Patents Examined by Matthew A Eason
  • Patent number: 11350211
    Abstract: An in-the-ear hearing aid device is disclosed. The device at least one electro-acoustic transducer, and at least one sensor or at least one active electronic component. The at least one electro-acoustic transducer comprises a capsule enclosing a transducer sound active part and a transducer air volume. The transducer air volume is air volume which is enclosed by said capsule and which is in fluid-connection with said transducer sound active part. At least a portion of said at least one sensor or of said at least one active electronic component is provided within said transducer air volume.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: May 31, 2022
    Assignee: Oticon A/S
    Inventors: Troels Holm Pedersen, Therese Schønemann Blom, Seri Jalonen, Jan Thor Lunddahl Larsen, Niels Stubager Kiemer, Jesper B. Johansen, Povl Koch, Svend Oscar Petersen, Anders Erik Petersen, Kåre Tais Christensen, Antonello Salvatucci, Franz Treue
  • Patent number: 11350198
    Abstract: An earphone includes a main body unit in which an outside shape of one edge portion is formed in an arc shape to be fitted into a pinna, a sound tube portion extending from the main body unit to a first surface side of the main body unit, and a supporter for covering at least the first surface side at a side of the one edge portion in the main body unit. The supporter includes a protruding portion protruded toward the first surface side in an arc shape corresponding to an arc shape of the outside shape of the one edge portion in the main body unit.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: May 31, 2022
    Assignee: JVCKENWOOD CORPORATION
    Inventor: Shinji Kamimura
  • Patent number: 11350223
    Abstract: A thermal excitation acoustic-wave-generating device includes a first acoustic wave source that includes a first heating element and a substrate that includes a main surface along which the first heating element is disposed, a second acoustic wave source that includes a second heating element and a facing body that includes a main surface along which the second heating element is disposed, and a pair of electrodes connected to the first and second heating elements. The first and second acoustic wave sources are arranged such that the first and second heating elements are separated from each other and face each other. The pair of electrodes are disposed between the first and second acoustic wave sources.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: May 31, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shinichi Sasaki, Takaaki Asada
  • Patent number: 11343613
    Abstract: The technology described in this document can be embodied in a computer-implemented method of controlling a wearable audio device configured to provide an audio output. The method includes receiving data indicating the wearable audio device is proximate a geographic location associated with a localized audio message, and determining that the localized audio message has a higher priority compared to at least one other localized audio message associated with another geographical location proximate to the wearable audio device. The method also includes, responsive to determining that the localized audio message has the higher priority, providing a prompt to initiate playback of the localized audio message with the higher priority to a user of the wearable audio device, and initiating playback of the localized audio message with the higher priority at the wearable audio device in response to actuation of the prompt by the user.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: May 24, 2022
    Assignee: Bose Corporation
    Inventors: John Gordon, Santiago Carvajal, Glenn Gomes-Casseres, Todd Richard Reily, Conor Sheehan, Neil Adam Ranney
  • Patent number: 11343605
    Abstract: System for automatic right-left ear detection for headphone comprising: first earcup and second earcup that are identical. Each of first and second earcups includes: first microphone located on perimeter of each earcup, when first earcup is worn on user's right ear first microphone of first earcup is at location farthest from user's mouth when headphone is worn in normal wear position; second microphone located on perimeter of each earcup, when first earcup is worn on user's right ear, second microphone of first earcup is at location closer than first microphone of first earcup to user's mouth; third microphone located inside each earcup facing user's ear cavity, fourth microphone located at perimeter and bottom center portion of each earcup and facing exterior of each earcup, and fifth microphone located on perimeter of each earcup above and to left of second microphone when looking at outside housing of each earcup.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: May 24, 2022
    Assignee: APPLE INC.
    Inventor: Sorin V. Dusan
  • Patent number: 11337005
    Abstract: A MEMS capacitive microphone according to the present invention is configured such that a support plate 120 from which an inside thereof has been removed in a plane is attached to supports 110 each having an end fixed to a substrate 100, an anchor 130 is attached to an edge region of the support plate 120, an edge of a diaphragm 200 is supported by the anchor 130, and a “substrate-free area” includes the anchor 130 in a plan view, and pluralities of moving comb fingers 300 and stiffeners are attached to a top or bottom or a top and bottom of the diaphragm 200, and the supports 110 support the stationary comb fingers 400 arranged at predetermined intervals on both sides of the moving comb fingers 300 in a plan view.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: May 17, 2022
    Inventor: Kyeong Won Kim
  • Patent number: 11335312
    Abstract: Embodiments include fenestration units with active sound canceling properties, retrofit units with active sound canceling properties and related methods. In an embodiment a fenestration unit with active sound canceling properties can include an glazing unit including an exterior transparent pane, an interior transparent pane, and an internal space disposed between the exterior and interior transparent panes. The fenestration unit can include an active noise cancellation system including an exterior module including a sound input device and a signal emitter. An interior module can include a signal receiver to receive the signal from the signal emitter, and a vibration generator configured to vibrate the interior transparent pane. A sound cancellation control module can control the vibration generator to vibrate the interior transparent pane and generate pressure waves causing destructive interference with a portion of the sound waves received by the sound input device.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: May 17, 2022
    Assignee: Andersen Corporation
    Inventors: David D. Plummer, Kevin T. Ferenc
  • Patent number: 11337016
    Abstract: A mechanical connection is provided for a microelectromechanical and/or nanoelectromechanical device for measuring a variation in pressure. The device includes a fixed component extending in a main plane, a mobile component to move or deform in an out-of-plane direction under effect of a variation in pressure, and a detector of movement or deformation having at least one mobile element.
