Patents Examined by Matthew A Eason
  • Patent number: 11225408
    Abstract: An embodiment as described herein includes a microelectromechanical system (MEMS) with a first MEMS transducer element, a second MEMS transducer element, and a semiconductor substrate. The first and second MEMS transducer elements are disposed at a top surface of the semiconductor substrate and the semiconductor substrate includes a shared cavity acoustically coupled to the first and second MEMS transducer elements.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: January 18, 2022
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Andreas Wiesbauer, Christian Mandl, Marc F├╝ldner, Shu-Ting Hsu
  • Patent number: 11228847
    Abstract: A microphone can include a cover having a series of slits and a nest. The nest can be configured to receive a first diaphragm, a second diaphragm, and a PCB in a stacked arrangement, such that the PCB is positioned between the first diaphragm and the second diaphragm. Also, the first diaphragm can define a first plane, the second diaphragm can define a second plane, and the PCB can define a third plane and the first plane, the second plane, and the third plane can extend parallel to one another. The cover can also include slits having a first length and a second length, and the first length can be greater than the second length. The slits can extend both radially and axially.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: January 18, 2022
    Assignee: Shure Acquisition Holdings, Inc.
    Inventors: Jeff Segota, Michael Alwicker, Daniel Pratt, John Miller, Elizabeth Cho
  • Patent number: 11223907
    Abstract: The present application relates to structures for supporting mechanical, electrical and/or electromechanical components, devices and/or systems and to methods of fabricating such structures. The application describes a primary die comprising an aperture extending through the die. The aperture is suitable for receiving a secondary die. A secondary die may be provided within the aperture of the primary die.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: January 11, 2022
    Assignee: Cirrus Logic, Inc.
    Inventors: Rkia Achehboune, Roberto Brioschi
  • Patent number: 11214483
    Abstract: In an embodiment a MEMS microphone includes a substrate, a shield layer, a central insulation layer and a membrane, wherein the substrate has an upper surface with a first opening therein, wherein the shield layer is arranged between the upper surface of the substrate and the membrane, the shield layer having a second opening, wherein the central insulation layer is arranged between the shield layer and the membrane, the shield layer comprising a dielectric bulk material having a third opening and an etch stopper forming an edge of the central insulation layer towards the third opening such that the dielectric bulk material of the central insulation layer is completely enclosed between the shield layer, the etch stopper and the membrane, and wherein all openings are arranged one above another to form a common sound channel to the membrane.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: January 4, 2022
    Assignee: TDK CORPORATION
    Inventors: Kurt Rasmussen, Jan Tue Ravnkilde
  • Patent number: 11206495
    Abstract: A MEMS microphone includes a substrate. A dielectric layer is disposed on the substrate, having an opening and includes: indent region surrounding the opening; pillars extending from an indent surface at the indent region to the substrate; and an outer part surrounding the indent region and disposed on the substrate. A signal sensing space is created at the indent region between the pillars and between the pillars and the outer part. A first electrode layer is disposed on the indent surface of the dielectric layer. A second electrode layer is disposed on the substrate. A sensing diaphragm is held by the dielectric layer, including two elastic diaphragms supported by the dielectric layer; and a conductive plate between the first elastic diaphragm and the second elastic diaphragm. The conductive plate has a central part embedded in the holding structure and a peripheral part extending into the signal sensing space.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: December 21, 2021
    Assignee: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Li-Chi Tsao, Chien-Hsing Lee
  • Patent number: 11197106
    Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: December 7, 2021
    Assignee: SHENZHEN VOXTECH CO., LTD.
    Inventors: Xin Qi, Fengyun Liao
  • Patent number: 11197104
    Abstract: A microelectromechanical system (MEMS) transducer includes a transducer substrate including an opening; a back plate including a plurality of protrusions oriented substantially perpendicular to the back plate; and a diaphragm between the transducer substrate and the back plate. The diaphragm includes a lead and a plurality of spring members. The lead is structured to suspend the diaphragm over the transducer substrate. The spring members are structured to separate the diaphragm from the transducer substrate and the back plate in the absence of a bias voltage.
