Abstract: A method for providing a vertical optical via for a semiconductor substrate is described. The semiconductor substrate has a front surface and a back side. A hard mask having an aperture therein is formed on the front surface. Part of the semiconductor substrate exposed by the aperture is removed to form a via hole. The via hole has a width not exceeding one hundred micrometers and a bottom. Cladding layer(s) and core layer(s) are provided in the via hole. The core layer(s) have at least a second index of refraction greater than that of the core layer(s). A portion of the semiconductor substrate including the back side is removed to expose a bottom portion of the core layer(s) and a bottom surface of the semiconductor substrate. The vertical optical via includes the cladding and core layers. The vertical optical via extends from the front surface to the bottom surface.

Abstract: An apparatus and system that includes a plurality of data devices, a network module, and a chassis. The network module may include an interface defining couplings and channels extending between the couplings defining a network topology for interconnecting data devices. The chassis may be configured to receive data devices and the network module to operably couple the received data devices via the interconnect topology defined by the network module.

Abstract: A method is described for selecting fibers meeting requirements of a second minimum bandwidth at a second wavelength based on differential mode delay data measured at a first wavelength different from the second wavelength.

Abstract: Aspects of the subject disclosure may include, a system for receiving first optical power signals via an optical fiber connected with a light source of a network device, converting the first optical power signals to electrical energy utilizing an optical power converter where the electrical energy is utilized as power by the system, and transmitting or receiving electromagnetic waves that propagate along a transmission medium without requiring an electrical return path, and wherein the electromagnetic waves convey data. Other embodiments are disclosed.

Abstract: A photoelectric adapter includes a power sourcing equipment (PSE) device, an optical connector connection part and an electrical connector. The electrical connector is connectable to an electrical connector connection part of an electrical device. The PSE device includes a semiconductor laser that oscillates with electric power, thereby outputting feed light. The PSE device is driven by receiving the electric power supplied from the electrical device through the electrical connector, and outputs the feed light from the optical connector connection part. Another photoelectric adapter includes a powered device, an optical connector connection part and an electrical connector. The powered device includes a photoelectric conversion element that converts feed light into electric power. The powered device receives the feed light supplied through the optical connector connection part, converts the feed light into the electric power, and outputs the electric power from the electrical connector.

Abstract: An optical fiber distribution element (1810) includes a chassis (1820), an optical device (1900) mounted to the chassis (1820), the optical device (1900) including a plurality of cables (2134) extending from the optical device (1900) into the chassis (1820), and a cable management device (2110/2210) mounted to the chassis (1820).

Abstract: Optical fiber connector assembly for a fiber optic cable comprising an optical fiber having an end portion terminated with a ferrule and rod members (4). The optical fiber connector assembly comprises: a ferrule holder (110) configured to hold the end portion of the optical fiber (10), the ferrule (30) and the rod members (4); a connector (190) having an internal passageway for housing the ferrule holder (110); a locking member (180) extending lengthwise and having an internal passageway for the end portion of the fiber optic cable (1). There is also disclosed a pre-connectorized fiber optic cable comprising a fiber optic cable and the optical fiber connector assembly mounted upon an end portion of the fiber optic cable.

Abstract: Disclosed is an optical interconnection device that includes an alignment ferrule assembly formed from an alignment substrate and optical fibers. The optical interconnection device also has an alignment assembly formed by a planar support member with guide features. A receiving region resides between the guide features in which the alignment substrate is secured. An evanescent optical coupler can be formed using the optical interconnection device as a first device and another optical interconnection device as a second device. The second device is constituted by a planar lightwave circuit that operably supports waveguides and an adapter. The adapter of the second device is configured to engage the alignment assembly of the first device to place the optical fibers and the optical waveguides of the respective devices in evanescent optical communication.

Abstract: A pluggable optical connector is configured to be insertable into and removable from an optical communication apparatus, and to be capable of communicating a modulation signal and a data signal with the optical communication apparatus. A wavelength-tunable light source is configured to output an output light and a local oscillation light. An optical transmission unit is configured to output an optical signal generated by modulating the output light in response to the modulation signal. An optical reception unit is configured to demodulate an optical signal received by using the local oscillation light to the data signal. Pluggable optical receptors are configured in such a manner that an optical fiber is insertable into and removable from the pluggable optical receptors, and configured to be capable of outputting the optical signal to the optical fiber and transferring the optical signal received thorough the optical fiber to the optical reception unit.

Abstract: Example methods, devices, and systems for optical transmission are disclosed. An example method can comprise coupling a plurality of optical filters to a substrate. The method can comprise coupling a polymeric waveguide to the plurality of optical filters. The polymeric waveguide can be configured to guide a free space optical signal along the polymeric waveguide and communicate, via the plurality of optical filters, one or more components of the free optical space signal to an integrated chip.