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: May 17, 2022
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventor: Loïc Joet
  • Patent number: 11330385
    Abstract: A method and system dynamically adjusts the audio of an audio and video signal to improve its overall sound quality and dialog intelligibility. Some embodiments use gain, equalization, audio signal compression and spatial enhancement (reverb) on individual channels of a multichannel audio signal.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: May 10, 2022
    Inventor: Steven Jay Borne
  • Patent number: 11323823
    Abstract: An MEMS acoustic transducer includes a substrate having an opening formed therein, a diaphragm comprising a slotted insulative layer, and a first conductive layer. The slotted insulative layer is attached around a periphery thereof to the substrate and over the opening, and the first conductive layer is disposed on a first surface of the slotted insulative layer. A backplate is separated from the diaphragm and disposed on a side of the diaphragm opposite the substrate.
    Type: Grant
    Filed: January 18, 2021
    Date of Patent: May 3, 2022
    Assignee: KNOWLES ELECTRONICS, LLC
    Inventors: Shubham Shubham, Hungchien Lin
  • Patent number: 11322127
    Abstract: A noise cancellation technique is presented with improved frequency resolution. The method includes: acquiring a digitized noise signal from an environment in which the audio signal stream is present; receiving a data sample from the digitized noise signal; appending one or more additional samples to the data sample to form a series of samples, where magnitude for each of the one or more additional samples is substantially zero; computing a frequency domain representation of the series of samples in the frequency domain; shifting the frequency domain representation of the series of samples in time using the digital processor circuit, thereby producing a shifted frequency domain representation of the series of samples; converting the shifted frequency domain representation of the series of samples to time domain to form a portion of an anti-noise signal; and outputting the anti-noise signal into the audio signal stream to abate the noise through destructive interference.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: May 3, 2022
    Assignee: Silencer Devices, LLC.
    Inventors: Eugene Seagriff, Raihan Ferdous Sajal, Jean-Claude Junqua
  • Patent number: 11317219
    Abstract: A method for manufacturing a filtering module comprising the steps of: forming a multilayer body comprising a filter layer of semiconductor material and having a thickness of less than 10 ?m, a first structural layer coupled to a first side of the filter layer, and a second structural layer coupled to a second side, opposite to the first side, of the filter layer; forming a recess in the first structural layer, which extends throughout its thickness; removing selective portions, exposed through the recess, of the filter layer to form a plurality of openings, which extend throughout the thickness of the filter layer; and completely removing the second structural layer to connect fluidically the first and second sides of the filter layer, thus forming a filtering membrane designed to inhibit passage of contaminating particles.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: April 26, 2022
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Matteo Perletti, Federico Vercesi, Silvia Adorno, Giorgio Allegato
  • Patent number: 11317220
    Abstract: In an embodiment, the invention provides a structure of MEMS microphone includes a substrate of semiconductor, having a first opening in the substrate. A dielectric layer is disposed on the substrate, having a dielectric opening. A diaphragm is within the dielectric opening and held by the dielectric layer at a peripheral region, wherein the diaphragm has a diaphragm opening. A back-plate is disposed on the dielectric layer, over the diaphragm. A protruding structure is disposed on the back-plate, protruding toward the diaphragm. At least one air valve plate is affixed on an end of the protruding structure within the diaphragm opening of the diaphragm. The air valve plate is activated when suffering an air flow with a pressure.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: April 26, 2022
    Assignee: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Cheng-Wei Tsai, Chien-Hsing Lee
  • Patent number: 11312616
    Abstract: A structure of micro-electro-mechanical-system (MEMS) microphone includes a substrate, having a first opening. A dielectric layer is disposed on the substrate, wherein the dielectric layer has a second opening aligned to the first opening. A membrane is disposed within the second opening of the dielectric layer. A peripheral region of the membrane is embedded into the dielectric layer at sidewall of the second opening. A backplate layer is disposed on the dielectric layer. The backplate layer includes a protection layer, having a peripheral region disposed on the dielectric layer and a central region with venting holes over the second opening. The central region of the protection layer further has anti-sticky structures at a side of the protection layer toward the membrane. An electrode layer is disposed on the side of the protection layer, surrounding the anti-sticky structures.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: April 26, 2022
    Assignee: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Chien-Hsing Lee, Cheng-Wei Tsai
  • Patent number: 11311238
    Abstract: A sensor pod assembly comprising a gel pad, a gel pad cap, a piezoelectric sensor, a base plate, a base plate support, a wiring harness, a battery, a noise attenuating backing, and a charging component; said gel pad comprising a top and bottom, said bottom having a flat bottom and a concave recess; said flat bottom acoustically contacting said piezoelectric sensor; said piezoelectric sensor secured to a first side of said base plate support, and a second side of said base plate support secured to said base plate, a wiring harness and a battery connected to said base plate, and a charging component having exposed annular rings on the exterior side of said sensor pod assembly; a noise attenuating backing compressing the charging component against the base plate; and a gel pad cap having an outer face and an inner face, said inner face in contact with said base plate support.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: April 26, 2022
    Assignee: CVR Global, Inc.
