Patents Examined by Mark Kopec
  • Patent number: 11810688
    Abstract: Electrically conductive nanocomposite particles including a core of a C1-C6 alkyl polyacrylate homopolymer or a copolymer of C1-C6 alkyl acrylate and of an ?,?-unsaturated amide comonomer, a shell of polyaniline, and a non-ionic surfactant, for printing on a stretchable substrate. Also, a printed stretchable substrate obtained from the electrically conductive nanocomposite particles, which is usable, for example, in the field of printed electronics or connected clothing.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: November 7, 2023
    Assignees: UNIVERSITE DE PAU ET DES PAYS DE L'ADOUR, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
    Inventors: Stéphanie Reynaud, Pierre Marcasuzaa
  • Patent number: 11802221
    Abstract: An electrically conductive adhesive layer includes an adhesive material; a plurality of electrically conductive dendritic first particles dispersed in the adhesive material and having a cumulative 50% particle diameter D50 in a range from about 20 micrometers to about 40 micrometers; and a plurality of electrically conductive substantially planar second particles dispersed in the adhesive material and having a cumulative 50% particle diameter D50 in a range from about 40 micrometers to about 70 micrometers. The adhesive layer has an average thickness in a range from about 15 micrometers to about 35 micrometers, an electrical resistance in a thickness direction of less than about 30 milliohms, and a peel strength of at least 0.1 N/mm from a stainless steel surface after a dwell time of about 20 minutes at 22° C.
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: October 31, 2023
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Jing Fang, Dong Yang, Jeffrey W. McCutcheon
  • Patent number: 11802074
    Abstract: A high-tension busbar silver paste applied to the N-type solar cell is prepared by mixing a silver powder (a mixture of a spherical silver powder A having a median particle size of 700-900 nm and a tapped density of 5-6 g/mL and a spherical silver powder B having a medium particle size of 280-450 nm and a tapped density of 4-5 g/mL), an organic vehicle (a mixture of 3-5 wt % of polyvinyl butyral resin and 5-10 wt % of acrylic resin as a main resin) and a glass powder (copper-bismuth-manganese-tellurium series glass powder having a medium particle size of 0.7-1 ?m and a softening temperature of 600-800° C.); the silver paste has large welding tension, in which the welding tension of the front busbar line is 4 N or more.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: October 31, 2023
    Assignee: NANTONG T-SUN NEW ENERGY CO., LTD.
    Inventors: Ping Mao, Shu Zhang, Yulong Guan, Huan Yang
  • Patent number: 11802253
    Abstract: Compositions, systems and methods for introducing lubricants, and additives, that are designed to work with environmentally friendly refrigerants into vehicle heat management systems including passenger compartment air conditioning (A/C) systems are disclosed. Methods for charging lubricants and specific additives using environmentally desirable (low GWP) refrigerant or refrigerant blend compositions into an environmentally friendly system, such as a system that uses HFO-1234yf, are also disclosed.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: October 31, 2023
    Assignee: THE CHEMOURS COMPANY FC, LLC
    Inventors: Mary E. Koban, Nina E. Gray, Hubert Mentz, Jr.
  • Patent number: 11799076
    Abstract: A main object of the present disclosure is to provide an active material wherein a volume variation due to charge/discharge is small. The present disclosure achieves the object by providing an active material comprising a silicon clathrate II type crystal phase, including a void inside a primary particle, and a void amount of the void with a fine pore diameter of 100 nm or less is 0.05 cc/g or more and 0.15 cc/g or less.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: October 24, 2023
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Mitsutoshi Otaki, Jun Yoshida, Kazuhiro Suzuki, Masanori Harata
  • Patent number: 11799080
    Abstract: A positive electrode active material having high capacity and excellent cycle performance is provided. The positive electrode active material has a small difference in a crystal structure between the charged state and the discharged state. For example, the crystal structure and volume of the positive electrode active material, which has a layered rock-salt crystal structure in the discharged state and a pseudo-spinel crystal structure in the charged state at a high voltage of approximately 4.6 V, are less likely to be changed by charge and discharge as compared with those of a known positive electrode active material.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: October 24, 2023
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Mayumi Mikami, Aya Uchida, Yumiko Yoneda, Yohei Momma, Masahiro Takahashi, Teruaki Ochiai
  • Patent number: 11787730
    Abstract: A glass powder is a glass powder comprising vanadium-tellurium-silver, which has a softening temperature of 230-330° C. and a median particle size of 1-2 ?m; when the glass powder is applied to the silver paste, the requirement that the silver paste is sintered at the temperature of 230-400° C. can be met, and a firm three-dimensional network structure can be formed in the glass system after the silver paste is sintered, and the welding tension of a front silver electrode can be improved; the addition of other metal elements to the glass powder can enable the network structure of the glass powder to be more compact and complete and ensure the stability of the glass powder; the prepared silver paste can be sintered at a temperature of 230-400° C.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: October 17, 2023
    Assignee: NANTONG T-SUN NEW ENERGY CO., LTD.
