Patents Examined by Michael Datskovsky
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Patent number: 6778392Abstract: A heat dissipation device is employed to lower the temperature of an electronic component. The dissipation device has a first blower, a second blower, and three heat dissipation fins. The first heat dissipation fin connected to the electronic component via a heat pipe is cooled by the first blower. The second heat, dissipation fin connected to the electronic component via a heat pipe is cooled by the second blower. The third heat dissipation fin closely connected to the electronic component is cooled by the first and second blower serially.Type: GrantFiled: January 15, 2003Date of Patent: August 17, 2004Assignee: Arima Computer CorporationInventor: Ing-Jer Chiou
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Patent number: 6778396Abstract: A retaining device for attaching a heat sink (2) to a CPU (3) mounted on a circuit board (4). The retaining device includes a pair of clips (1), a backplate (6), and four pins (5). Each clip includes a central pressing portion (10), two resilient portions (12) adjacent the pressing portion, two shoulders (13) adjacent the resilient portions, and two arms (17). Each shoulder defines first and second cutouts (14a, 14b). Each pin forms a blocking head (50), and a bottom blocking stop (58). The pins are extended through the backplate, the circuit board and the heat sink. The heads are initially received through the first cutouts, and then engaged on the shoulders at the second cutouts. The heads press downwardly on the clips, and the stops press upwardly on the backplate. Thus, the clips and the backplate firmly sandwich the heat sink, the CPU and the circuit board therebetween.Type: GrantFiled: December 16, 2002Date of Patent: August 17, 2004Assignee: Hon Hai Precision Ind. Co., LTDInventor: HeBen Liu
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Patent number: 6775134Abstract: A heat dissipation system includes an enclosure (10), a motherboard (30), a CPU module, a plurality of first system fan (80) and a second fan (90). The enclosure includes a first panel (12), a second panel (14) perpendicular to the first panel and a third panel (16) parallel to the first panel. A plurality of air inlets (18) is defined in the third panel. The motherboard is mounted inside the enclosure parallel to but opposite from the second panel. The CPU module is secured to the motherboard. The first fan is secured to the first panel for expelling air inside the enclosure to an outside of the enclosure. The second fan is secured to the second panel for causing air entering the enclosure via the air inlets to be directed generally toward the CPU module.Type: GrantFiled: December 20, 2002Date of Patent: August 10, 2004Assignee: Hon Hai Precision Ind. Co., Ltd.Inventor: Yun Lung Chen
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Patent number: 6775131Abstract: A sealing mechanism for a customer replaceable unit (CRU) within a computer system is provided. The sealing mechanism comprises a faceplate for the CRU, wherein insertion and extraction latches are recessed into a trench within that faceplate. The backside of the faceplate has a protruding rim around the perimeter. The rim engages a groove in the subsystem enclosure, which surrounds the aperture that the CRU engages. Since the faceplate incorporates a perimeter ridge and a trench structure, the interacting groove follows the contour of the trench. Thus the rim and groove both trace the faceplate trench around the faceplate. The groove in the subsystem enclosure has an entrenched section at both ends of the receptacle perimeter that accommodate sections of the faceplate rim that trace the trench in the faceplate.Type: GrantFiled: November 21, 2002Date of Patent: August 10, 2004Assignee: LSI Logic CorporationInventor: George E. Hanson
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Patent number: 6775139Abstract: A removable cooler on the memory module wherein the PC board is able to attach on the memory module without any modification. The cooler contains a heat sink module and a cooler module. The heat sink module is combined by two heat conductive heat sinks placed oppositely and screwed or tenoned on the memory module to stimulate heat exchange above the extension part of the heat sinks. The cooler module could be a fan or heat conductive tube. As a fan, it could be buckled on the memory module socket for the extension part of the heat sinks to stimulate heat exchange. As a heat conduction tube screwed or tenoned against the extension part of the heat sinks, it stimulates heat exchange and provides heat dispensation function to assure the performance of the memory module.Type: GrantFiled: January 8, 2003Date of Patent: August 10, 2004Assignee: Ma Laboratories, Inc.Inventor: Paul Hsueh
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Patent number: 6775137Abstract: An enclosure apparatus provides for combined air and liquid cooling of rack mounted stacked electronic components. A heat exchanger is mounted on the side of the stacked electronics and air flows side to side within the enclosure, impelled by air-moving devices mounted behind the electronics. Auxiliary air-moving devices may be mounted within the enclosure to increase the air flow. In an alternative embodiment, air-to-liquid heat exchangers are provided across the front and back of the enclosure, and a closed air flow loop is created by a converging supply plenum, electronics drawers through which air is directed by air-moving devices, diverging return plenum, and a connecting duct in the bottom. In a variant of this embodiment, connecting ducts are in both top and bottom, and supply and return ducts are doubly convergent and doubly divergent, respectively. Auxiliary blowers may be added to increase total system air flow.Type: GrantFiled: November 25, 2002Date of Patent: August 10, 2004Assignee: International Business Machines CorporationInventors: Richard C. Chu, Michael J. Ellsworth, Jr., Edward Furey, Roger R. Schmidt, Robert E. Simons