    Inventors: Bret Kline, Peter Bakema
  • Patent number: 11317185
    Abstract: The purpose of the present invention is to provide an earphone with a better fit and with an improved sound quality. An earphone 20 is provided with: an elastic housing 21; a speaker 24 contained within the housing 21; and a nozzle 26 fixed on the housing 21. The nozzle 26 includes a sound guiding part 33 through which sounds from the speaker 24 pass and is configured such that the orientation of the sound guiding part 33 relative to the housing 21 can be adjusted by elastic deformation of the housing 21.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: April 26, 2022
    Assignee: VIE STYLE, INC.
    Inventor: Yasuhiko Imamura
  • Patent number: 11308975
    Abstract: A mixing device of a first signal and a second signal on a time-frequency plane, includes a control signal generation unit to generate a control signal indicating whether to perform prioritized mixing that includes amplification of the first signal and attenuation of the second signal; and a gain derivation unit to derive a first gain for amplifying the first signal and a second gain for attenuating the second signal based on the control signal. The control signal takes at least a first value and a second value different from the first value, wherein the first value is not continuous beyond a predetermined bandwidth on a frequency axis. The mixing device applies the prioritized mixing to the first and second signals when the control signal indicates the first value, and applies simple addition to the first and second signals when the control signal indicates the second value.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: April 19, 2022
    Assignees: The University of Electro-Communications, Hibino Corporation
    Inventors: Kota Takahashi, Tsukasa Miyamoto, Yoshiyuki Ono, Yoji Abe, Hiroshi Inoue
  • Patent number: 11310606
    Abstract: The present disclosure provides an MEMS microphone including a base having a rear cavity and a capacitor system disposed on the base. The capacitor system includes a rear plate and a diaphragm that are spaced relatively apart to form an acoustic cavity. A piezoelectric diaphragm is attached to a side of the diaphragm, the side being away from the acoustic cavity. The piezoelectric diaphragm, under the deformation effect of the diaphragm, deforms to generate and output charges. Therefore, the MEMS microphone can output two groups of electrical signals, one group of electrical signals output by the capacitor system and one group of electrical signals output by the piezoelectric diaphragm, thereby sensitivity of the microphone is improved.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: April 19, 2022
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Bei Tong, Zhan Zhan, Yang Li, Kahkeen Lai, Xiaohui Zhong, Lian Duan
  • Patent number: 11304011
    Abstract: A bone conduction speaker includes a housing, a vibration board and a transducer. The transducer is located in the housing, and the vibration board is configured to contact with skin and pass vibration. At least one sound guiding hole is set on at least one portion of the housing to guide sound wave inside the housing to the outside of the housing. The guided sound wave interfaces with the leaked sound wave, and the interfacing reduces a sound pressure level of at least a portion of the leaked sound wave. A frequency of the at least a portion of the leaked sound wave is lower than 4000 Hz.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: April 12, 2022
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Xin Qi, Fengyun Liao
  • Patent number: 11299392
    Abstract: The Application describes a substrate design for a MEMS transducer package. The substrate is defined by a conductive layer which forms the upper and lower surfaces of the substrate. The substrate is also provided with a conductive portion which is electrically isolated from the rest of the conductive layer. The conductive portion is supported between a first plane defined by the upper surface of the substrate and a second plane defined by the lower surface of the substrate by an electrically insulating moulding substance.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: April 12, 2022
    Assignee: Cirrus Logic, Inc.
    Inventors: Rkia Achehboune, Roberto Brioschi, Dimitris Drogoudis, David Patten