Patents Examined by Mandeep S Buttar
  • Patent number: 11716832
    Abstract: An enclosure for providing liquid film cooling to heat generating components includes a chassis, a sump, a first pump, a plumbing system, tube plates, and a heat exchanger. The chassis includes cassettes that hold one or more heat generating components. The sump stores a liquid to be supplied to the heat generating components. The first pump draws the liquid from the sump and supplies the liquid to the tube plates through the plumbing system. Each tube plate is positioned between two cassettes to deliver the liquid to the heat generating components. The tube plates directly spray the liquid onto the heat generating components by way of nozzles embedded on the tube plates. The liquid is evaporated into vapors upon contact with the plurality of heat generating components. The heat exchanger condenses the vapors into condensed liquid upon contact. The condensed liquid is collected in the sump to be re-circulated.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: August 1, 2023
    Inventor: Gregory Ong Kong Chye
  • Patent number: 11700714
    Abstract: According to one embodiment, an immersion cooling system may include a container to receive one or more server blades, each having electronics, at least partially submerged within a two-phase coolant contained within the container. The immersion cooling system may also include a cover panel to cover the phase change area. This area may include a liquid region defined to contain the two-phase coolant therein, and a vapor region defined between the cover panel and a surface of the two-phase coolant. The cover panel includes a plurality of slots, covered with rotatable panels. At least one of the slots is configured to allow a server blade to be inserted into the liquid region and at least partially submerged into the two-phase coolant. The slots may be configured to allow a condensing unit to be inserted into the vapor region.
    Type: Grant
    Filed: August 24, 2021
    Date of Patent: July 11, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11696422
    Abstract: A two phase coolant immersion system includes a top section and an immersion section, where the top section and the immersion section are separated by one or more panels. The immersion section includes at least a number of server slots to receive a number of servers, where each of the servers is at least partially submerged within two phase liquid coolant within the immersion section, where, when the servers operate, the servers generate heat that is transferred to the two phase liquid coolant causing some of the two phase liquid coolant to turn into a vapor. The two phase coolant immersion system includes a condensing section interfaced with the immersion section, where the condensing section includes a vapor collection compartment to collect two phase liquid coolant in vapor phase and a liquid collection compartment situated beneath the vapor collection compartment. The one or more panels prevent vapor loss to the environment.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: July 4, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11687132
    Abstract: A crossflow air deflector part for directing airflow includes a front central spine, a first arcuate wall extending from the spine to a first back lateral edge of the airflow deflector, and a second arcuate wall extending from the spine to a second back lateral edge of the airflow deflector opposing the first back lateral edge. Such an airflow deflector can be implemented into a storage server, positioned between a laterally adjacent pair of data storage device (DSD) chambers and a pair of vertically stacked fans, such that the crossflow air deflector functions to direct airflow from one of the lateral DSD chambers into the lower fan and to direct airflow from the other lateral DSD chamber into the upper fan. Independent airflow control for each DSD chamber and each corresponding DSD is thereby provided.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: June 27, 2023
    Assignee: Western Digital Technologies, Inc.
    Inventors: Shailesh R Nayak, Joe Paul Moolanmoozha, Steven Cheng, Erik Silaprasay, Nicholas Maris
  • Patent number: 11690169
    Abstract: A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.
    Type: Grant
    Filed: June 16, 2022
    Date of Patent: June 27, 2023
    Assignee: Bio-Rad Laboratories, Inc.
    Inventors: Amir Sadri, Neven Nikolic, Gabriel Culinco, Thanh-Vi Tran, Nenad Kircanski
  • Patent number: 11683915
    Abstract: Embodiments disclosed include a heat exchange apparatus and method comprising, in an electronic device, a first heat exchanger for exchanging heat with the device wherein the heat exchanger comprises a flow duct for receiving a fluid, and at least a portion of the flow duct is arranged for thermal communication with the device. Preferred embodiments include a pressure reducing unit comprising a pump associated with the flow duct and a Venturi tube configured for reducing the pressure of the fluid in the portion of the flow duct arranged in thermal communication with the device and less than the pressure external to the duct. An embodiment includes a fluid reservoir, and a second heat exchanger for removing heat from the fluid reservoir wherein the second heat exchanger comprises an evaporator in a refrigerant system through which refrigerant is passed in a closed loop via an expansion valve from a gas cooler and back into a compressor.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: June 20, 2023
    Assignee: Nautilus TRUE, LLC
    Inventor: Arnold Castillo Magcale
  • Patent number: 11683912
    Abstract: A cooling device includes: a duct that guides air that has absorbed heat generated inside a cooling target and has been discharged, to the cooling target; a cooler that is provided in the duct and cools the air flowing inside the duct; and an adjusting mechanism that is located on a downstream side of the cooler, adjusts an amount of the air discharged from the duct into a room where the cooling target is installed.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: June 20, 2023
    Assignee: NEC CORPORATION
    Inventors: Kenji Kobayashi, Koichi Todoroki, Nirmal Singh Rajput, Yoshinori Miyamoto, Masaki Chiba, Minoru Yoshikawa
  • Patent number: 11678459
    Abstract: A ventilation and air conditioning system (6) is for a room (2) containing a heat source and the ventilation and air conditioning system (6) comprising a cooled air supply (12) and a ventilation duct (10). The ventilation duct (10) includes a primary inlet (24) connected to the cooled air supply (12) and an outlet (14) leading into the room (2). A number of heat storage elements (30) is arranged inside the ventilation duct (10) between the primary inlet (24) and the outlet (14), such that during operation of the cooled air supply (12) there is a forced stream of cooled air through the ventilation duct (10), thereby cooling and preferably freezing the heat storage elements (30). A secondary inlet (36) into the ventilation duct (10) is in flow communication with the room (2) and during operation of the cooled air supply (12) is closed by a damper (40).
