Abstract: A silicone composition that contains an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, a filler containing an aluminum powder and a zinc oxide powder, an organohydrogenpolysiloxane having two or more SiH groups per molecule, and a platinum group metal catalyst, in which when a storage and loss elastic modulus G? of the silicone composition is measured by means a viscoelasticity measurement apparatus capable of measuring shear modulus, the silicone composition can provide a cured product wherein G? after 3,000 seconds from the start of holding is 10,000 Pa or less, G? after 7,200 seconds from the start of holding is 100,000 Pa or less, and G? exceeds G? after 800 seconds or more from the start of holding. As a result, there is provided a silicone composition excellent in crushability, spreadability, and heat conductivity, and further provided a method for manufacturing a heat-conductive silicone composition.

Abstract: A polymer (A) having, at one terminal moiety thereof, a terminal structure having two or more carbon-carbon unsaturated bonds. A reactive-silicon-group-containing polymer (B) having, at one terminal moiety thereof, a terminal structure having two or more reactive silicon groups.

Abstract: The present invention relates to silicone polymer ligands for binding to quantum dots. The silicone polymer ligands contain a multiplicity of amine, carboxy, and/or phosphine binding groups suitable for attachment to quantum dots. The present invention also describes a process for the preparation of quantum dot binding ligands.

Abstract: A polymer material comprising a constraint bicyclic bridged structure such as bicyclo(2,2,1) ring system, most preferably a norbornyl group, pendant to a siloxane backbone. The bridged bicyclic-containing materials can exhibit good refractive index, transparency, gas permeability, and/or other properties making them suitable for use in a variety of applications.

Abstract: The present invention aims to provide a condensation-curable silicone resin composition with excellent adhesion properties. The present invention also aims to provide a condensation-curable silicone resin cured product formed from the condensation-curable silicone resin composition and a sealed optical semiconductor element formed by using the condensation-curable silicone resin composition.

Abstract: A surface finish may be formed in a microelectronic structure, wherein the surface finish may include an interlayer comprising a refractory metal, phosphorus, and nickel, with the refractory metal having a content of between about 2 and 12% by weight and the phosphorus having a content of between about 2 and 12% by weight with the remainder being nickel. In one embodiment, the refractory metal of the interlayer may consist of one of tungsten, molybdenum, and ruthenium. In another embodiment, the interlayer may comprise the refractory metal being tungsten having a content of between about 5 and 6% by weight and phosphorus having a content of between about 5 and 6% by weight with the remainder being nickel.

Abstract: A process for forming an organic-inorganic hybrid material that can undergo a property change when exposed to an external stimulus, the process comprising providing a prepolymer; and attaching a functional organometal material to the prepolymer, where the functional organometal material comprises a functional moiety that is responsive to an external stimulus such that the organic-inorganic hybrid material exhibits a change in a property of the organic-inorganic hybrid material. The process can further include forming hydrogel particles from the organic-inorganic hybrid material.

Abstract: A laminate is formed by laminating a substrate and a support plate through an adhesive layer and a release layer. The release layer is formed by applying a composition containing a reactive polysilsesquioxane and a crosslinkable group-containing siloxane onto the surface of the support plate or the surface of the substrate and heating the composition to polymerize the reactive polysilsesquioxane and the crosslinkable group-containing siloxane.

Abstract: Provided is an electro-conductive belt including an electro-conductive resin layer. The electro-conductive resin layer includes a matrix containing a thermoplastic resin having at least one bond selected from the group consisting of an amide bond, an ester bond and a carbonate bond, a domain containing an ionic liquid containing a hexafluorophosphate anion or an anion expressed by formula (1), and particles containing a silicone resin having a structure expressed by formula (2): R0—SiO3/2.

Abstract: A silicone composition that contains an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, a filler containing an aluminum powder and a zinc oxide powder, an organohydrogenpolysiloxane having two or more SiH groups per molecule, and a platinum group metal catalyst, in which when a storage and loss elastic modulus G? of the silicone composition is measured by means a viscoelasticity measurement apparatus capable of measuring shear modulus, the silicone composition can provide a cured product wherein G? after 3,000 seconds from the start of holding is 10,000 Pa or less, G? after 7,200 seconds from the start of holding is 100,000 Pa or less, and G? exceeds G? after 800 seconds or more from the start of holding. As a result, there is provided a silicone composition excellent in crushability, spreadability, and heat conductivity, and further provided a method for manufacturing a heat-conductive silicone composition.