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: December 7, 2021
    Assignee: Knowles Electronics, LLC
    Inventor: Peter V. Loeppert
  • Patent number: 11197079
    Abstract: A MEMS microphone with a hybrid packaging structure is provided. The microphone comprises: a first circuit board; a second circuit board, spaced apart from the first circuit board and parallel to the first circuit board; a packaging cover, covering the second circuit board, and forming an acoustic cavity with the second circuit board; wherein the first circuit board and the second circuit board form an accommodating space in which a pressure sensor is disposed. In the present invention, the chip and electronics of the MEMS microphone are installed on two different circuit boards, respectively, so that an interior space of the microphone is fully utilized, a good heat dissipation is achieved, a better sound transmission effect is achieved, and the microphone can be widely used.
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: December 7, 2021
    Inventor: Jinghua Ye
  • Patent number: 11197088
    Abstract: A MEMS transducer includes a transducer substrate, a back plate, a diaphragm, and an intermediate layer. The transducer substrate includes an aperture. The back plate is coupled to a first surface of the transducer substrate and covers the aperture. The diaphragm is oriented substantially parallel to the back plate and is spaced apart from the back plate to form a gap. The intermediate layer is coupled to the diaphragm and the back plate and includes an acoustic relief channel, which fluidly couples the gap to an environment surrounding the MEMS transducer.
    Type: Grant
    Filed: May 10, 2020
    Date of Patent: December 7, 2021
    Assignee: Knowles Electronics, LLC
    Inventors: Vahid Naderyan, Mohammad Mohammadi, Evan Llamas-Young
  • Patent number: 11185170
    Abstract: Furniture such as a mattresses and beds containing mattresses include transducers disposed within the furniture and exposed from external surfaces of the furniture to deliver sounds or ranges of sonic frequencies in a sonic wave vibration format through the furniture to the occupant of the furniture and audible format through external speakers to an area around the furniture.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: November 30, 2021
    Assignee: PPJ, LLC
    Inventors: Philip Reid Sherman, Horace Robert Eskridge, III, Philip Woods McCarty
  • Patent number: 11180361
    Abstract: A MEMS device includes a first electrode structure and a second electrode structure forming a capacitive sensing arrangement. The MEMS device includes a plurality of anti-stiction bumps arranged between the first electrode structure and the second electrode structure at a corresponding plurality of locations. The plurality of locations being projected into a main surface of the second electrode structure is distributed so as to comprise a first distribution density in a first main surface region of the main surface and so as to comprise second, different distribution density in a second main surface region of the main surface, the second main surface region being delimited from the first main surface region.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: November 23, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Marc Fueldner, Arnaud Walther
  • Patent number: 11172314
    Abstract: The application describes a package substrate for a MEMS transducer package having a recessed region formed in an upper surface of the package substrate. The recessed region extends only partially through the package substrate from an opening in the upper surface of the package substrate in a first direction towards the lower surface of the substrate. The recessed region extends only partially through the package substrate from an opening in a side surface of the package substrate in a second direction towards an opposite side surface.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: November 9, 2021
    Assignee: Cirrus Logic, Inc.
    Inventors: Roberto Brioschi, Rkia Achehboune
  • Patent number: 11159894
    Abstract: The present invention provides a MEMS microphone, having a base and a capacitive system provided on the base. The capacitive system includes a diaphragm and a back plate. The MEMS microphone is further provided with a supporting frame located between the back plate and the diaphragm. One end of the supporting frame is connected with the back plate, and the other end is connected with the diaphragm. The supporting frame divides the cavity into a first cavity body and a second cavity body. The supporting frame is provided with a connection channel. During the production process of the MEMS microphone, the etchant enters the first cavity body, and then enters the second cavity body, which prevents oxides from remaining in the microphone product and affecting the use of MEMS microphone.
