Patents Examined by Matthew Eason
  • Systems and methods for suppressing sound leakage
    Patent number: 11197106
    Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: December 7, 2021
    Assignee: SHENZHEN VOXTECH CO., LTD.
    Inventors: Xin Qi, Fengyun Liao
  • MEMS microphone with acoustic relief channels
    Patent number: 11197088
    Abstract: A MEMS transducer includes a transducer substrate, a back plate, a diaphragm, and an intermediate layer. The transducer substrate includes an aperture. The back plate is coupled to a first surface of the transducer substrate and covers the aperture. The diaphragm is oriented substantially parallel to the back plate and is spaced apart from the back plate to form a gap. The intermediate layer is coupled to the diaphragm and the back plate and includes an acoustic relief channel, which fluidly couples the gap to an environment surrounding the MEMS transducer.
    Type: Grant
    Filed: May 10, 2020
    Date of Patent: December 7, 2021
    Assignee: Knowles Electronics, LLC
    Inventors: Vahid Naderyan, Mohammad Mohammadi, Evan Llamas-Young
  • MEMS transducer including free plate diaphragm with spring members
    Patent number: 11197104
    Abstract: A microelectromechanical system (MEMS) transducer includes a transducer substrate including an opening; a back plate including a plurality of protrusions oriented substantially perpendicular to the back plate; and a diaphragm between the transducer substrate and the back plate. The diaphragm includes a lead and a plurality of spring members. The lead is structured to suspend the diaphragm over the transducer substrate. The spring members are structured to separate the diaphragm from the transducer substrate and the back plate in the absence of a bias voltage.
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: December 7, 2021
    Assignee: Knowles Electronics, LLC
    Inventor: Peter V. Loeppert
  • Mattress with embedded transducers
    Patent number: 11185170
    Abstract: Furniture such as a mattresses and beds containing mattresses include transducers disposed within the furniture and exposed from external surfaces of the furniture to deliver sounds or ranges of sonic frequencies in a sonic wave vibration format through the furniture to the occupant of the furniture and audible format through external speakers to an area around the furniture.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: November 30, 2021
    Assignee: PPJ, LLC
    Inventors: Philip Reid Sherman, Horace Robert Eskridge, III, Philip Woods McCarty
  • MEMS device and method for producing the same
    Patent number: 11180361
    Abstract: A MEMS device includes a first electrode structure and a second electrode structure forming a capacitive sensing arrangement. The MEMS device includes a plurality of anti-stiction bumps arranged between the first electrode structure and the second electrode structure at a corresponding plurality of locations. The plurality of locations being projected into a main surface of the second electrode structure is distributed so as to comprise a first distribution density in a first main surface region of the main surface and so as to comprise second, different distribution density in a second main surface region of the main surface, the second main surface region being delimited from the first main surface region.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: November 23, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Marc Fueldner, Arnaud Walther
  • Packaging for a MEMS transducer
    Patent number: 11172314
    Abstract: The application describes a package substrate for a MEMS transducer package having a recessed region formed in an upper surface of the package substrate. The recessed region extends only partially through the package substrate from an opening in the upper surface of the package substrate in a first direction towards the lower surface of the substrate. The recessed region extends only partially through the package substrate from an opening in a side surface of the package substrate in a second direction towards an opposite side surface.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: November 9, 2021
    Assignee: Cirrus Logic, Inc.
