Patents Examined by Michael Datskovskiy
  • Patent number: 7420807
    Abstract: The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the total configuration of the apparatus. The liquid cooling unit 9 and the air cooling unit 12 are formed in a unit. A heat absorption surface 19 of the liquid cooling unit 9 is contacted or bonded to the heat generation component such as the CPU and the heat generator, which have the largest power consumption and also locally generate heat within a small area in the box 2. In the liquid cooling unit 9, a liquid cooling pump 14 composed of an electromagnetic pump is arranged for circulating the coolant in the flow path 10. The heat generated by the heat generation components such as CPU 6, heat generator 7, and the like is thermally diffused with heat conduction into the whole liquid cooling unit 9 by circulating the coolant with the liquid cooling pump 14.
    Type: Grant
    Filed: August 18, 2003
    Date of Patent: September 2, 2008
    Assignee: NEC Corporation
    Inventors: Kazuyuki Mikubo, Sakae Kitajo, Yasuhiro Sasaki, Atsushi Ochi, Mitsuru Yamamoto
  • Patent number: 7417849
    Abstract: An apparatus and method for an electric load center including a basepan with a plurality of fastener devices for securing bus bars, neutral bars, and a variety of other electrical components to the basepan. Each fastener device comprises two independent structures, the first structure a self aligning support post and the second structure is an engaging lock. Both the self aligning support post and the engaging lock project away from the basepan first surface. The self aligning support post consists of a plurality of angled surfaces to facilitate assembly of the electrical component to the basepan first surface. The self aligning support post also contains an interior cavity that houses the engaging lock. The engaging lock has a first surface with an inclined angle with respect to the basepan and a second surface with a zero angle with respect to the basepan to facilitate retention of the bus bar.
    Type: Grant
    Filed: November 29, 2004
    Date of Patent: August 26, 2008
    Assignee: Siemens Energy & Automation, Inc.
    Inventors: Joseph Scott Dixon, Kristopher Scott Robinson, Jeffrey Kenton Hudgins, Jr.
  • Patent number: 7411790
    Abstract: A heat sink with a built-in heat pipe for semiconductor package is disclosed. At least a built-in heat pipe is disposed in a cavity of a metal vessel and sealed by a metal cover. The built-in heat pipe has an evaporating portion, a condensing portion, and a bent portion between the evaporating portion and the condensing portion. Thermal interface materials are applied in the cavity such that the evaporating portion is thermally coupled to the metal vessel, and the condensing portion is thermally coupled to the metal cover. The metal vessel has a flat surface opposing to the cavity for attaching to a heating surface of a semiconductor package.
    Type: Grant
    Filed: December 23, 2004
    Date of Patent: August 12, 2008
    Assignee: Advanced Semiconductor Engineering Inc.
    Inventor: Hong-Yuan Huang
  • Patent number: 7388752
    Abstract: A series-connected heat dissipater coupled by heat-pipe used for the interface cards of a computer system. Wherein, a plurality of additional auxiliary dissipaters are provided onto the insertion slots adjacent to the interface cards, and are connected to the main dissipater through heat pipe, hereby effectively solving the heat dissipation problem of the interface cards, so that the main-machine-board will not be bent and deformed due to the overweight caused by the interface cards.
    Type: Grant
    Filed: August 9, 2006
    Date of Patent: June 17, 2008
    Assignee: Asustek Computer Inc.
    Inventors: Chien-Lung Chang, Hui He, Chih-Peng Wu
  • Patent number: 7385821
    Abstract: The present invention is a cooling device for removing heat from an integrated circuit. In one embodiment, the cooling device includes a conduit and a flexible channel having a first open end and a second closed end. The flexible channel's first open end has an internal width and is coupled with the conduit. The flexible channel is comprised of a resilient material having spring-like characteristics. In one embodiment, this material provides a spring-like restoring force when compressed. The cooling device also includes an interconnect mechanism between the conduit and the flexible channel to allow a gas or a fluid introduced within the conduit to move between the conduit and the flexible channel.
    Type: Grant
    Filed: December 6, 2001
    Date of Patent: June 10, 2008
    Assignee: Apple Inc.
    Inventor: Gary F. Feierbach
  • Patent number: 7385805
    Abstract: An uninterruptible power supply that provides power to an electrical device, the uninterruptible power supply that includes a first housing; a cover plate that includes a plurality of electrical outlets located on a surface of the cover plate and said cover plate is connected to the first housing in an angled position; and a battery in electrical communication with the plurality of electrical outlets on the surface of the cover plate, and the battery being removably attached to the first housing.