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: October 26, 2021
    Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
    Inventors: Linlin Wang, Xiaohui Zhong, Rui Zhang, Zhenkui Meng
  • Patent number: 11159868
    Abstract: An electronic device is provided. The electronic device includes an interface, and a processor configured to receive an input of a user, output an audio signal by using a first external device connected to the electronic device through the interface, in response to the input of the user, obtain an audio signal reflected on a part of the user of the outputted audio signal, by using the first external device, authenticate the user by using the reflected audio signal and execute a specified function in a unlocked state of the electronic device when the user is a user authenticated for the electronic device.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: October 26, 2021
    Inventor: Young Soo Chun
  • Patent number: 11159895
    Abstract: Provided is a piezoelectric type and capacitive type combined MEMS microphone, comprising a base with a back cavity and a capacitor system arranged on the base; wherein, the capacitor system comprises a back plate and a diaphragm; the back plate is opposite to and apart from the diaphragm to form a first sound cavity; a piezoelectric diaphragm structure is between the capacitor system and the base; a second sound cavity is formed between the capacitor system and the piezoelectric diaphragm structure; the second sound cavity is at least in communication with the first sound cavity or the back cavity; the piezoelectric type and capacitive type combined MEMS microphone can output two groups of electric signals comprising a group of electric signals output from the capacitor system and a group of electric signals output from the piezoelectric diaphragm structure, thus improving sensitivity of the microphone.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: October 26, 2021
    Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
    Inventors: Bei Tong, Zhan Zhan, Yang Li, Kahkeen Lai, Xiaohui Zhong, Lian Duan
  • Patent number: 11153691
    Abstract: A thin-film filter includes thin-film part having a film surface and a rear film surface arranged a rear side of the film surface, a plurality of through holes being formed to penetrate the thin-film part from the film surface to the rear film surface, and stripes-formed inner wall surfaces. The stripes-formed inner wall surfaces include stripe-like parts formed along with an intersecting direction intersecting the film surface. The stripes-formed inner wall surfaces are formed inside the respective through holes.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: October 19, 2021
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Hiroshi Take, Makoto Yoshida, Anthony Reymund Melad Binarao, Cheng Bu Heng
  • Patent number: 11146894
    Abstract: The present application describes a MEMS transducer package having a substrate layer which defines a recess. The recess extends in the plane of the substrate layer and defines a channel for directing sound waves that are incident on a side surface of the package substrate.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: October 12, 2021
    Assignee: Cirrus Logic, Inc.
    Inventors: Roberto Brioschi, Rkia Achehboune
  • Patent number: 11146892
    Abstract: Magnetic field cancelling audio systems and associated devices are disclosed. In one embodiment, an audio system with two electromagnetic audio drivers positioned and electrically connected to reduce emitted magnetic fields over a range of predefined frequencies.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: October 12, 2021
    Assignee: SeeScan, Inc.
    Inventors: Ray Merewether, Mark S Olsson
  • Patent number: 11146896
    Abstract: An MEMS microphone comprises a substrate; a cover covering the substrate and forming an acoustic cavity with the substrate, wherein the substrate of the acoustic cavity is provided with: an acoustic transducer disposed in a first region of the substrate; an integrated circuit chip comprising a first bonding pad and a second bonding pad, wherein the first bonding pad is connected to the acoustic transducer via lead wires, the second bonding pad communicates with a groove formed at a bottom of the integrated circuit chip; a metal connection layer is formed on a surface of the groove and a portion where the metal connection layer extends to a bottom surface of the integrated circuit chip serves as a metal connection area. The integrated circuit chip is connected to a second region of the substrate through the metal connection area.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: October 12, 2021
    Inventor: Jinghua Ye
  • Patent number: 11146882
    Abstract: An earphone including an audio play portion, a body where a printed circuit board, a plug, and a socket are installed, and a connecting wire. The plug, the socket, and the connecting wire are in electrical connection with the printed circuit board. The plug is configured to be adapted to a lightning interface integrated with an audio output and a power input, and the audio play portion and the socket are in electrical connection with the plug and capable of work simultaneously and being respectively configured to play music and charge when the plug is inserted into the lightning interface. The earphone utilizes the plug to be adapted to the lightning interface integrated with the audio output and the power input.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: October 12, 2021
    Inventors: Shiwen Guo, Yong Zhang, Jihui Wang, Zhiqiong Wei