Abstract: A polyacetal resin composition which, when formed into a molded article, minimizes degradation caused by contact with a fuel. This resin composition contains 100 parts by weight of a polyacetal copolymer resin, 0.1-1.0 parts by weight of a hindered phenol-based antioxidant, 0.1-2.0 parts by weight of a divalent metal oxide, and 0.5-3.0 parts by weight of an alkylene oxide adduct of an alkylamine and/or an alkylene oxide adduct of an alkylene diamine. Component contains magnesium oxide and/or zinc oxide, and component is one or more of general formulae (1) to (3). In these general formulae, X represents (C2H4O)m(C3H6O)nH, and m and n are each an integer of 0 or higher. In addition, R1 is an alkyl group having 12-18 carbon atoms, and R2 is an alkylene group having 2 or 3 carbon atoms.

Abstract: An anti-microbial coating formulation consisting essentially of triethanolamine and a silane.

Abstract: The present invention provides curable compositions comprising non-tin metal accelerators that accelerate the condensation curing of moisture-curable silicones/non-silicones. In particular, the present invention provides an accelerator comprising amino acid compounds that are suitable as replacements for organotin in sealant and RTV formulations.

Abstract: A composition for forming a silica based layer and a method for manufacturing a silica based layer, the composition including a silicon-containing compound, the silicon-containing compound including a hydrogenated polysilazane moiety, a hydrogenated polysiloxazane moiety, or a combination thereof, and a solvent, wherein a number of particles of the silicon-containing compound in the composition and having a particle diameter of about 0.2 ?m to about 1 ?m is less than or equal to about 10/ml.

Abstract: An organopolysiloxane having at least 4 terminal hydrosilyl groups per molecule is novel. Also provided is an addition curable silicone composition comprising (A) a linear organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least 4 terminal hydrosilyl groups per molecule, and (C) a hydrosilylation catalyst.

Abstract: The present invention relates to a resin composition containing components (A), (B), and (C), component (A) being a silicone resin having a weight-average molecular weight of 3,000-500,000 and having constituent units represented by compositional formula (1), component (B) being an epoxy resin curing agent, and component (C) being a filler. The present invention is capable of providing a resin film and a resin composition whereby wafers can be molded (wafer molding) in batch fashion, the resin composition having good molding properties with respect to large-diameter thin-film wafers in particular while at the same time imparting low warpage after molding and good wafer-protective ability, the resin composition also facilitating the molding step and being suitable for use in wafer-level packaging.

Abstract: The invention provides mixtures, liquid at 25° C.

Abstract: A polymeric material formed by reacting aminopolyol having a structure: wherein R4 is selected from the group consisting of —H and —CH2—CH2—OH; and an organosilane, wherein said organosilane has a structure: wherein R1 is selected from the group consisting of —H, —CH3 and —CH2—CH3 and R2 is selected from the group consisting of —OH, —O—CH3, O—CH2—CH3, alkyl, alkyl with a chlorine moiety, alkyl with an amino moiety, and alkyl with a quaternary ammonium group.

Abstract: A method of making a thermoplastic composition comprises melt blending two polysiloxane/polyimide block copolymers. Both of the block copolymers have extended polysiloxane blocks.

Abstract: A sizing composition for reinforcement fibers that includes one or more film forming agents, a silane coupling agent package, and at least one lubricant surfactant is provided. Optional components such as rheology modifiers, fillers, biocides, and pH modifiers may also be included. Preferred film forming polymers are amide-based polymers. Additionally, the sizing composition is free of polyvinyl alcohol. The absence of polyvinyl alcohol in the size composition reduces or eliminates the production of precipitates from white water in wet-laid processes. The size composition is applied to reinforcement fibers and formed into chopped strand, wet-laid mats that can be used for a variety of purposes, including roofing products. Chopped strand mats formed from fibers sized with the inventive sizing composition maintains or improves the dry tear and tensile strengths compared to chopped strand mats made from fibers sized with a commercial sizing composition that does not contain polyvinyl alcohol.