Abstract: An apparatus includes a server cabinet configured to receive a plurality of servers therein, and a single heat dissipation device mounted on the server cabinet and positioned outside of the plurality of servers. The heat dissipation device includes a plurality of fans, and each of the plurality of fans is configured to dissipate heat generated in the overall server cabinet.

Abstract: An evaporator having an enhanced flow channel design for use in a computer system is described. Specifically, micro-channels of the evaporator comprise nucleation sites and different channel widths. The enhanced flow channel design improves heat transfer from a computer component to a working fluid.

Abstract: An adjustable heat sink shroud includes an insert that may be included within the interior of the heat sink shroud depending on the size of the heat sink enclosed within the shroud. The presence of the insert directs the flow of air through the heat sink.

Abstract: A method and an assembly of the invention are intended for connecting two parts via a spacer made from a heat-shrinkable material shrinkable only in one direction. The spacer is sandwiched between the parts and attached to both parts with such orientation that direction of the shrinkage of the spacer coincides with the direction of movement of both parts towards each other. After the parts and the spacer are interconnected, the spacer is heated for causing said parts to move closer to each other. The space between the parts can be filled with an adhesive material so that the parts will be held together without the use of clamps or binding bands while the adhesive is cured. Another application is to attach a heatsink to an electronic device supported by a PC board. Shrinkage of the spacer under effect of heating brings the electronic device into a tight heat-transferring contact with the heatsink and maintains this contact irreversibly.

Abstract: A heat dissipation device (40) includes at least a heat pipe (45) and a plurality of metal fins (43) thermally connected to the heat pipe. Each of the metal fins defines therein an aperture (431). An extension flange (433) extends outwardly from the metal fin and surrounds the aperture. The extension flange defines therein a plurality of slits (435). The apertures and extension flanges of the metal fins are aligned together. The heat pipe is received in the aligned apertures and soldered by a thermal medium material to the metal fins via the aligned extension flanges. During the soldering process, rosin content contained in the thermal medium material can be discharged away via the slits formed in the extension flange.

Abstract: Embodiments of the present invention include an apparatus, method and system for a thermal management arrangement in a standardized peripheral device.

Abstract: A heat sink operatively connected to an integrated circuit is configured to generate a magnetic field. Fluid flow toward and away from a hot spot of the integrated circuit is dependent on the magnetic field and an induced electrical current. A temperature sensor is used to take temperature measurements of the hot spot. A value of the induced electrical current is adjusted dependent on one or more temperature measurements taken by the temperature sensor.

Abstract: A housing for power semiconductor modules with a base plate or for direct mounting on a heat sink. The housing (10) surrounds an electrically insulating substrate (40) with metal connection tracks (41) disposed thereon. The metal connection tracks are insulated from one another and have power semiconductor components (50) disposed on them. The housing has a cap (14) and at least one framelike housing part (12) forming the side walls thereof. This housing part (12) includes a main frame (120) and at least one locking frame (130). The main frame (120) has guides (122, 128) for receiving connection elements (30, 32). The locking frame (130) is disposed relative to the main frame (120) such that it rests at least in part on the connection tabs (310, 320) of the connection elements (30, 32), in order to prevent movemnt of the connection elements toward the substrate (40).

Abstract: An electronic device with uniform heat-dissipation is disclosed. The electronic device comprises a housing, a circuit board, and a metal shielding. The housing has concavities at inner sides thereof, and the circuit board is disposed within the housing. The metal shielding is disposed between the housing and the circuit board and has protrusions at outer sides thereof to match up the concavities of the housing. Thereby, the metal shielding substantially stays close to the housing for allowing the electronic device to dissipate heat uniformly.

Abstract: A ductwork assembly can be used with an electronic device wherein the electronic device includes a fan and the ductwork assembly is configured to receive a heat transfer fluid from the fan. A disperser lies within the ductwork assembly and is attached thereto in order to affect at least a portion of a flow of the heat transfer fluid. The ductwork assembly may also include a first channel and the first channel is characterized by a first average fluid velocity that is a highest average fluid velocity of all channels within the ductwork assembly. The ductwork assembly may include a second channel that is characterized by a second average fluid velocity that is a lowest average fluid velocity of all channels within the ductwork assembly. The second averaged fluid velocity may be no less than 90% of the first averaged fluid velocity.