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Patent number: 6771503Abstract: The port for a removable module of a set-top box in a cable television system incorporates guide members of a thermally conductive material to provide a new primary heat dissipation path to manage thermal energy generated by operation of the module. The guide members may also be used to guide the module into proper connection with a module connector which electrically connects the circuit on the module with the circuitry of the set-top box. The guide members may be attached to the chassis of the set-top box or integrally formed in the chassis. Thus, heat from the module is provide directly to the chassis of the set-top box from which it is released by convention into the ambient environment.Type: GrantFiled: July 26, 2002Date of Patent: August 3, 2004Assignee: General Instrument CorporationInventors: Steven Kimball, Shiomo Ovadia, William J. Storti, Keith Sibley, Barry Falvo, Charles Herrmann
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Patent number: 6771492Abstract: An electronic device, such as a portable computer, incorporates a removable cover. The cover is readily removed without tools and provides access to a variety of components that may require servicing, substitution, component upgrades, etc. The component cover utilizes a variety of retention features that provide stability while permitting easy attachment and opening of the cover.Type: GrantFiled: August 14, 2001Date of Patent: August 3, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: Ronald E. DeLuga, David A. Hulsebosch, Michele Bovio
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Patent number: 6768634Abstract: The present invention provides a combined system of mirror and mobile computer or communication device. In one embodiment of the invention, a portable computer comprises a top unit comprising a visual display and a base unit comprising a plurality of key buttons, a mouse, and other peripheral devices. The base unit is coupled to the top unit, and the top unit has a mirror attached to its exterior surface. The top unit may comprise a recess area or pocket on its exterior surface to hold a mirror in place and may comprise a cover or lid to protect the mirror. The mirror may be also disengageably attached to the top unit of the computer using a detachable mechanism. In another embodiment of the invention, the mirror is installed on the base unit of the portable computer so that the mirror is exposed and available for use when a user opens the computer, and covered when the user closes the computer.Type: GrantFiled: December 27, 2002Date of Patent: July 27, 2004Inventor: Kwangjun Kim
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Patent number: 6765796Abstract: A cover attaches to a circuit board and has an inlet at one side for receiving forced air and plurality of openings on its top surface through which heat sinks mounted on the circuit board partially extend. Air is made to flow into the inlet and out the exhaust openings, thereby concentrating airflow in the vicinity of the circuit board's heat dissipative components.Type: GrantFiled: November 21, 2002Date of Patent: July 20, 2004Assignee: Teradyne, Inc.Inventors: Mark S. Hoffman, David C. Drahms
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Patent number: 6765791Abstract: A front input/output module is provided. The front input/output module, as disclosed in this invention, is adapted to a computer, provided with a chassis and a motherboard. The front input/output module comprises a tray, a printed circuit board and at least one interface device. The tray is detachably disposed inside the chassis. The printed circuit board is disposed on the tray and electrically connected with the motherboard. The interface device, having a connector, is disposed on the tray and electrically connected with the printed circuit board. The connector is exposed when the tray is disposed inside the chassis.Type: GrantFiled: May 10, 2002Date of Patent: July 20, 2004Assignees: Wistron Corporation, Acer IncorporatedInventors: Harold Syring, Alan Kyle
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Patent number: 6762928Abstract: An automatic lifting apparatus for a liquid crystal display module of notebook computers is described. The automatic lifting apparatus comprises a latch hook, a latch button, a latch spring, a lifting plate, at least one lifting spring, and a housing. The latch hook fixes on a liquid crystal display module of the notebook computer. The others parts are positioned inside a base of the notebook computer for locking the latch hook. Furthermore, the lifting plate with the lifting spring power pushes the latch hook moving upward until the latch hook reaches about the height of the latch hook. Therefore, the automatic lifting apparatus can open the liquid crystal display module more efficiently and easily.Type: GrantFiled: August 19, 2002Date of Patent: July 13, 2004Assignee: Quanta Computer Inc.Inventor: Chao-Yuan Lo
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Patent number: 6762939Abstract: A bottom heat dissipating device may be attached to a bottom surface of a printed circuit board (PCB). A top surface of the bottom heat dissipating device may be thermally coupled with a backside surface of one or more electronic components mounted on the bottom surface of the PCB. A top heat dissipating device may be attached to a top surface of the PCB. The top heat dissipating device may be thermally coupled with the bottom heat dissipating device through a thermally conductive coupling member to provide a conductive path for heat transfer from the bottom heat dissipating device to the top heat dissipating device. An opening adjacent to an edge of the thermally conductive coupling member may allow air flow between the top and bottom heat dissipating devices. The PCB may be part of a mezzanine card, such as a Peripheral Component Interconnect (PCI) mezzanine card (PMC).Type: GrantFiled: February 20, 2002Date of Patent: July 13, 2004Assignee: Intel CorporationInventors: Mark D. Summers, JavĂer Leija