    Inventors: Roberto Brioschi, Rkia Achehboune
  • Electronic device for authenticating user by using audio signal and method thereof
    Patent number: 11159868
    Abstract: An electronic device is provided. The electronic device includes an interface, and a processor configured to receive an input of a user, output an audio signal by using a first external device connected to the electronic device through the interface, in response to the input of the user, obtain an audio signal reflected on a part of the user of the outputted audio signal, by using the first external device, authenticate the user by using the reflected audio signal and execute a specified function in a unlocked state of the electronic device when the user is a user authenticated for the electronic device.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: October 26, 2021
    Inventor: Young Soo Chun
  • Piezoelectric type and capacitive type combined MEMS microphone
    Patent number: 11159895
    Abstract: Provided is a piezoelectric type and capacitive type combined MEMS microphone, comprising a base with a back cavity and a capacitor system arranged on the base; wherein, the capacitor system comprises a back plate and a diaphragm; the back plate is opposite to and apart from the diaphragm to form a first sound cavity; a piezoelectric diaphragm structure is between the capacitor system and the base; a second sound cavity is formed between the capacitor system and the piezoelectric diaphragm structure; the second sound cavity is at least in communication with the first sound cavity or the back cavity; the piezoelectric type and capacitive type combined MEMS microphone can output two groups of electric signals comprising a group of electric signals output from the capacitor system and a group of electric signals output from the piezoelectric diaphragm structure, thus improving sensitivity of the microphone.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: October 26, 2021
    Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
    Inventors: Bei Tong, Zhan Zhan, Yang Li, Kahkeen Lai, Xiaohui Zhong, Lian Duan
  • MEMS microphone
    Patent number: 11159894
    Abstract: The present invention provides a MEMS microphone, having a base and a capacitive system provided on the base. The capacitive system includes a diaphragm and a back plate. The MEMS microphone is further provided with a supporting frame located between the back plate and the diaphragm. One end of the supporting frame is connected with the back plate, and the other end is connected with the diaphragm. The supporting frame divides the cavity into a first cavity body and a second cavity body. The supporting frame is provided with a connection channel. During the production process of the MEMS microphone, the etchant enters the first cavity body, and then enters the second cavity body, which prevents oxides from remaining in the microphone product and affecting the use of MEMS microphone.
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: October 26, 2021
    Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
    Inventors: Linlin Wang, Xiaohui Zhong, Rui Zhang, Zhenkui Meng
  • Thin-film filter, thin-film filter substrate, method of manufacturing the thin-film filter, method of manufacturing the thin-film filter substrate, MEMS microphone and method of manufacturing the MEMS microphone
    Patent number: 11153691
    Abstract: A thin-film filter includes thin-film part having a film surface and a rear film surface arranged a rear side of the film surface, a plurality of through holes being formed to penetrate the thin-film part from the film surface to the rear film surface, and stripes-formed inner wall surfaces. The stripes-formed inner wall surfaces include stripe-like parts formed along with an intersecting direction intersecting the film surface. The stripes-formed inner wall surfaces are formed inside the respective through holes.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: October 19, 2021
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Hiroshi Take, Makoto Yoshida, Anthony Reymund Melad Binarao, Cheng Bu Heng
  • Packaging for a MEMS transducer
    Patent number: 11146894
    Abstract: The present application describes a MEMS transducer package having a substrate layer which defines a recess. The recess extends in the plane of the substrate layer and defines a channel for directing sound waves that are incident on a side surface of the package substrate.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: October 12, 2021
    Assignee: Cirrus Logic, Inc.
    Inventors: Roberto Brioschi, Rkia Achehboune
  • Magnetic field canceling audio devices
    Patent number: 11146892
    Abstract: Magnetic field cancelling audio systems and associated devices are disclosed. In one embodiment, an audio system with two electromagnetic audio drivers positioned and electrically connected to reduce emitted magnetic fields over a range of predefined frequencies.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: October 12, 2021
    Assignee: SeeScan, Inc.
    Inventors: Ray Merewether, Mark S Olsson
  • Mems microphone with improved connection structure and method for manufacturing the same
    Patent number: 11146896
    Abstract: An MEMS microphone comprises a substrate; a cover covering the substrate and forming an acoustic cavity with the substrate, wherein the substrate of the acoustic cavity is provided with: an acoustic transducer disposed in a first region of the substrate; an integrated circuit chip comprising a first bonding pad and a second bonding pad, wherein the first bonding pad is connected to the acoustic transducer via lead wires, the second bonding pad communicates with a groove formed at a bottom of the integrated circuit chip; a metal connection layer is formed on a surface of the groove and a portion where the metal connection layer extends to a bottom surface of the integrated circuit chip serves as a metal connection area. The integrated circuit chip is connected to a second region of the substrate through the metal connection area.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: October 12, 2021
    Inventor: Jinghua Ye
  • Earphone
    Patent number: 11146882
    Abstract: An earphone including an audio play portion, a body where a printed circuit board, a plug, and a socket are installed, and a connecting wire. The plug, the socket, and the connecting wire are in electrical connection with the printed circuit board. The plug is configured to be adapted to a lightning interface integrated with an audio output and a power input, and the audio play portion and the socket are in electrical connection with the plug and capable of work simultaneously and being respectively configured to play music and charge when the plug is inserted into the lightning interface. The earphone utilizes the plug to be adapted to the lightning interface integrated with the audio output and the power input.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: October 12, 2021
    Inventors: Shiwen Guo, Yong Zhang, Jihui Wang, Zhiqiong Wei
  • Accoustic feedback path modeling for hearing assistance device
    Patent number: 11140499
    Abstract: A system and method of determining a filter to cancel feedback signals from input signals in a hearing assistance device includes determining feedback signals for a plurality of feedback paths associated with the device, and determining a model of the plurality of feedback paths, with the model having an invariant portion and a time varying portion. A probable structure of the invariant portion is determined to generate a structural constraint to constrain the plurality of feedback paths, and probability distributions to impose the structural constraint on the invariant portion are determined. During an iterative process, the invariant portion is iteratively determined using the determined probability distributions and the feedback path measurements.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: October 5, 2021
    Assignee: Starkey Laboratories, Inc.