Abstract: A high voltage switching apparatus delivers kV pulses to a load such as a magnetron. The switching apparatus comprises a switching stack surrounded by capacitors and both arranged within a housing. Lt power is supplied to the stack, e.g. for control electronics, by magnetic coupling across a non-conducting wall of the housing. Annular inserts are arranged on either side of the wall. Each insert receives a transformer core and winding. The bottom surfaces of the inserts carry a conductive coating to minimise electric stresses. Ht power is also supplied through the wall.

Abstract: A package unit to be mounted on an external printed board includes a package board mounted with an exoergic circuit element, a heat spreader that transmits heat from the exoergic circuit element to a heat sink that radiates the heat, a joining member that seals between the exoergic circuit element and the heat spreader, and forms a sealing space in cooperation with the exoergic circuit element and the heat spreader, and a liquid metal sealed in the sealing space.

Abstract: Embodiments of the present invention include an apparatus, method, and system for a thermal management arrangement having a low heat flux channel flow coupled to high heat flux channels.

Abstract: A heat dissipating device for cooling a number of electronic devices, includes a heat sink assembly (10) and a fan (20) mounted to a side of the heat sink assembly. The heat sink assembly includes a heat spreader (12), a plurality of fins (14), and heat pipes thermally connecting the heat spreader and the fins. The fins form a plurality of channels (140) therebetween, and include a guiding fin (15). The guiding fin includes a body (150) spaced from the heat spreader and an inclined sidewall (152) bent from the body. An airflow generated by the fan has a portion flowing through the channels of the fins and another portion flowing between the body and the heat spreader for blowing a second heat generating electronic device by guiding of the sidewall of the guiding fin.

Abstract: The present invention provides a method for producing an electronic assembly and an electronic assembly with an integrated cooling system for dissipating heat. The electronic assembly comprises a base; and at least one electrical component attached to the base. The base defines an integrated cooling system having a fluid channel spanning within the base and at least one heat exchanger in heat communication with the fluid channel. The integrated cooling system may further include a pump attached to the base for directing the flow of the fluid within the fluid channel, and a port in fluid communication with the fluid channel for receiving fluid from an external source.

Abstract: An apparatus for securing a modular component comprises a jointed cam arm including a first portion and a second portion pivotally connected to the first portion. A flexible member is included on the first portion. A pivot limiting catch is included on the second portion, the catch being operable to engage with the flexible member to position the first portion at an angle relative to the second portion. In response to a force applied to the first portion sufficient to flex the flexible member, the first portion is pivotable to reduce the relative angle with the second portion.

Abstract: A device may include an integrated circuit chip and channels to carry a coolant. The channels may be proximate to an upper surface of the integrated circuit chip, and the channels may extend along a length of the integrated circuit chip. A density of the channels may change across the length of the integrated circuit chip.

Abstract: In one embodiment, the invention is a method and apparatus for recycling exhaust air expelled from a computer server (e.g., a unit including microprocessors such as a standard server or a mainframe). In one embodiment, at least one windmill (e.g., a standard windmill or a wind turbine) is driven by the exhaust air from at least one server unit, and the at least one windmill in turn drives a generator. Therefore, energy previously wasted in the form of exhaust is harnessed and reused to provide power to the server system. The method and apparatus also reduce the demand placed on ventilation systems needed to cool server environments, further reducing the amount of energy consumed and/or wasted in the operation of a server system. In one embodiment, the electric power from the generator unit is either recycled into the power grid. In another embodiment, the recycled air is used to charge batteries that might be available as power standby units.

Abstract: Structures and methods for holding heat sinks in contact with electronic devices are described herein. In one embodiment, an assembly for holding a heat sink in contact with an electronic device includes a coil spring in transverse compression. When transversely compressed, the coil spring presses the heat sink against the electronic device with a uniform, or at least approximately uniform, pressure that enables the heat sink to efficiently conduct heat away from the electronic device without damaging the device.

Abstract: A removable cooler on the memory module wherein the PC board is able to attach on the memory module without any modification. The cooler contains a heat sink module and a cooler module. The heat sink module is combined by two heat conductive heat sinks placed oppositely and screwed or tenoned on the memory module to stimulate heat exchange above the extension part of the heat sinks. The cooler module could be a fan or heat conductive tube. As a fan, it could be buckled on the memory module socket for the extension part of the heat sinks to stimulate heat exchange. As a heat conduction tube screwed or tenoned against the extension part of the heat sinks, it stimulates heat exchange and provides heat dispensation function to assure the performance of the memory module.