Patents Examined by Matthew Eason
  • Patent number: 11503422
    Abstract: One or more embodiments include an audio processing system for generating an audio scene for an extended reality (XR) environment. The audio processing system determines that a first virtual sound source associated with the XR environment affects a sound in the audio scene. The audio processing system generates a sound component associated with the first virtual sound source based on a contribution of the first virtual sound source to the audio scene. The audio processing system maps the sound component to a first loudspeaker included in a plurality of loudspeakers. The audio processing system outputs at least a first portion of the component for playback on the first loudspeaker.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: November 15, 2022
    Assignee: Harman International Industries, Incorporated
    Inventors: Sven Kratz, Adam Boulanger, Joseph Verbeke, Stefan Marti
  • Patent number: 11495239
    Abstract: The following coding scenario is addressed: A number of audio source signals need to be transmitted or stored for the purpose of mixing wave field synthesis, multi-channel surround, or stereo signals after decoding the source signals. The proposed technique offers significant coding gain when jointly coding the source signals, compared to separately coding them, even when no redundancy is present between the source signals. This is possible by considering statistical properties of the source signals, the properties of mixing techniques, and spatial hearing. The sum of the source signals is transmitted plus the statistical properties of the source signals, which mostly determine the perceptually important spatial cues of the final mixed audio channels. Source signals are recovered at the receiver such that their statistical properties approximate the corresponding properties of the original source signals. Subjective evaluations indicate that high audio quality is achieved by the proposed scheme.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: November 8, 2022
    Assignee: FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
    Inventor: Christof Faller
  • Patent number: 11484911
    Abstract: A ultrasonic transducer device includes a transducer bottom electrode layer disposed over a substrate, and a plurality of vias that electrically connect the bottom electrode layer with the substrate, wherein substantially an entirety of the plurality of vias are disposed directly below a footprint of a transducer cavity. Alternatively, the transducer bottom electrode layer includes a first metal layer in contact with the plurality of vias and a second metal layer formed on the first metal layer, the first metal layer including a same material as the plurality of vias.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: November 1, 2022
    Assignee: BFLY Operations, Inc.
    Inventors: Lingyun Miao, Jianwei Liu
  • Patent number: 11490205
    Abstract: The invention relates to audio transducers, such as loudspeaker, microphones and the like, and includes improvements in or relating to: audio transducer diaphragm structures and assemblies, audio transducer mounting systems; audio transducer diaphragm suspension systems, personal audio devices incorporating the same and any combination thereof. The embodiments of the invention include linear action and rotational action transducers. For both types of transducer, rigid and composite diaphragm constructions and unsupported diaphragm periphery designs are described. Systems and methods for mounting the transducer to a housing, such as an enclosure or baffle are also described. Furthermore, hinge systems including: rigid contact hinge systems and flexible hinge systems are also disclosed for various rotational action transducer embodiments.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: November 1, 2022
    Assignee: WING ACOUSTICS LIMITED
    Inventors: David John Palmer, Michael Ian Palmer
  • Patent number: 11484287
    Abstract: Arrangements described herein relate to systems, apparatuses, and methods for a headset system that includes a transducer configured to collect physiological data of a subject, a device housing configured to support the transducer, an insert portion disposed on the device housing, a support structure comprising a baseplate and a receiving portion, and a head cradle supported by the baseplate. The receiving portion extends in a direction that is oblique with respect to the baseplate. The insert portion is sized and shaped to engage the receiving portion to removably attach the device housing to the baseplate.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: November 1, 2022
    Assignee: NovaSignal Corp.