    Type: Grant
    Filed: May 13, 2005
    Date of Patent: June 10, 2008
    Assignee: American Power Conversion Corporation
    Inventors: Mark H. Germagian, Benjamin J. Beck, Andrew R. Woodward
  • Patent number: 7382614
    Abstract: A power supply having an extendable power input port connecting to a connection line to be installed on a side wall of a computer host. The side wall and the power supply form a heat dissipation passage therebetween to improve heated airflow in the computer host and increase heat dissipation effect without affecting electric plugging of the power supply.
    Type: Grant
    Filed: May 26, 2004
    Date of Patent: June 3, 2008
    Assignee: Zippy Technology Corp.
    Inventor: Tzung-Han Lee
  • Patent number: 7379302
    Abstract: An exemplary display device (1) includes a chassis (12), a circuit board (14) and a heat sink (16). The heat sink connects with the circuit board and the chassis. The chassis covers the circuit board and includes at least one heat conducting member (120) connecting with the heat sink. The display device performs an increased heat dissipating efficiency, and can be conveniently assembled or disassembled.
    Type: Grant
    Filed: June 5, 2006
    Date of Patent: May 27, 2008
    Assignees: Innocom Technology (Shenzhen) Co., Ltd., Innolux Display Corp.
    Inventors: Zhi-Yuan Cai, Te-Hsu Wang, Chih-Jen Sun
  • Patent number: 7375951
    Abstract: A load control device is operable to receive a first control signal having a first magnitude and to generate a second control signal having a second magnitude. The load control device is adapted to be installed in an electrical wallbox having a barrier. The load control device comprises a split enclosure having first and second enclosure portions and a gap between the two portions. A first connector is provided in an opening of the first portion for receipt of the first control signal and a second connector is provided in an opening of the second portion for providing the second control signal. The gap of the split enclosure receives the barrier when the load control device is installed in the electrical wallbox, such that the first control signal is electrically isolated from the second control signal. Accordingly, the load control device meets the requirements of the National Electrical Code when installed in the electrical wallbox.
    Type: Grant
    Filed: July 7, 2006
    Date of Patent: May 20, 2008
    Assignee: Lutron Electronics Co., Inc.
    Inventor: Michael Hash
  • Patent number: 7375963
    Abstract: Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first biasing member biasing the heatsink towards the module, a plurality of non-influencing fasteners positionally fixing the heatsink, and a second biasing member biasing the circuit board and module towards the heatsink. Further disclosed herein is a method of mounting a module cooling system, comprising, connecting electrically a module to a circuit board, abutting a stiffener to the circuit board, abutting a heatsink to the module, biasing with a biasing member the heatsink in a direction towards the module, fixing the heatsink with non-influencing fasteners, and biasing with a second biasing member the circuit board and module towards the heatsink.
    Type: Grant
    Filed: April 11, 2006
    Date of Patent: May 20, 2008
    Assignee: International Business Machines Corporation
    Inventors: Eric A. Eckberg, Michael S. Good, Mark D. Pfeifer
  • Patent number: 7372701
    Abstract: A work machine includes a bulkhead separating an operator cab from an engine compartment. An electronic module includes a cantilever arranged mounting flange mounted to the bulkhead. The electronic module includes a rigid and thermally conductive frame. An electronics board is mounted to one side of the frame, and a power board is mounted to an opposite side of the frame. The electronics board carries a plurality of electronic components, and the power board carries a plurality of replaceable power elements. Each power element is a fuse, relay and/or circuit breaker. A housing encloses the electronics board and the power board. The housing includes an access cover to the power board.
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: May 13, 2008
    Assignee: Deere & Company
    Inventors: Jon Thomas Jacobson, David Scott Gordon, Jason Robert Weishaar, Michael Andrew Hajicek, Michael Ray Schlichtmann
  • Patent number: 7369410
    Abstract: An apparatus for providing two-phase heat transfer for semiconductor devices includes a vapor chamber configured to carry a cooling liquid, the vapor chamber having base section, and a plurality of three-dimensional (3D) shaped members. The plurality of 3D-shaped members have interior and exterior sidewalls, the 3D-shaped members being connected to the base section so that vapor carrying latent heat can reach the respective interior sidewalls and get transferred to the respective exterior sidewalls configured to be in contact with an external coolant. The vapor chamber is configured to be in contact with a semiconductor device in order to remove heat therefrom.
    Type: Grant
    Filed: May 3, 2006
    Date of Patent: May 6, 2008
    Assignee: International Business Machines Corporation
    Inventors: Howard Chen, Hsichang Liu, Louis Hsu, Lawrence Mok
  • Patent number: 7369412
    Abstract: A heat dissipation device used for dissipating heat from heat generating electronic components mounted on an interface card, which has a mounting bracket for being mounted to a computer case, includes a heat-absorbing member, a pair of heat pipes and a pair of heat-dissipating members. The heat-absorbing member is bound to the heat generating electronic components for absorbing heat generated by the electronic components. The heat-dissipating members are disposed within the computer case and located at one peripheral side edge of the graphics card. The heat-absorbing member and the heat-dissipating members are connected by the heat pipes so as to transfer the heat received by the heat-absorbing member to the heat-dissipating members for further dissipating.
