Abstract: A second duct is designed to oppose its air outlet to a portion of an air inlet of a first duct in an electronic apparatus. The wall member closes the air inlet of the first duct at a position outside the air outlet of the second duct. An opening is defined in the wall member. The opening enables a connection between the outer space of the second duct and the air inlet of the first duct. Airflow enters the air inlet of the first duct from the air outlet of the second duct as well as from the opening of the wall member, respectively.

Abstract: A mechanism for connecting a loop heat pipe and a method therefore. The mechanism can communicably connect two pipe openings of a loop heat pipe, which includes a connector body. The connector body includes at least a through hole for inserting therein at least two pipe openings. At least one of the through holes is a penetrating hole, which allows at least one unsealed pipe opening to protrude the connector body. In addition, at least a communicable hole is drilled on the connector body perpendicular to the two pipe openings, thereby communicably connecting the two pipe openings. One can access the unsealed pipe opening to clean the inner part of the pipe, so as to fill therein a working fluid. Finally, the unsealed pipe openings and the communicable hole are sealed after exhaustion. Accordingly, a loop heat pipe is obtained.

Abstract: An exemplary apparatus generally includes a fence, a heat sink, and a thermal interface. The fence includes walls defining at least one opening along an upper portion of the fence. The walls are configured to be disposed generally about one or more electrical components of a board. The heat sink includes resilient fingers connected to a lid portion, and configured to engage openings of the fence and/or the board. The lid portion is configured to substantially entirely cover the at least one opening of the fence for cooperatively shielding the one or more electrical components within the interior defined by the lid portion and the fence's walls. The thermal interface is configured such that engagement of the resilient fingers with the openings compresses the thermal interface between the lid portion and the one or more electrical components, thereby forming a thermally-conducting heat path from the one or more electrical components to the heat sink.

Abstract: A quick connect system for an electronic device, comprising a docking station configured to engage the electronic device, the docking station having a locking mechanism actuatable to an unlocked position, the locking mechanism configured to independently remain in the unlocked position and automatically return to a locking position in response to disengagement of the electronic device from the docking station.

Abstract: Described is an apparatus for use supporting a heatsink thermally coupled to an integrated circuit component disposed on a first side of a circuit board. The heatsink has an opening that is aligned with an opening of the circuit board. The apparatus includes a support stud disposed beneath the heatsink on a second side of the circuit board. The support stud has a bore and is press fit into the opening of the circuit board from the second side and secured within the opening of the circuit board by a fastener passing through the aligned openings of the heatsink and the circuit board and into the bore. A capture mechanism, disposed on a surface adjacent and parallel to the second side of the circuit board, receives the support stud, thereby coupling the circuit board to the adjacent surface.

Abstract: An optical disk device of the present invention has a main PC board carrying a semiconductor element and attached at the rear of a drawer to efficiently dissipate a heat generated from the semiconductor element. The drawer is formed of a material having good thermal conductivity. A thermal conductive member having good thermal conductivity is interposed between the IC desired to be dissipate heat and the drawer.

Abstract: A heat dissipation structure for a display panel efficiently dissipates heat generated during operation of the display panel, and a display module including the heat dissipation structure is also so characterized. The heat dissipation structure is capable of preventing electromagnetic waves generated during the operation of the display panel operation from adversely influencing a driving circuit. The heat dissipation structure comprises: a display panel; a heat dissipating sheet contacting a rear surface of the display panel; and a chassis base disposed on a rear side of the heat dissipating sheet and connected to the display panel via a double-sided adhesive element. The heat dissipating sheet includes two heat dissipating layers and a metal sheet layer interposed between the two heat dissipating layers.

Abstract: This invention provides an expansion socket for a digital video device, which is located under a side of a housing of the digital video device in a laptop. By configuring the expansion socket and the digital video device, it may form a box-like shape. The expansion socket for the digital video device of this invention comprises a socket main body for an expansion module to be inserted into in order to increase the functionality of the laptop.

Abstract: A cooling device comprises a circulation passage through which a liquid coolant flows, and a pump provided in the circulation passage configured to circulate the liquid coolant along the circulation passage. The pump includes, (1) a pump casing including a pump chamber into which the liquid coolant flows, (2) an impeller mounted in the pump chamber to push out the liquid coolant from the pump chamber to the circulation passage, and (3) an injection portion provided in the pump casing configured to inject the liquid coolant to the pump chamber.

