Abstract: A method for making a multilayer polishing pad includes rotating a cylinder about a central axis. The cylinder encloses in an interior space a single polymer mixture that phase separates under centrifugal force. The method also includes forming the polishing pad from at least some of a polymer formed after the polymer mixture has reacted. The method includes forming at least two distinct layers in the polishing pad by casting and gelling sequentially at least two different polymers.

Abstract: A stripping apparatus and a stripping station capable of reducing cycle time for steps of stripping an insulation coating from a conducting wire material are provided. A stripping apparatus configured to strip an insulation coating WL from a conducting wire material W, including the insulation coating WL and cross-section of which orthogonal to a longitudinal direction has a rectangular shape, the stripping apparatus includes: an upper mold 150 provided with a stripping blade configured to strip the insulation coating WL; a lower mold 110 configured to support the conducting wire material W from a lower side thereof; a pressing member 130 configured to prevent displacement of the conducting wire material W; and a rotation mechanism configured to rotate the conducting wire material W around a rotational axis C1 that is parallel to a axial center of the conducting wire material W.

Abstract: A magnetic field manipulated localized polishing system includes a container holding a volume of a magnetic abrasive fluid. The magnetic abrasive fluid contains abrasive particles. A motor is positioned under the container. A magnet is coupled to the motor such that the motor induces rotation of the magnet. A workpiece is suspended in the container.

Abstract: A polishing apparatus capable of precisely controlling a polishing profile, particularly a polishing profile in an edge portion, of a wafer is disclosed. The polishing apparatus includes: a top ring shaft; a housing fixed to the top ring shaft; a flexible membrane configured to press a wafer against a polishing pad; a top ring body configured to hold the flexible membrane; a retaining ring coupled to the top ring body and disposed so as to surround the flexible membrane; a gimbal mechanism configured to allow the top ring body and the retaining ring to tilt with respect to the housing; and a local load exerting mechanism configured to exert a downward local load on a part of the retaining ring.

Abstract: An abrasive jet cutting system may include a differential pressure measurement apparatus configured to measure a differential pressure between points in an abrasive supply system. The differential pressure may be used to determine one or more conditions of the jet and the abrasive delivery. The measured differential pressure may be used in a feedback control system, feed forward control system, and/or an alarm or safety system.

Abstract: A displaceable carriage (10) and a linear guide for guiding the carriage, which includes a first guide path slideway (13, 31) and a second guide path slideway (32). To form the first slideway (13, 31), the carriage (10) includes at least one pocket (13), which slides along the first guide path part (31) and can hold lubricant under pressure to create a relieving force on the carriage (10). The second guide path part (32) includes an island-shaped surface to create a frictional force on the carriage (10). A pressure medium held in the at least one pocket (13, 14, 15) creates the relieving force, whereby the first slideway (13, 31) relieves the load on the second slideway (11a, 12a, 12b, 32).

Abstract: A grinding wheel for grinding a wafer held on a holding table includes: a first circular annular plate mounted to a mount of a grinding apparatus; a tubular body extending downward from an outer circumference of the first circular annular plate; a second circular annular plate connected to a lower end of the tubular body; a plurality of grindstones arranged in an annular pattern on a lower surface of the second circular annular plate; an annular ultrasonic oscillation section disposed on an upper surface of the second circular annular plate so as to surround an opening; and an ultrasonic reception section that receives an ultrasonic vibration transmitted from the ultrasonic oscillation section to the grindstones.

Abstract: A device for the fine machining of a circumferential workpiece surface arranged eccentrically relative to an axis of a workpiece. The device comprises a pressure mechanism configured to press a fine-machining tool against the circumferential workpiece surface. The device also includes a drive unit configured to drive an active section of the pressure mechanism via a first drive and a second drive. The first drive drives the active section in a movement plane that runs crosswise to the workpiece axis along a first movement trajectory. The second drive drives the active section along a second movement trajectory that is at an angle to the first movement trajectory.

Abstract: A cooling lubricant supply device for supply of a cooling lubricant to a grinding wheel is rotatably mounted as a tool on a grinding spindle of a processing unit in a grinding machine. The device has a feed shoe, which is mounted at least indirectly on a grinding spindle housing and seated on a circumferential surface of the grinding wheel and which has a seating surface facing the grinding wheel. The seating surface has a shape substantially complementary with the circumferential surface of the grinding wheel and is provided centrally with a pocket-like recess into which the cooling lubricant can be fed under pressure. A spring mechanism is provided, by which the feed shoe is biased with the seating surface thereof against the circumferential surface of the grinding wheel.

Abstract: A device for blocking workpieces has an aligning station that includes a workpiece support for aligning a workpiece. A blocking station comprises a block piece mount and serves to block the aligned workpiece by use of a block material on a block piece, which can be mounted in the block piece mount in a centered manner in relation to a substantially vertically extending blocker axis. A workpiece carriage carries a holding head for the workpiece and is suitably guided and driven to transport the workpiece from the aligning station to the blocking station to position the workpiece along the blocker axis in a defined manner relative to the block piece held in the block piece mount, and to hold the workpiece during blocking in the defined relative position to the block piece with a gap between workpiece and body piece.