    Inventors: Ping Mao, Xin Zhao, Jinhua Zheng
  • Patent number: 11785845
    Abstract: An object of the present invention is to provide a composition capable of manufacturing an organic thin film transistor having excellent carrier mobility even under low temperature conditions. The composition of the present invention contains a compound represented by Formula (1) and an alcohol represented by Formula (S1).
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: October 10, 2023
    Assignees: FUJIFILM Corporation, The University of Tokyo
    Inventors: Koki Nakamura, Hiroki Sugiura, Yukio Tani, Tetsuya Matsushita, Tetsuya Watanabe, Junichi Takeya, Toshihiro Okamoto
  • Patent number: 11781022
    Abstract: An anti-corrosive coating composition is disclosed. The anti-corrosive coating composition includes a binder, an electrically conducting polymer, one or more fillers, and a crosslinker. The electrically conductive polymer may include polyaniline, poly(3,4-ethylenedioxythiophene), polypyrrole, or an additive, such as a biopolymer grafted thereto. A method for making an anti-corrosive coating composition is also disclosed.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: October 10, 2023
    Assignee: THE BOEING COMPANY
    Inventors: Kamaraj Kandhasamy, Kishora Shetty
  • Patent number: 11783958
    Abstract: The conductive wiring material composition includes (A) a polymer compound having a repeating unit “a” which has a structure selected from an ammonium salt, a lithium salt, a sodium salt, a potassium salt and a silver salt of any of fluorosulfonic acid, fluorosulfonimide and fluorosulfonamide and (B) metal powder, wherein the component (B) is contained with an amount exceeding 50 parts by mass based on 100 parts by mass of a solid content of the conductive wiring material composition excluding the component (B).
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: October 10, 2023
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Jun Hatakeyama, Koji Hasegawa, Osamu Watanabe
  • Patent number: 11783953
    Abstract: Disclosed are a superconductor having improved critical current density when exposed to high-energy neutron radiation and high magnetic fields, such as found in a compact nuclear fusion reactor, and a method of making the same. The method includes, prior to deployment in the exposure environment, irradiating a polycrystalline (e.g. cuprate) superconductor with ionic matter or neutrons at a cryogenic temperature to create “weak” magnetic flux pinning sites, such as point defects or small defect clusters. Irradiation temperature is chosen, for example as a function of the superconducting material, so that irradiation creates the beneficial flux pinning sites while avoiding detrimental widening of the boundaries of the crystalline grains caused by diffusion of the displaced atoms. Such a superconductor in a coated-conductor tape is expected to be beneficial when used, for example, as a toroidal field coil in a fusion reactor when cooled well below its critical temperature.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: October 10, 2023
    Assignee: MASSACHUSETTS INSTITUTE OF TECHNOLOGY
    Inventors: Brandon Nils Sorbom, Zachary Hartwig, Dennis G. Whyte
  • Patent number: 11776707
    Abstract: An electrically conductive paste includes: an elastic binder; and a conductive filler. The conductive filler includes: at least one spherical conductive filler, at least one plate-like conductive filler, and at least one rod-like conductive filler. In an embodiment, the spherical filler has a mean particle diameter, measured in accordance with ISO 21501-2:2019-11 of at most 200 ?m.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: October 3, 2023
    Assignee: CARL FREUDENBERG KG
    Inventors: Stanislaus Schmidt, Benno Schmied, Ivan Schmalzel, Marco Sutter
  • Patent number: 11777089
    Abstract: A positive electrode active material having high capacity and excellent cycle performance is provided. The positive electrode active material has a small difference in a crystal structure between the charged state and the discharged state. For example, the crystal structure and volume of the positive electrode active material, which has a layered rock-salt crystal structure in the discharged state and a pseudo-spinel crystal structure in the charged state at a high voltage of approximately 4.6 V, are less likely to be changed by charge and discharge as compared with those of a known positive electrode active material.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: October 3, 2023
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Mayumi Mikami, Aya Uchida, Yumiko Yoneda, Yohei Momma, Masahiro Takahashi, Teruaki Ochiai
  • Patent number: 11773271
    Abstract: Hybrid particles having improved electrical conductivity and thermal and chemical stabilities are disclosed. The hybrid particles are for use in conductive pastes. The hybrid particles include a nanoparticle selected from a graphene-containing material, a dichalcogenide material, a conducting polymer, or a combination thereof encapsulated in a conducting metal. The hybrid particles include a nanoparticle selected from a graphene-containing material, a dichalcogenide material, or a combination thereof encapsulated in a conducting polymer, and optionally further in a conducting metal. Suitable conducting metals include nickel or silver. Suitable conducting polymers include polyaniline, polypyrrole, or polythiophene. Suitable dichalcogenide materials include MoS2 or MoSe2. The hybrid particles can further include a conducting polymer layer on an outer surface of the conducting metal. Methods of making the hybrid particles are also disclosed.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: October 3, 2023
    Assignee: University of South Florida
    Inventor: Manoj Kumar Ram
  • Patent number: 11773276
    Abstract: A conductive polymer composition having the resistance to moisture and heat in the coating film is provided. A conductive polymer composition comprising a solvent and a ?-conjugated conductive polymer is provided. A vinyl sulfone group-containing compound containing a vinyl sulfone group as a dopant of the conductive polymer or an additive is included and when the conductive polymer composition contains the vinyl sulfone group-containing compound as the additive, the vinyl sulfone group-containing compound contains a plurality of vinyl sulfone groups.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: October 3, 2023
    Assignee: SOKEN CHEMICAL & ENGINEERING CO., LTD.
