Patents Examined by Matthew A Eason
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Patent number: 11521632Abstract: A system includes a first microphone that captures audio, a communication module communicatively coupled to the first microphone, a logic circuit communicatively coupled to the first microphone and communication module, a speaker operatively coupled to the logic circuit, and an interaction element. The interaction element and logic circuit are configured to initiate control of audio content for output from the speaker in response to at least one voice command detected in captured audio. Other embodiments are disclosed.Type: GrantFiled: February 10, 2020Date of Patent: December 6, 2022Assignee: STATON TECHIYA, LLCInventor: Steven Wayne Goldstein
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Patent number: 11523224Abstract: A capacitive transducer or microphone includes a first substrate of one or more layers and which includes a first surface, a first cavity in the first surface, and a mesa diaphragm that spans the first cavity. The capacitive transducer or microphone includes a second substrate fixed to the first substrate. The second substrate has one or more layers which includes a second cavity having a nonplanar (e.g., contoured or structured or stepped) bottom surface that faces the mesa diaphragm. A shape or relief of the bottom surface of the cavity may advantageously be, to at least some degree, complementary to a deformed shape of the diaphragm. The second substrate may include one or more acoustic holes, non-uniformly distributed thereacross. One or more vents may vent the second cavity.Type: GrantFiled: February 21, 2020Date of Patent: December 6, 2022Inventors: Kathirgamasundaram Sooriakumar, Anu Austin, Ian Rose Bihag, Boon Wah Soh, Jane Jiaying Soh
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Patent number: 11516597Abstract: A force feedback actuator includes a pair of electrodes and a dielectric member. The pair of electrodes are spaced apart from one another to form a gap. The dielectric member is disposed at least partially within the gap. The dielectric member includes a first portion having a first permittivity and a second portion having a second permittivity that is different from the first permittivity. The dielectric member and the pair of electrodes are configured for movement relative to each other.Type: GrantFiled: December 9, 2020Date of Patent: November 29, 2022Assignee: Knowles Electronics, LLCInventors: Mohsin Nawaz, Stephen C. Thompson, Michael Pedersen, Peter V. Loeppert, Zouhair Sbiaa
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Patent number: 11513366Abstract: Various aspects include audio eyeglasses with a frame including: a lens region; a pair of arms extending from the lens region; a hinge coupling each of the pair of arms with the lens region; and a cable extending through each hinge, where each hinge includes: a body defining a cavity accommodating the cable; and a hinge mechanism within the body, the hinge mechanism having: a spring located in the lens region, the spring including at least one lever arm extending within the cavity; and a cam member contacting the lever arm of the spring, where the cam member includes: a first contact surface for resisting kickback from the spring when the audio eyeglasses are in a fully open position, and a second, distinct contact surface for resisting kickback from the spring when the audio eyeglasses are in a fully closed position.Type: GrantFiled: April 17, 2020Date of Patent: November 29, 2022Assignee: Bose CorporationInventors: Brandon Leo Hicks, Annu Kuriakose, Dallas Robert Tharrett
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Patent number: 11516596Abstract: A MEMS device and a method for manufacturing a MEMS device are provided. The MEMS device includes an anchor, a diaphragm structure, and a sealing film. The diaphragm structure is disposed over the anchor and has an opening through the diaphragm structure. The sealing film covers at least a portion of the opening of the diaphragm structure.Type: GrantFiled: October 30, 2020Date of Patent: November 29, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Wei-Chu Lin, Yi-Chuan Teng, Jung-Kuo Tu
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Patent number: 11516595Abstract: An integrated structure of a MEMS microphone and an air pressure sensor, and a fabrication method for the integrated structure, the structure including a base substrate; a vibrating membrane, back electrode, upper electrode, and lower electrode formed on the base substrate, as well as a sacrificial layer formed between the vibrating membrane and the back electrode and between the upper electrode and the lower electrode; a first integrated circuit electrically connected to the vibrating membrane and the back electrode respectively; and a second integrated circuit electrically connected to the lower electrode and the upper electrode respectively, wherein a region of the base substrate corresponding to the vibrating membrane is provided with a back cavity; the sacrificial layer between the vibrating membrane and the back electrode is hollowed out to from a vibrating space that communicates with the exterior of the integrated structure, and the sacrificial layer between the upper electrode and the lower electrodeType: GrantFiled: September 27, 2018Date of Patent: November 29, 2022Assignee: WEIFANG GOERTEK MICROELECTRONICS CO., LTD.Inventors: Dexin Wang, Huabin Fang, Qinglin Song