    Inventors: Jan Zwierstra, Kiah Lesher, Matthew Hutter, Lane Stith
  • Patent number: 11483666
    Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: October 25, 2022
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Xin Qi, Fengyun Liao
  • Patent number: 11470426
    Abstract: A micro electrical mechanical systems (MEMS) device includes a flexible membrane disposed over a substrate, and a first backplate disposed over the flexible membrane. The first backplate includes a first plurality of bumps facing the flexible membrane. The MEMS device further includes a plurality of features disposed at the flexible membrane, where each of the plurality of features being associated with a corresponding one of the first plurality of bumps.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: October 11, 2022
    Assignee: Infineon Technologies AG
    Inventors: Arnaud Walther, Stefan Barzen, Wolfgang Klein, Johann Strasser
  • Patent number: 11463817
    Abstract: A microelectromechanical systems (MEMS) die includes a substrate, a back plate, and a diaphragm. The back plate is coupled to the substrate and includes a dielectric layer and an electrode. The electrode is coupled to the dielectric layer and defines an opening that exposes a central portion of the dielectric layer. The diaphragm is oriented parallel to the back plate and is spaced apart from the back plate. In one implementation, a diameter of the opening is greater than or equal to 1/10 of the diameter of the diaphragm.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: October 4, 2022
    Assignee: KNOWLES ELECTRONICS, LLC
    Inventor: Peter V. Loeppert
  • Patent number: 11463806
    Abstract: A method includes: generating a first and second shift signal by using a phase of a sound signal regarding an M-channel or a S-channel, the sound signal of the M-channel and the sound signal of the S-channel being obtained by using a mid-side microphone, the sound signal of the S-channel including a positive channel and a negative channel, the first shift signal being configured to reduce a phase difference caused by a difference between a sound arrival distance to the M-channel and a sound arrival distance to the positive channel of the S-channel, the second shift signal being configured to reduce a phase difference caused by a difference between the sound arrival distance to the M-channel and a sound arrival distance to the negative channel of the S-channel; and approximately converting the first or second shift signal into an L-channel signal and an R-channel signal of an XY-microphone.
    Type: Grant
    Filed: October 2, 2020
    Date of Patent: October 4, 2022
    Assignee: FUJITSU LIMITED
    Inventors: Yohei Kishi, Masanao Suzuki
  • Patent number: 11455141
    Abstract: Audio systems and methods for obtaining location information are disclosed. A portable, wireless speaker that may include a beacon that a user may activate to remotely trigger a request for shot information, which may include location information of the user or speaker. The beacon may be wirelessly coupled to the speaker. The speaker may receive location information from a remote device, such as a GPS-enabled mobile phone. The shot information may be converted into an audio format for playback by the speaker. The speaker may pause the playback of the speaker to play out the shot information.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: September 27, 2022
    Assignee: BUSHNELL INC.
    Inventors: John DeCastro, Scott O. Nyhart, William Flood
  • Patent number: 11447388
    Abstract: A MEMS package includes a MEMS chip, a package substrate which the MEMS chip is adhered and a thin-film filter which is adhered to the package substrate or the MEMS chip. The thin-film filter includes a thin-film part having a film surface and a rear film surface arranged a rear side of the film surface, and a plurality of through holes being formed to penetrate the thin-film part from the film surface to the rear film surface. The through holes are formed in an adhesive region of the thin-film part. The adhesive region is adhered to the package substrate or the MEMS chip.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: September 20, 2022
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Hiroshi Take, Makoto Yoshida, Anthony Reymund Melad Binarao, Cheng Bu Heng
  • Patent number: 11451907
    Abstract: Concentric rings of speakers in a room are activated in sequence to emit test sounds that are picked up by microphones placed in the ears of a listener in the middle of the room. The output of the microphones is used to generate plural HRTF spheres that are concentric, and that can be convolved with each other to render a multi-distance HRTF filter that can be configured to “move” the perceived distance and bearing of audio objects “inside” the outer sphere as desired, without being restricted to placing the audio objects at the outer edges of a single sphere. Any desired placement of an audio object between spheres is done by interpolating between respective coefficients of the closest spheres.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: September 20, 2022
    Assignee: Sony Corporation
    Inventors: James R. Milne, Gregory Peter Carlsson
  • Patent number: 11438706
    Abstract: A robust MEMS transducer includes a kinetic energy diverter disposed within its frontside cavity. The kinetic energy diverter blunts or diverts kinetic energy in a mass of air moving through the frontside cavity, before that kinetic energy reaches a diaphragm of the MEMS transducer. The kinetic energy diverter renders the MEMS transducer more robust and resistant to damage from such a moving mass of air.
    Type: Grant
    Filed: January 7, 2021
    Date of Patent: September 6, 2022
    Assignee: Vesper Technologies Inc.
    Inventors: Craig Core, Hamid Basaeri, Robert Littrell
  • Patent number: 11435412
    Abstract: This applications relates to methods and apparatus for monitoring a socket (101), to detect a connection status of a mating plug (102), e.g. for monitoring an audio jack socket for connection of an audio jack plug. A monitor (115, 305) is configured to monitor a voltage (VM) at a monitoring node (114), which is coupled to a jack detect contact (112) of the socket and a voltage pull-up element (113). The voltage (VM) at the monitoring node (114) is monitored against a threshold (Vthv) and a threshold module (302) is configured to vary the threshold depending on an indication of signal activity (SACT) of a signal path for a first socket contact (103) which will be electrically connected to the jack detect contact when a plug when inserted in the socket.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: September 6, 2022
    Assignee: Cirrus Logic, Inc.