    Inventor: Takeshi Miyamoto
  • Patent number: 11777094
    Abstract: A composite binder composition for an all-solid-state battery includes: a first polymer comprising a repeating structure represented by Chemical Formula 1a or Chemical Formula 1b below, and a second polymer comprising at least one selected from a group consisting of diene-based rubber, polysiloxane, and combinations thereof:
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: October 3, 2023
    Assignees: Hyundai Motor Company, Kia Corporation, SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
    Inventors: Sang Mo Kim, Tae Young Kwon, Ju Yeon Lee, Sung Hoo Jung, Jang Wook Choi, Ji Eun Lee
  • Patent number: 11776893
    Abstract: Metallic alloy interconnects (which can comprise copper) with low electrical resistivity and methods for making the same are disclosed. The electrical resistivity of thin film copper alloys was reduced by 36% with niobium solute and by 51% with iron solute compared to pure copper counterpart in dilute solute regimes (0-1.5 atomic %). The fabrication method is operated at room temperature, and does not require a high temperature annealing step.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: October 3, 2023
    Assignee: The Trustees of the University of Pennsylvania
    Inventors: Daniel S. Gianola, Gyuseok Kim
  • Patent number: 11776709
    Abstract: A flexible conductive paste and a flexible electronic device are provided, which relate to the technical field of new materials. The flexible conductive paste includes: 3% to 7% by weight of a film former; 20% to 50% by weight of a conductive powder; 25% to 45% by weight of a liquid metal microcapsule; 10% to 30% by weight of a solvent; 0.1% to 5% by weight of a curing agent; and 0.5% to 5% by weight of a functional additive. The wall of the liquid metal microcapsule is a coating resin, the core of the liquid metal microcapsule is a liquid metal. The melting point Tm of the liquid metal satisfies Tm?T1. The film former has a molecular weight within a range of 15000 to 30000, and has a glass transition temperature Tg smaller than or equal to T1. T1 is a temperature at which the flexible conductive circuit manufactured by the flexible conductive paste is deformed. The flexible conductive circuit of the present disclosure can have better conductivity and better flexibility simultaneously.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: October 3, 2023
    Assignee: Beijing Dream Ink Technologies Co., Ltd.
    Inventors: Shijin Dong, Zhenlong Men
  • Patent number: 11776708
    Abstract: The present disclosure provides a liquid metal conductive paste and an electronic device, and relates to a technical field of new materials. The liquid metal conductive paste provided by the present disclosure includes: 1%-50% by weight of a liquid metal microcapsule, 30%-80% by weight of a conductive powder, 1%-25% by weight of a base polymer and 10%-40% by weight of a solvent. A capsule wall of the liquid metal microcapsule is made of a coating polymer, and a capsule core is made of a liquid metal. Melting point of the liquid metal satisfies: the liquid metal is in a liquid state at least when the wire made of the liquid metal conductive paste is deformed. The present disclosure can achieve a better flexible wire.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: October 3, 2023
    Assignee: Beijing Dream Ink Technologies Co., Ltd.
    Inventors: Ping Li, Shijin Dong, Zhenlong Men
  • Patent number: 11767399
    Abstract: A composition comprising: (a) a conductive polymer, (b) a resin having a solubility parameter of 9.0 to 12.0 (cal/cm3)1/2, (c) a solvent, and (d) a phenolic compound.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: September 26, 2023
    Assignee: IDEMITSU KOSAN CO., LTD.
    Inventors: Shingo Onodera, Toru Bando