Abstract: The present invention relates to a substrate processing system and a substrate processing method capable of cleaning a processing-liquid supply line. A substrate processing system includes: a substrate processing apparatus (1) configured to process a substrate W; and a flushing device for cleaning a distribution line (93) and a processing-liquid supply line (92). The flushing device includes: a cleaning-liquid supply line (99) coupled to the distribution line (93); a drain mechanism (101) configured to direct a cleaning liquid, supplied into the processing-liquid supply line (92) through the distribution line (93), to a liquid disposal area (100); a supply switching valve (104) configured to allow only the processing liquid or the cleaning liquid to flow in the distribution line (93); and an operation controller (30) configured to control operations of the drain mechanism (101) and the supply switching valve (104).

Abstract: Provided is a feeler for workpieces being machined, including a rocking arm configured to feel the workpiece, a first sensor configured to measure the position of the rocking arm and at least one additional sensor operatively connected to the rocking arm and configured to detect external perturbations acting on the feeler.

Abstract: A wire saw apparatus including: a wire row formed of a wire wound around a plurality of wire guides and reciprocatively travels in an axial direction; a nozzle from a coolant or slurry is supplied to the wire; and a workpiece feed mechanism presses a held workpiece against the wire row, the wire saw apparatus slice the workpiece into a wafer shape by pressing the workpiece held by the workpiece feed mechanism against the wire row and feeding it for slicing while supplying the coolant or the slurry from the nozzle to the wire, the wire saw apparatus nozzle is arranged above the wire row to be orthogonal to the wire row, and windbreak plates are arranged on both left and right sides of the arranged nozzle seen from an axial direction.

Abstract: A device for fine processing of optically effective surfaces on workpieces has a workpiece spindle which protrudes into a working space and by which a workpiece to be polished can be rotationally driven about a workpiece axis of rotation. Two tool spindles are associated with the workpiece spindle and protrude into the working space oppositely to the workpiece spindle. On each tool spindle, a polishing tool can be rotationally driven about a tool axis of rotation and is retained so that the polishing tool can be axially advanced along the tool axis of rotation. Furthermore, the tool spindles can be moved together in relation to the workpiece spindle along a linear axis extending substantially perpendicularly to the workpiece axis of rotation and can be pivoted about different pivoting adjustment axes, which extend substantially perpendicularly to the workpiece axis of rotation and substantially perpendicularly to the linear axis.

Abstract: Wafer geometry measurement tools and methods for providing improved wafer geometry measurements are disclosed. Wafer front side, backside and flatness measurements are taken into consideration for semiconductor process control. The measurement tools and methods in accordance with embodiments of the present disclosure are suitable for handling any types of wafers, including patterned wafers, without the shortcomings of conventional metrology systems.

Abstract: A connection structure is connected between a wrench head of a torque wrench and a socket, and the connection structure contains: a body, a casing, and two positioning members. The body includes a coupling section, a driving section, an extension defined between the coupling section and the driving section, and two bolts oppositely inserted into the body from an outer wall of the coupling section. The casing includes a first part, a second part, and two accommodation grooves respectively defined on two inner walls of the first part and the second part and located adjacent to the coupling section. Each of the two positioning members is housed in each of the two accommodation grooves, wherein each positioning member includes multiple toothed projections arranged on an inner wall thereof and abutting against each of the two bolts.

Abstract: The invention relates to a polishing disc for a tool for fine processing optically active surfaces on spectacle lenses, having a main body which has a central axis and to which an intermediate layer that is softer than the main body and is made of a resilient material is secured, a polishing medium carrier resting on the intermediate layer. The intermediate layer has at least two regions with different degrees of hardness, said regions being arranged one behind the other in the direction of the central axis of the main body. The intermediate layer region adjoining the main part is softer than the intermediate layer region on which the polishing medium carrier rests.

Abstract: A grinder includes a motor, a housing, a spindle and a cover. The spindle protrudes downward from the housing, is driven by the motor, and thereby rotates. The cover at least partially covers a tool accessory mounted on the spindle. The cover includes a first cover part and a second cover part. The first cover part is fixed to the housing and at least partially covers the tool accessory from above. The second cover part is held such that it is capable of moving relative to the first cover part. The grinder is configured such that the area of the tool accessory covered by the cover changes in accordance with the relative movement.

Abstract: A folding knife with a combination bottle opener and actuation extension preferably includes a bottle opening member and a fastener. The bottle opening member includes a base member a first extended leg and a second extended leg. The first extended leg extends from one side of the base member at a top of the base member. The second extended leg extends from the one side of the base member at a bottom of the base member. The second extended leg extends outward and upward from the base member. A retention hole is formed through the base member for retention on a knife blade of a folding knife. A set screw may also be retained in the base member. A knife slot is formed in the base member and a portion of the second extended leg to receive a width of a back edge of the knife blade.

Abstract: Embodiments described herein generally relate to a grinding disc is being rotatably drivable around an axis of rotation. The grinding disc has a front side as well as a rear side facing away from the front side. The grinding disc further includes a multi-layered circular grinding blank packet with a plurality of circular grinding blanks. The grinding blanks are flatly stacked over each other along the axis of rotation and in which each grinding blank includes a central through opening. The central through openings form together a recess of the circular grinding blank packet. Wherein the grinding disc has a backing plate, which is arranged in the recess, and the circular grinding blanks each are fixed individually to the backing plate.