Abstract: A photonic integrated circuit device includes a semiconductor substrate (e.g., wafer) having a chip region therein, which is bounded on at least one side thereof by a scribe line. The chip region includes an optical transmitter, an optical receiver and a test optical waveguide. This test optical waveguide is coupled to the optical transmitter and the optical receiver and overlaps the scribe line. During a substrate dicing operation, a portion of the test optical waveguide overlapping the scribe line is removed.

Abstract: Disclosed are image relay elements exhibiting transverse Anderson localization for light field and holographic energy sources. The relay elements may include a relay element body having one or more structures, where the structures can be coupled in series, in parallel and/or in stacked configurations. The structures may have multiple surfaces such that energy waves propagating therethrough the relay elements may experience spatial magnification or de-magnification.

Abstract: A method and system of co-packaging optoelectronics components or photonic integrated circuit (PIC) with application specific integrated circuits (ASICs) are disclosed and may include package substrate, several electronics die, passive components, socket assembly, and heat sinks. The said method converts ASIC high speed signals to optical signals by eliminating intermediary electrical interface between the ASIC and conventional optical modules. The method described provides many advantages of pluggable optical modules such as configurability, serviceability, and thermal isolation from the ASIC heat, while eliminating bandwidth bottlenecks as result of the ASIC package, host or linecard printed circuit board (PCB) traces, and the optical module connector. The high-power consumption ASIC is mounted below the package substrate, but sensitive optoelectronics and PIC components are mounted on top of the package substrate assembly for thermal isolation and serviceability.

Abstract: The disclosed embodiments generally relate to extruding multiple layers of micro- to nano-polymer layers in a tubular shape. In particular, the aspects of the disclosed embodiments are directed to a method for producing a Bragg reflector comprising co-extrusion of micro- to nano-polymer layers in a tubular shape.

Abstract: Aspects of the present disclosure describe improved supercontinuum generation based upon alternating optical dispersion along a waveguide length that advantageously generates much more spectral bandwidth than possible with conventional, prior art techniques without losing coherence as well as supporting a larger range of pulse energies (i.e., for lower than conventionally allowed pulse energies or high pulse energies).

Abstract: A method of connecting lengths of multicore optical fibers (MCFs) to one another. First and second lengths of a MCF whose cores are arranged in a certain pattern about the fiber axis to define pairs of cores are provided, and the cores of each pair of cores are disposed symmetrically with respect to a key plane that includes the axis of the fiber. Ends of the first and the second lengths of the MCF are arranged in axial alignment with one another, and the key plane at the end of the first length of the MCF is aligned with the key plane at the end of the second length of the MCF. Each defined pair of cores in the first length of the MCF is thereby positioned to mate with the same defined pair of cores in the second length of the MCF.

Abstract: An adaptor with a built-in shutter member for optical connector including a body, a shutter, and an elastic member is provided. The body has a receiving space. The shutter is movably assembled to the body to shield or expose the receiving space. An optical connector is suited for pushing away the shutter to enter the receiving space to be connected to the body. The shutter has a step structure such that a gap is maintained between the shutter and the optical connector. The elastic member is disposed in the body and located on a moving path of the shutter. The shutter deforms the elastic member when the optical connector pushes away the shutter, and the elastic member drives the shutter to be restored when the optical connector leaves the receiving space.

Abstract: A transceiver assembly for mounting on a mother board, said transceiver assembly comprising: (a) a frame defining a first plane configured for mounting parallel to said motherboard, said frame defining a plurality of slots perpendicular to said first plane; and (b) one or more opto-electric cards, each of said one or more opto-electric cards disposed in one of said plurality of slots and comprising at least, (i) a substrate having a first edge parallel to said first plane when said opto-electric card is mounted in said slot, (ii) an electrical interface along said first edge, (iii) and an interposer electrically connected to said electrical interface and comprising at least one optical component operatively connected to said electrical interface, and (iv) at least one optical fiber extending freely from said interposer.

Abstract: A two-fiber Quad Small Form-factor Pluggable electro-optical transceiver (QSFP) currently connects to two optical fibers, one for transmission and one for reception. In accordance with an embodiment of the disclosure, a three-port optical circulator may be employed in order to achieve bidirectional transmission (BiDi) on a single fiber. The disclosure provides in accordance with an embodiment of the disclosure a miniature optical circulator that clips onto the two-fiber QSFP without protruding from the QSFP extraction lever, and is configured to mate with the two QSFP fiber connectors on one side and a single optical fiber on the other. Another embodiment provides an integrated bidirectional QSFP that is configured to mate with a single bidirectional fiber.

Abstract: An optical fiber sensor includes a first single mode fiber, a second single mode fiber, and a multimode fiber positioned between, and coupled to, the first single mode fiber and the second single mode fiber. The multimode fiber includes a graded-index core with an outer diameter between about 35 ?m and about 45 ?m. A numerical aperture of the core is between about 0.15 and about 0.25. The multimode fiber includes a cladding with an outer diameter between about 70 ?m and about 90 ?m. A coupling strength of an LP01 mode of the first single mode fiber to each of an LP02 mode and an LP03 mode of the multimode fiber is at least about 0.25.