    Inventor: John Bruce Bowlerwell
  • Patent number: 11425480
    Abstract: An in-ear audio listening device comprising a user input element, the user input element comprising a force-sensitive resistor (FSR) and a contact portion configured to receive a user input and, in turn, exert a force upon the FSR, wherein the FSR is configured to detect the force from the contact portion and generate an output for use in controlling operation of an electronic device associated with the in-ear audio listening device.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: August 23, 2022
    Assignee: Zound Industries International AB
    Inventors: André Hedh, Daniel Andersson, Axel Bluhme
  • Patent number: 11425521
    Abstract: The directivity of a loudspeaker describes how sound produced by the speaker varies with angle and frequency. Low-frequency sound tends to be relatively omnidirectional, while high-frequency sound tends to be more strongly directional. Because the two ears of a listener are in different spatial positions, the direction-dependent performance of the speakers can produce unwanted differences in volume or spectral content between the two ears. For example, high-frequency sounds may appear to be muffled in one ear, compared to the other. A multi-speaker sound system can employ binaural directivity compensation, which can compensate for directional variations in performance of each speaker, and can reduce or eliminate the difference in volume or spectral content between the left and right ears of a listener. The binaural directivity compensation can optionally be included with spatial audio processing, such as crosstalk cancellation, or can optionally be included with loudspeaker equalization.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: August 23, 2022
    Assignee: DTS, Inc.
    Inventors: Daekyoung Noh, Oveal Walker
  • Patent number: 11418885
    Abstract: A micromechanical component for a sensor device or microphone device. The component includes a diaphragm support structure with a diaphragm, a cavity formed in the diaphragm support structure and adjoined by a diaphragm inner side, and a separating trench structured through the surface of the diaphragm support structure and extends to the cavity and completely frames the diaphragm, and that is sealed off media-tight and/or air-tight using at least one separating trench closure material. An etching channel is formed in the diaphragm support structure, separately from the separating trench, and extends from its first etching channel end section to its second etching channel end section. The first etching channel end section opens into the cavity, and the second etching channel end section is sealed off media-tight and/or air-tight using at least one etching channel closure structure formed on an outer partial surface of the surface of the diaphragm support structure.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: August 16, 2022
    Assignee: Robert Bosch GmbH
    Inventors: Heribert Weber, Andreas Scheurle, Christoph Hermes, Peter Schmollngruber, Thomas Friedrich
  • Patent number: 11418888
    Abstract: An actuation structure of a MEMS electroacoustic transducer is formed in a die of semiconductor material having a monolithic body with a front surface and a rear surface extending in a horizontal plane x-y plane and defined in which are: a frame; an actuator element arranged in a central opening defined by the frame; cantilever elements, coupled at the front surface between the actuator element and the frame; and piezoelectric regions arranged on the cantilever elements and configured to be biased to cause a deformation of the cantilever elements by the piezoelectric effect. A first stopper arrangement is integrated in the die and configured to interact with the cantilever elements to limit a movement thereof in a first direction of a vertical axis orthogonal to the horizontal plane, x-y plane towards the underlying central opening.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: August 16, 2022
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Fabrizio Cerini, Enri Duqi, Silvia Adorno, Lorenzo Baldo
  • Patent number: 11405731
    Abstract: A microelectromechanical system includes a spacer layer, a first corrugated conductive diaphragm, and a second corrugated conductive diaphragm. The spacer layer includes counter electrode walls, slots and support walls extending along a first direction. The counter electrode walls, slots and support walls are arranged alternately in a second direction. The first corrugated conductive diaphragm includes first crests and first troughs arranged alternately in the second direction. The second corrugated conductive diaphragm includes second crests and second troughs arranged alternately in the second direction. The spacer layer is received in a cavity formed by the first and second corrugated conductive diaphragms. The support walls are respectively sandwiched between the aligned first troughs and second crests. The counter electrode walls are respectively suspended in the corresponding chambers formed between the aligned first crests and second troughs.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: August 2, 2022
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventor: Euan James Boyd
  • Patent number: 11405737
    Abstract: The invention provides a method for manufacturing a MEMS microphone, including the steps of: providing a base and preparing a first diaphragm on a first surface of the base; preparing a back plate on a surface of the first diaphragm opposite to the first surface; forming a first gap between the first diaphragm and the back plate; preparing a second diaphragm; forming a second gap between the second diaphragm and the back plate; preparing electrodes; forming a back cavity by etching the surface opposite to the first surface.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: August 2, 2022
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Zhenkui Meng, Zhengyan Liu