    Inventors: Ritwik Giri, Fred Mustiere, Tao Zhang
  • Sound signal modelling based on recorded object sound
    Patent number: 11140495
    Abstract: A hearing device configured to be worn by a user, includes: a first input transducer for providing an input signal; a first processing unit configured for processing the input signal according to a first sound signal model; and an acoustic output transducer coupled to an output of the first processing unit for conversion of an output signal from the first processing unit into an audio output signal; wherein the hearing device is configured to obtain an input signal comprising a first signal part and a second signal part, the first signal part corresponding at least partly to a first object signal recorded by a recording unit; and wherein the hearing device is also configured to apply a first set of parameter values of a second sound signal model to the first sound signal model, and process the input signal according to the first sound signal model.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: October 5, 2021
    Assignee: GN HEARING A/S
    Inventors: Bert De Vries, Almer Van Den Berg
  • Lids with a patterned conductor for microphone transducer packages, and associated modules and devices
    Patent number: 11134325
    Abstract: A microphone assembly has an interconnect substrate and a microphone transducer coupled with the substrate. A lid overlies the microphone transducer. At least a portion of the lid is spaced from the substrate, defining an acoustic chamber for the microphone transducer. The lid can have a layer of discretized metal or other patterned conductor. The discretized layer of metal or other patterned conductor is configured to inhibit formation of eddy currents, as when exposed to electromagnetic radiation. The lid can be grounded. Microphone modules and electronic devices also are described.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: September 28, 2021
    Assignee: Apple Inc.
    Inventors: Peter C. Hrudey, Anthony D. Minervini, Joseph R. Maurer
  • Bone conduction skin interface
    Patent number: 11128968
    Abstract: A skin interface apparatus configured as an interface of a prosthesis with skin of a recipient, including a first portion configured for direct contact with skin of the recipient, and a second portion configured for direct contact with skin of the recipient, wherein the portions have different material properties. In an exemplary embodiment, the first portion is a part of a holding plate pad of a hearing prosthesis and the second portion is part of a driving plate pad of the hearing prosthesis.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: September 21, 2021
    Assignee: Cochlear Limited
    Inventors: Marcus Andersson, Johan Gustafsson, Martin Evert Gustaf Hillbratt, Tobias Good
  • MEMS microphone and method of manufacturing the same
    Patent number: 11115756
    Abstract: A MEMS microphone includes a first dummy pad elevating a circumferential portion of an intermediate insulation layer adjacent to a second pad electrode, a second dummy pad elevating a first circumferential portion of an upper insulation layer adjacent to the second pad electrode, and a third dummy pad elevating a second circumferential portion of the upper insulation layer adjacent to the first pad electrode. Thus the first circumferential portion of the upper insulation layer is elevated relative to an upper surface of the second pad electrode, and the second circumferential portion of the upper insulation layer is elevated relative to an upper surface of the first pad electrode.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: September 7, 2021
    Assignee: DB HITEK CO., LTD.
    Inventors: Hyeok In Kwon, Jong Won Sun
  • MEMS microphone, a manufacturing method thereof and an electronic apparatus
    Patent number: 11111131
    Abstract: A MEMS microphone, a manufacturing method thereof and an electronic apparatus are disclosed. The MEMS microphone comprises: a MEMS microphone device including a MEMS microphone chip and a mesh membrane monolithically integrated with the MEMS microphone chip; and a housing including an acoustic port, wherein the MEMS microphone device is mounted in the housing, and the mesh membrane is arranged between the MEMS microphone chip and the acoustic port as a particle filter for the MEMS microphone chip.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: September 7, 2021
    Assignee: GOERTEK INC
    Inventor: Quanbo Zou