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Patent number: 6757157Abstract: A folding electronic device comprising a first part and a second part arranged to turn with respect to the first part. The first part comprises data input means and the second part comprises a display unit. The parts can be turned with respect to each other into a folded position and an open position. In the folded position, the data input means and the display unit are on different, outer sides of the device and at least some of the data input means are arranged to operate as a pointing device of the display.Type: GrantFiled: March 29, 2002Date of Patent: June 29, 2004Assignee: Nokia CorporationInventors: Arto Lammintaus, Pekka Pihlaja
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Patent number: 6751091Abstract: A modular housing device includes a modular housing having a first side and a second side, at least one component disposed with said modular housing. The modular housing device further includes a bracket disposed on the second side.Type: GrantFiled: September 6, 2002Date of Patent: June 15, 2004Assignee: Circadiant Systems, Inc.Inventors: Rajesh Dighde, William Joseph Thompson
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Patent number: 6751095Abstract: A cooling unit for cooling a heat generating component includes a heat receiving portion thermally connected to the heat generating component and a heat radiating portion including first and second radiating members having thermal conductivity. The first and second radiating members are overlaid on each other and define a path for allowing a cooling medium heated by the heat generating component to flow through the path. A pump circulates the cooling medium between the heat receiving portion and the heat radiating portion.Type: GrantFiled: November 20, 2002Date of Patent: June 15, 2004Assignee: Kabushiki Kaisha ToshibaInventors: Kenichi Ishikawa, Katsumi Hisano
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Patent number: 6751089Abstract: A keyboard securing device secures a keyboard module to an opening defined in a top wall of a casing of a notebook computer. The securing device includes a resilient body from which first and second tabs extend. The first tab is attached to an underside of the top wall of the casing. The second tab extends through a slot defined in a side wall that defines the opening into the opening for engaging an edge of the keyboard module and thus securing the keyboard. A retainer is fixed in the casing and supports the resilient body of the securing device thereon. First and second flanges extend from the retainer. The first flange is fixed to the casing. The second flange is positioned on and supported by a bottom wall of the casing for movably and at least partially supporting the second tab thereon whereby the securing device is retained in position against a downward force for mounting the keyboard into the opening.Type: GrantFiled: September 20, 2002Date of Patent: June 15, 2004Assignee: Taiwan TriGem Information Co., Ltd.Inventor: Hiu-Lan Hsieh
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Patent number: 6751098Abstract: A heat sink system and method for a radiographic sensor device includes a heat sink formed of a first material possessing a predetermined thermal conductivity. The heat sink system further includes a thermal channel device formed of a second material possessing a predetermined thermal conductivity. The thermal channel device includes at least one contact portion adapted to contact the radiographic sensor device and an extending member that extends away from the at least one contact portion and contacts the heat sink. The thermal channel device is designed to extend between and substantially contact the heat sink and the radiographic sensor device when the heat sink system is assembled. The thermal channel device conducts heat from the radiographic sensor device to the heat sink.Type: GrantFiled: November 8, 2001Date of Patent: June 15, 2004Assignee: Siemens Medical Solutions USA, Inc.Inventors: George W. Dailey, James F. Caruba
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Patent number: 6744631Abstract: A heat dissipating device includes a housing and a fan unit. The housing has a top wall, a bottom wall opposite to the top wall, and a lateral wall that interconnects the top and bottom walls. Each of the top, bottom and lateral walls is formed with at least one vent hole therethrough. The fan unit is mounted in the housing for circulating air within the housing. The fan unit is operable so as to allow cool air to flow into and heated air to flow out of the housing through the vent holes in the top, bottom and lateral walls.Type: GrantFiled: December 31, 2002Date of Patent: June 1, 2004Assignee: Compal Electronics, Inc.Inventors: Wei-Pin Chuang, Chih-Chuan Cheng
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Patent number: 6744628Abstract: A multi-directional power distribution unit (PDU) provides flexibility in the configuration of a computer system, disk drive array or other enclosure. The power distribution unit may be installed in one orientation for a power feed having a first configuration (e.g., from the front of the enclosure), and may be installed in a second orientation for a power feed in a second configuration (e.g., from the rear of the enclosure). In either orientation, a set of external power connectors couples to one or more external power feeds. Depending on the orientation, either a first or second internal connector will interface with the system or enclosure (e.g., a midplane, a power supply). The PDU may include circuitry for filtering electrical power and may also include a heat sink.Type: GrantFiled: February 15, 2002Date of Patent: June 1, 2004Assignee: Sun Microsytems, Inc.Inventor: Timothy W. Olesiewicz