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Patent number: 11501790Abstract: An audiovisual communication system includes a plurality of environment sound sources, a microphone array, an image processing device, an audio processing device and a denoise processing device. Each of the plurality of environment sound sources has an environment sound. A plurality of microphones of the microphone array receive the plurality of environment sounds and output a plurality of receiving audio signals according to the plurality of environment sounds respectively. The image processing device obtains an image including the plurality of environment sound sources and selects one of the plurality of environment sound sources in the image as a target sound source according to a selection command. The image processing device calculates a relative position between the target sound source and the microphone array according to a first coordinate. The audio processing device receives the plurality of receiving audio signals and calculates a target audio signal.Type: GrantFiled: March 19, 2021Date of Patent: November 15, 2022Assignee: COMPAL ELECTRONICS, INC.Inventor: Dao-Wen Tang
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Patent number: 11503388Abstract: Loudspeaker enclosures and loudspeaker devices are provided. In some embodiments, a loudspeaker device is provided, the loudspeaker device comprising: a loudspeaker enclosure, comprising: a rear side; and a front side of the loudspeaker enclosure comprising: a lower portion of the front side comprising a first opening for receiving a first loudspeaker and a second opening for receiving a second loudspeaker; and an upper portion of the front side comprising a third opening for receiving a third loudspeaker, a first port, and a second port, wherein a distance from the lower portion of the front side to the rear side is greater than a distance from the upper portion of the front side to the rear side; the first loudspeaker positioned in the first opening; the second loudspeaker positioned in the second opening; and the third loudspeaker positioned in the third opening.Type: GrantFiled: July 22, 2020Date of Patent: November 15, 2022Assignee: Warner Music Inc.Inventor: George Augspurger
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Patent number: 11503422Abstract: One or more embodiments include an audio processing system for generating an audio scene for an extended reality (XR) environment. The audio processing system determines that a first virtual sound source associated with the XR environment affects a sound in the audio scene. The audio processing system generates a sound component associated with the first virtual sound source based on a contribution of the first virtual sound source to the audio scene. The audio processing system maps the sound component to a first loudspeaker included in a plurality of loudspeakers. The audio processing system outputs at least a first portion of the component for playback on the first loudspeaker.Type: GrantFiled: January 22, 2019Date of Patent: November 15, 2022Assignee: Harman International Industries, IncorporatedInventors: Sven Kratz, Adam Boulanger, Joseph Verbeke, Stefan Marti
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Patent number: 11495239Abstract: The following coding scenario is addressed: A number of audio source signals need to be transmitted or stored for the purpose of mixing wave field synthesis, multi-channel surround, or stereo signals after decoding the source signals. The proposed technique offers significant coding gain when jointly coding the source signals, compared to separately coding them, even when no redundancy is present between the source signals. This is possible by considering statistical properties of the source signals, the properties of mixing techniques, and spatial hearing. The sum of the source signals is transmitted plus the statistical properties of the source signals, which mostly determine the perceptually important spatial cues of the final mixed audio channels. Source signals are recovered at the receiver such that their statistical properties approximate the corresponding properties of the original source signals. Subjective evaluations indicate that high audio quality is achieved by the proposed scheme.Type: GrantFiled: April 8, 2020Date of Patent: November 8, 2022Assignee: FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.Inventor: Christof Faller
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Patent number: 11484911Abstract: A ultrasonic transducer device includes a transducer bottom electrode layer disposed over a substrate, and a plurality of vias that electrically connect the bottom electrode layer with the substrate, wherein substantially an entirety of the plurality of vias are disposed directly below a footprint of a transducer cavity. Alternatively, the transducer bottom electrode layer includes a first metal layer in contact with the plurality of vias and a second metal layer formed on the first metal layer, the first metal layer including a same material as the plurality of vias.Type: GrantFiled: April 9, 2020Date of Patent: November 1, 2022Assignee: BFLY Operations, Inc.Inventors: Lingyun Miao, Jianwei Liu
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Patent number: 11490205Abstract: The invention relates to audio transducers, such as loudspeaker, microphones and the like, and includes improvements in or relating to: audio transducer diaphragm structures and assemblies, audio transducer mounting systems; audio transducer diaphragm suspension systems, personal audio devices incorporating the same and any combination thereof. The embodiments of the invention include linear action and rotational action transducers. For both types of transducer, rigid and composite diaphragm constructions and unsupported diaphragm periphery designs are described. Systems and methods for mounting the transducer to a housing, such as an enclosure or baffle are also described. Furthermore, hinge systems including: rigid contact hinge systems and flexible hinge systems are also disclosed for various rotational action transducer embodiments.Type: GrantFiled: October 30, 2020Date of Patent: November 1, 2022Assignee: WING ACOUSTICS LIMITEDInventors: David John Palmer, Michael Ian Palmer