    Type: Grant
    Filed: May 2, 2006
    Date of Patent: May 6, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Xue-Wen Peng, Rui-Hua Chen
  • Patent number: 7365985
    Abstract: A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive. The two heat sink plates are connected together to form a rigid frame.
    Type: Grant
    Filed: May 9, 2006
    Date of Patent: April 29, 2008
    Assignee: Super Talent Electronics, Inc.
    Inventor: Jim Ni
  • Patent number: 7365977
    Abstract: Air in the first section is allowed to run into a second section through first and second air vents in an electronic apparatus. This causes an increase in the amount of airflow in the first section. In particular, if the pressure loss is larger in the first section, airflow blocked in the first section is forced to run into the second section. A smooth airflow can be established in the first section. Moreover, if the pressure in the first section is set larger than the pressure in the second section, a smoother airflow is established from the first section to the second section. A further superior airflow can be established in the first section.
    Type: Grant
    Filed: March 24, 2006
    Date of Patent: April 29, 2008
    Assignee: Fujitsu Limited
    Inventors: Hiromitsu Fujiya, Hideki Kimura
  • Patent number: 7365976
    Abstract: A first printed wiring board extends in the vertical direction within a first duct that extends in the vertical direction. A first axial flow fan generates airflow which absorbs heat from the first printed wiring board. Second and third ducts extends in parallel with the first duct. A fourth duct extends between the second and third ducts. A second printed wiring board extends in the horizontal direction within the fourth duct. A second axial flow fan is connected to the third duct. The second axial flow fan generates airflow which absorbs heat from the second printed wiring board. The electronic apparatus can be reduced in size.
    Type: Grant
    Filed: March 24, 2006
    Date of Patent: April 29, 2008
    Assignee: Fujitsu Limited
    Inventors: Hiromitsu Fujiya, Hideki Kimura, Eiji Makabe
  • Patent number: 7365972
    Abstract: An electronic device with dual heat dissipating structures use in an electronic system is disclosed. The electronic device comprises the circuit board having the first and second heat producing surfaces, the major and auxiliary heat dissipating structures disposed on the first and second heat producing surfaces of the circuit board respectively, and the connective portion connecting the auxiliary heat dissipating structure and the major heat dissipating structure. The second heat producing surface of the circuit board is a high-temperatured area relative to the first heat producing surface of the circuit board in the electronic system, thereby the heat produced by the second heat producing surface of the circuit board can be conducted to the major heat dissipating structure through the auxiliary heat dissipating structure and the connective portion for heat dissipation.
    Type: Grant
    Filed: April 26, 2006
    Date of Patent: April 29, 2008
    Assignee: Delta Electronics, Inc.
    Inventors: Tsu-Cheng Chen, Kai-Hung Huang, Yi-Hwa Hsieh
  • Patent number: 7365975
    Abstract: A heat dissipation device includes a heat sink including a heat conducting portion and a plurality of fins extending from the heat conducting portion. The heat conducting portion has a base portion for contacting a heat generating device, and two wing portions extending from the base portion. The heat sink has two slits extending through two opposite sides thereof. A fan holder having a fan mounted thereon is attached to a face of the heat sink. The fan holder includes two brackets each having a rib engaged in a corresponding slit of the heat sink to thereby attach the fan holder to the heat sink, and a faceplate having the fan thereon. The faceplate has an ear secured to a corresponding wing portion of the heat sink by a screw and a tab extending upwardly beyond a top end of the heat sink.
    Type: Grant
    Filed: May 2, 2006
    Date of Patent: April 29, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Wan-Lin Xia, Tao Li, Ji-Yun Qin, Jun Zhang
  • Patent number: 7362575
    Abstract: An apparatus for cooling a microprocessor includes a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal interface material layer applied to a top of the lid; at least one configurable diamond pin; at least one heat pipe; and a heat sink structure. At least one diamond pin is configured to displace junction temperature on a hot spot location of the microprocessor. The heat sink structure and at least one heat pipe are configured atop the second thermal interface material layer.
    Type: Grant
    Filed: July 17, 2006
    Date of Patent: April 22, 2008
    Assignee: Sun Microsystems, Inc.
    Inventor: Chien Ouyang
  • Patent number: 7362584
    Abstract: A heat relief socket is provided where a contact carrier substrate is provided carrying a plurality of contacts, and is supported by a frame. The frame has an open area therethrough which can receive air flow to cool the bottom of a chip carried by the socket and the contacts themselves.
    Type: Grant
    Filed: April 7, 2006
    Date of Patent: April 22, 2008
    Assignee: Tyco Electronics Corporation
    Inventors: Steven J Millard, John F D'Ambrosia