Abstract: Embodiments of a power distribution apparatus that is adaptable to be readily mounted within a variety of differing types of electronic equipment racks are herein described. One such embodiment provides power distribution apparatus having an upper mounting adapter. The upper mounting adapter may be attachable to a housing of the power distribution apparatus or may be integrally formed therein. Another embodiment provides power distribution apparatus having a lower mounting adapter. The lower mounting adapter may be attachable to the housing of the power distribution apparatus or may be integrally formed in the housing. A further embodiment provides power distribution apparatus having at least one mounting peg mounting in mating holes formed in a rack. The mounting pegs may be attachable to a housing of the power distribution apparatus or may be integrally formed therein.

Abstract: A air shroud for dissipating heat from an electronic component is composed of a air shroud of a roughly U-shaped cross section, whose left and right sides are formed into a first and a second opening, respectively. A passage is formed between the first and second openings, enabling air to flow along a specific direction. A flexible thin piece is fixed inside the air shroud which covers a specific electronic component on a circuit board, and the flexible thin piece is touched with a surface of the electronic component. The fast-flowing air flows quickly along the passage, so as to effectively cool down a working temperature of the specific electronic component, thereby increasing a lifetime of usage of the specific electronic component.

Abstract: A switching installation (5) having a circuit breaker (12), which is connected to a cable connection (33), and optionally a disconnector (14) for making or breaking a conductive connection between the cable connection (33) and a rail system (15), and an electrically insulating barrier (10). The electrically insulating barrier (10) surrounds at least the parts which are under electric voltage in operation from the circuit breaker (12) to the rail system (15), including a branch (18) leading to a rail (15) of the rail system, separately for each phase of the switching installation (5). Furthermore, inside the electrically insulating barrier (10) the switching installation may be provided with field-control means and/or voltage-sealing means (22, 25, 37).

Abstract: A system for maintaining an IC-chip near a set-point temperature while electrical power dissipation in the IC-chip is varied includes a container having an open end with a seal ring. Located in the container is at least one nozzle for spraying liquid coolant droplets on a portion of an IC-module which holds the IC-chip. This spraying of the liquid coolant occurs while the seal ring is pressed against the IC-module. Also, a pressure reducing means is coupled to the container for producing a sub-atmospheric pressure in the space between the container and the IC-module while the seal ring is pressed against the IC-module.

Abstract: A modularized redundant heat sink for dissipating heat generated from chips includes an independent rectangular fin whose sides are provided with at least more than two elastic pins, and which is provided with a bottom surface for conducting temperature; a circuit board on which are welded with at least more than two chips having upper surfaces. A bottom surface of the fin is attached to the upper surfaces of at least more than two chips through a heat conducting glue, so as to provide a temperature conducting and heat dissipating to at least more than two chips by one fin.

Abstract: An electrical assembly comprising plurality of heat producing devices in direct thermal contact with perforated heat pipe film. Direct benefits of this invention for circuit board packages are weight reduction, volume reduction, increase of allowable heat dissipation.

Abstract: An apparatus (10) for performance testing of heat dissipating modules (19) includes an enclosure (11) configured for receiving the heat dissipating module therein, a vertically movable platform (13) for supporting the enclosure thereon, a boosting mechanism (18) configured for raising the vertically movable platform, and a force gage (12) having a force-sensing portion (121) configured for abutting against a top of the heat dissipating module. The enclosure includes a mounting base (110) having a plurality of mounting holes (1101) defined therein configured for mounting of heat dissipating modules with various sizes thereon. The present heat dissipating module testing apparatus can fit heat dissipating modules with various sizes. Thus saving both cost and time in testing.

Abstract: An inverter assembly including a storage compartment for multiple cables adapted to be releasably connected to the inverter. A body of the inverter assembly includes interior and exterior fins for the dissipation of heat energy.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: A speaker module is disposed on the top casing and includes at least one first vent. A printed circuit board is disposed between the top casing and the bottom casing and includes at least one second vent corresponding to the first vent.

Abstract: A heat sink for dissipating heat from an electronic device includes a base for contacting the electronic device. A U-shaped heat pipe is fixed to the base and includes an evaporating portion contacting the base and two condensing portion extending from opposite ends of the evaporating portion and through a plurality of first fins stacked together parallel to each other. A plurality of second fins extends from the base towards the first fins and supports the first fins. A reinforcement is fixed on the base and joins with some of the first fins, thereby enhancing integrity of the first fins.