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: June 13, 2023
    Assignee: FRAMATOME GmbH
    Inventors: Christof Da Silva Weber, Laura Klaus
  • Patent number: 11665854
    Abstract: A portable radio device incorporating active thermal mitigation systems, and methods of use thereof. An example radio device incorporating an active thermal mitigation system may comprise a portable radio device selectively connectable or otherwise interoperable with a power adapter or battery device, wherein the power adapter or battery device includes an active thermal mitigation system. The system may include a micro-fan, blower, or other similar device configured to generate airflow, and may be configured to direct a flow of air or other fluid towards the radio device. The system may further include one or more fins or other features for directing and/or enhancing fluid flow, as well as sensors and control features to vary flow depending on temperature of the radio device or other variables. Thus, the system allows for the continuous cooling the radio device via convection without requiring the incorporation of the active thermal mitigation system within the radio device.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: May 30, 2023
    Assignee: THALES DEFENSE & SECURITY, INC.
    Inventors: Mehrdad Badie, Douglas Bell, Steven Kutchi
  • Patent number: 11665864
    Abstract: An immersion cooling system including a rack and at least one immersion cooling module is provided. The immersion cooling module includes a chassis and a condensation pipeline. The chassis is slidably disposed on the rack and is adapted to accommodate a coolant. At least one heat generating component is adapted to be disposed in the chassis to be immersed in the liquid coolant. The condensation pipeline is disposed in the chassis and is located above the liquid coolant. In addition, an electronic apparatus having the immersion cooling system is also provided.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: May 30, 2023
    Assignee: Wiwynn Corporation
    Inventors: Yu-Cheng Chu, Chin-Hao Hsu, Tsung-Han Li, Ting-Yu Pai
  • Patent number: 11662791
    Abstract: According to a first aspect, an industrial personal computer (IRC) (100) is provided. The IPC comprises: •a first housing module (10) having a first electronic component, an internal electric power supply device and a first electric connection portion; and •a second housing module (20?) having a second electronic component and a second electric connection portion, the first and the second housing modules being stacked along a stacking direction (SD), wherein the first and second connection portions form a connection bus along the stacking direction at least for transmitting electric power between the first and second housing modules; wherein •the second electronic component is an uninterruptible power supply (UPS) device (21); and •the IRC further comprising a power management controller (28).
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: May 30, 2023
    Assignee: OMRON Corporation
    Inventors: Frank Exoo, Martijn Elias
  • Patent number: 11659688
    Abstract: An information technology (IT) equipment cooling system includes a coolant unit to be coupled to an electronic rack, the coolant unit to supply a two phase liquid coolant to one or more IT equipment cooling sets mounted within on an electronic rack. Each of the one or more IT equipment cooling sets includes an IT unit having one or more pieces of IT equipment configured to provide IT services and is at least partially submerged within the two phase liquid coolant, where, while the IT equipment provides the IT services, the IT equipment generates heat that is transferred to the two phase liquid coolant thereby causing at least some of the two phase liquid coolant to turn into vapor phase. The IT equipment cooling set includes an IT condensing unit having a condenser positioned above the IT unit and the condenser is to condense the vapor back into liquid state.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: May 23, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11638364
    Abstract: A cryptocurrency mining furnace is provided. The cryptocurrency mining furnace comprises a furnace housing having an air flow path extending from a housing air inlet downstream to a housing air outlet; and at least three separate mining computers. Each mining computer is positioned in the furnace housing in the air flow path upstream of the housing air outlet and includes at least one cryptocurrency mining board. The cryptocurrency mining furnace also comprises a transformer positioned in the furnace housing upstream of the mining computers and downstream of the housing air inlet, the transformer electrically connected to each of the mining computers to power each of the mining computers; and a principal fan positioned in the furnace housing in the air flow path downstream of the transformer and upstream of the mining computers to induce air flow along the air flow path through the transformer and each of the mining computers.
