an adjustable server panel coupled to the chassis base to receive a server blade to be mounted on the adjustable server panel. The server blade includes a first portion and a second portion. The first portion has a first set of electronic components and the second portion has a second set of electronic components. The adjustable server panel is adjustably mounted along the chassis base, such that when the server chassis is deposited into a container having two-phase coolant therein, the first set of electronic components is at least partially submerged into a liquid region filled with the two-phase coolant, and the second set of electronic components is positioned within a vapor region above an immersion line defining the liquid region and the vapor region.

Abstract: A two-phase fluid management system, may include a sealed container and a mobile condenser that moves within the sealed container. The sealed container may include a plurality of input ports, each to receive a two-phase fluid as vapor from a respective one of a plurality of IT enclosures and a plurality of output ports, each to return the two-phase fluid as liquid to the respective one of the plurality of IT enclosures. The mobile condenser may be coupled to or include an actuator to move the mobile condenser to a respective one of a plurality of positions within the sealed container. An air intake and air outlet of the mobile condenser may form a sealed connection with a pair of condenser ports when the mobile condenser moves to the respective one of the plurality of positions.

Abstract: In an example implementation, a computer assembly includes a computer enclosure, a motherboard with an inset edge section that forms a motherboard air gap between the motherboard and a rear wall of the enclosure when the motherboard is installed in the enclosure, a vent opening formed in the enclosure below the motherboard, and an air mover to draw air from above the motherboard, through the air gap, and below the motherboard, and to expel the air drawn below the motherboard from the enclosure through the vent opening.

Abstract: A semiconductor device (1) includes a semiconductor module (20) and a fan device (30). The semiconductor module (20) includes a module board (21), a first element (22) mounted on the module board (21), and a second element (23a) having a smaller heat generation amount and lower heat resistance. In a flowing direction of an air flow (F) formed by driving the fan device (30), the fan device (30) is disposed downstream of the first element (22) and the second element (23a), and the first element (22) is disposed downstream of the second element (23a).

Abstract: A robot, robotic systems, and methods for conducting a subterranean operation. In some embodiments, a robot may include a hazardous atmosphere controlled volume, such as an explosive (EX)-certified chamber, that is located within the body of the robot. In some embodiments, a robot may include a cooling system that is at least partially disposed to fully disposed within the body of the robot, such as partially to fully disposed within the EX-certified chamber located within the body.

Abstract: A laundry appliance includes a basement housing comprising a capacitor receiver. A capacitor is disposed within the capacitor receiver to define a secured position. The capacitor receiver includes at least one retaining flange that is coupled to the basement housing via a living hinge. At least one retaining flange is outwardly biased away from a body of the capacitor when the capacitor is placed in an inserted position. At least one retaining flange includes a thread-engaging surface that operates to the secured position upon rotation of the capacitor in the inserted position.

Abstract: Embodiments include semiconductor packages. A semiconductor package includes dies on a package substrate, an integrated heat spreader (IHS) with a lid and sidewalls over the dies and package substrate, and a heatsink and a thermal interface material respectively on the IHS. The semiconductor package includes a vapor chamber defined by a surface of the package substrate and surfaces of the lid and sidewalls, and a wick layer in the vapor chamber. The wick layer is on the dies, package substrate, and IHS, where the vapor chamber has a vapor space defined by surfaces of the wick layer and lid of the IHS. The sidewalls are coupled to the package substrate with a sealant that hermetically seals the vapor chamber with the surfaces of the package substrate and the sidewalls and lid. The wick layer has a uniform or non-uniform thickness, and has porous materials including metals, powders, or graphite.

Abstract: A bellows assembly and related methods are described. The bellows assembly can be used in a two-phase immersion cooling system to regulate pressure in a tank's airspace above a coolant liquid. The bellows assembly can include a flexible container and pressure-release valves located to reduce emissions of coolant liquid vapor into an ambient environment.