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Patent number: 11484287Abstract: Arrangements described herein relate to systems, apparatuses, and methods for a headset system that includes a transducer configured to collect physiological data of a subject, a device housing configured to support the transducer, an insert portion disposed on the device housing, a support structure comprising a baseplate and a receiving portion, and a head cradle supported by the baseplate. The receiving portion extends in a direction that is oblique with respect to the baseplate. The insert portion is sized and shaped to engage the receiving portion to removably attach the device housing to the baseplate.Type: GrantFiled: February 12, 2020Date of Patent: November 1, 2022Assignee: NovaSignal Corp.Inventors: Jan Zwierstra, Kiah Lesher, Matthew Hutter, Lane Stith
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Patent number: 11483666Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.Type: GrantFiled: February 8, 2021Date of Patent: October 25, 2022Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Xin Qi, Fengyun Liao
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Patent number: 11470426Abstract: A micro electrical mechanical systems (MEMS) device includes a flexible membrane disposed over a substrate, and a first backplate disposed over the flexible membrane. The first backplate includes a first plurality of bumps facing the flexible membrane. The MEMS device further includes a plurality of features disposed at the flexible membrane, where each of the plurality of features being associated with a corresponding one of the first plurality of bumps.Type: GrantFiled: August 9, 2019Date of Patent: October 11, 2022Assignee: Infineon Technologies AGInventors: Arnaud Walther, Stefan Barzen, Wolfgang Klein, Johann Strasser
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Patent number: 11463817Abstract: A microelectromechanical systems (MEMS) die includes a substrate, a back plate, and a diaphragm. The back plate is coupled to the substrate and includes a dielectric layer and an electrode. The electrode is coupled to the dielectric layer and defines an opening that exposes a central portion of the dielectric layer. The diaphragm is oriented parallel to the back plate and is spaced apart from the back plate. In one implementation, a diameter of the opening is greater than or equal to 1/10 of the diameter of the diaphragm.Type: GrantFiled: March 30, 2021Date of Patent: October 4, 2022Assignee: KNOWLES ELECTRONICS, LLCInventor: Peter V. Loeppert
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Patent number: 11463806Abstract: A method includes: generating a first and second shift signal by using a phase of a sound signal regarding an M-channel or a S-channel, the sound signal of the M-channel and the sound signal of the S-channel being obtained by using a mid-side microphone, the sound signal of the S-channel including a positive channel and a negative channel, the first shift signal being configured to reduce a phase difference caused by a difference between a sound arrival distance to the M-channel and a sound arrival distance to the positive channel of the S-channel, the second shift signal being configured to reduce a phase difference caused by a difference between the sound arrival distance to the M-channel and a sound arrival distance to the negative channel of the S-channel; and approximately converting the first or second shift signal into an L-channel signal and an R-channel signal of an XY-microphone.Type: GrantFiled: October 2, 2020Date of Patent: October 4, 2022Assignee: FUJITSU LIMITEDInventors: Yohei Kishi, Masanao Suzuki
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Patent number: 11455141Abstract: Audio systems and methods for obtaining location information are disclosed. A portable, wireless speaker that may include a beacon that a user may activate to remotely trigger a request for shot information, which may include location information of the user or speaker. The beacon may be wirelessly coupled to the speaker. The speaker may receive location information from a remote device, such as a GPS-enabled mobile phone. The shot information may be converted into an audio format for playback by the speaker. The speaker may pause the playback of the speaker to play out the shot information.Type: GrantFiled: November 11, 2019Date of Patent: September 27, 2022Assignee: BUSHNELL INC.Inventors: John DeCastro, Scott O. Nyhart, William Flood
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Patent number: 11447388Abstract: A MEMS package includes a MEMS chip, a package substrate which the MEMS chip is adhered and a thin-film filter which is adhered to the package substrate or the MEMS chip. The thin-film filter includes a thin-film part having a film surface and a rear film surface arranged a rear side of the film surface, and a plurality of through holes being formed to penetrate the thin-film part from the film surface to the rear film surface. The through holes are formed in an adhesive region of the thin-film part. The adhesive region is adhered to the package substrate or the MEMS chip.Type: GrantFiled: February 13, 2020Date of Patent: September 20, 2022Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Hiroshi Take, Makoto Yoshida, Anthony Reymund Melad Binarao, Cheng Bu Heng
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Patent number: 11451907Abstract: Concentric rings of speakers in a room are activated in sequence to emit test sounds that are picked up by microphones placed in the ears of a listener in the middle of the room. The output of the microphones is used to generate plural HRTF spheres that are concentric, and that can be convolved with each other to render a multi-distance HRTF filter that can be configured to “move” the perceived distance and bearing of audio objects “inside” the outer sphere as desired, without being restricted to placing the audio objects at the outer edges of a single sphere. Any desired placement of an audio object between spheres is done by interpolating between respective coefficients of the closest spheres.Type: GrantFiled: May 29, 2019Date of Patent: September 20, 2022Assignee: Sony CorporationInventors: James R. Milne, Gregory Peter Carlsson