    Type: Grant
    Filed: September 28, 2022
    Date of Patent: April 25, 2023
    Inventor: Joel Landry
  • Patent number: 11627683
    Abstract: Embodiments of an enclosure assembly to enhance cooling of a hydraulic fracturing direct drive unit (DDU) during operation are included. The enclosure assembly may include an enclosure body extending at least partially around an enclosure space to house the DDU for driving a fluid pump. The enclosure assembly may include one or more heat exchanger assemblies connected to the enclosure body for cooling a process fluid associated with one or more of the DDU and the fluid pump, and which may be configured to draw air into the enclosure space from and external environment, toward one or more radiator assemblies to cool the process fluid, and along an airflow path through the enclosure space. One or more outlet fan assemblies may be operative to discharge air from the enclosure space to the external environment to maintain a desired temperature of the enclosure space.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: April 11, 2023
    Assignee: BJ Energy Solutions, LLC
    Inventors: Tony Yeung, Ricardo Rodriguez-Ramon, Guillermo Rodriguez
  • Patent number: 11599164
    Abstract: Apparatuses and methods include at least one push fan assembly and at least one pull fan assembly and at least one constriction channel or pathway designed to compress air pulled in by the push fan so that as the compressed air exits the at least one constriction channel or pathway, the air undergoes an expansion and cools and the push-pull fan arrangement pulls the cooled air through the housing improving the cooling of computer or electronic components housed in the housing.
    Type: Grant
    Filed: January 17, 2022
    Date of Patent: March 7, 2023
    Inventors: Scott A Strozier, Christopher D. Robinson
  • Patent number: 11596080
    Abstract: An apparatus for housing a storage processor includes first and second side portions each extending in a plane defined by a first direction and a second direction, and separated from each other in a third direction; first and second flapper components disposed between the first side portion and the second side portion, extending in a first plane and a second plane, respectively, and rotatable about a first axis and a second axis, respectively, the first flapper component coupled to the first side portion and having a first end face, the second flapper component coupled to the second side portion and having a second end face; and first and second magnetic components disposed in the first end face and the second end face, respectively, and configured to be coupled to each other by a magnetic force so as to couple the first end face to the second end face.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: February 28, 2023
    Assignee: EMC IP Holding Company LLC
    Inventors: Aiqin Liu, Xu Chen
  • Patent number: 11589483
    Abstract: The present invention discloses a three-chambered constant pressure apparatus for liquid immersion cooling of servers. The apparatus comprises a housing within which two partitions are disposed. The two partitions divide the housing into a first chamber, a second chamber and a third chamber. A coolant is maintained within the first chamber, and an isolating liquid is maintained within the second chamber and the third chamber. At least one heat-generating device is submerged within the coolant maintained within the first chamber. During the operation of a server, a coolant is heated to a boiling point temperature generating a coolant vapor that causes the pressure in chambers to rise. By adjusting the air pressure in chambers prior to use, the rising pressure in chambers caused by the coolant vapor can be efficiently relieved.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: February 21, 2023
    Inventors: Fang-Shou Lee, Cho-Han Lee
  • Patent number: 11581711
    Abstract: A tank assembly has heat-generating equipment contained therein. The tank assembly includes a tank having an opening, and a thermal siphon fixed to the tank and sealing the opening of the tank. The thermal siphon has a main body portion and a loop portion. The thermal siphon contains a liquid and a gas. A center of the loop portion is exposed to the environment.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: February 14, 2023
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventor: David G. Woolard
  • Patent number: 11566654
    Abstract: A laundry appliance includes a basement housing comprising a capacitor receiver. A capacitor is disposed within the capacitor receiver to define a secured position. The capacitor receiver includes at least one retaining flange that is coupled to the basement housing via a living hinge. At least one retaining flange is outwardly biased away from a body of the capacitor when the capacitor is placed in an inserted position. At least one retaining flange includes a thread-engaging surface that operates to the secured position upon rotation of the capacitor in the inserted position.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: January 31, 2023
    Assignee: Whirlpool Corporation
    Inventor: Daniel A. Schurr
  • Patent number: 11570935
    Abstract: The present application pertains to testing methods and apparatus useful in single phase or two-phase liquid immersion cooling systems. Single phase systems use a fluid similar to mineral oil in which to immerse the servers. As the fluid is heated by the operating servers the fluid is circulated to one or more heat exchangers for cooling so the fluid never boils. In contrast, two-phase systems cool heat generating computer components which cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using the testing methods and apparatuses herein one may design and test more efficient components and systems. More specifically, the one or more heating elements are both passive and intelligent. They may be used to mimic the power load of a server which is used in the load testing of immersion cooling so actual servers are not required to test various aspects of the liquid immersion cooling units.
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: January 31, 2023
    Assignee: TMGCore, INC.
    Inventors: John David Enright, Jacob Mertel, Taylor Monnig, William Hadala