Abstract: One or more active components can be strand mounted within a cabinet that also has passive optical components. Certain types of strand mounts are slidable relative to the cabinet to enhance access to the components. Each component may be independently slidable.

Abstract: A system comprises an optical fiber, a manipulator assembly, and a control unit. The manipulator assembly comprises a chassis, an optical fiber cleaning assembly housed within the chassis, and a drive mechanism housed within the chassis. The optical fiber cleaning assembly comprises a cleaning tape, a first spool on which the cleaning tape is wound, and a second spool onto which the cleaning tape is drawn after use. The drive mechanism is configured to advance the cleaning tape from the first spool to the second spool such that a portion of the cleaning tape wipes a face of the optical fiber. The control unit is configured to control the drive mechanism to advance the cleaning tape.

Abstract: A fiber optic installation device is disclosed for easily and efficiently installing fiber into an existing conduit in order to provide telecommunication and other services. The installation device includes a housing having first and second entry points. A first tube is releasably coupled to the first entry point, and configured for receiving a fiber cable, and a second tube is releasably coupled to the second entry point, and configured for receiving and securing an existing conduit so that the fiber optic cable can be pushed through and installed into the conduit. The cable is driven through the device via a drive wheel that is coupled to a drive shaft being driven by a standard electric drill. To prevent slippage of the cable, a pincher wheel is adjusted up or down via a knob to ensure the fiber optic cable remains in contact with the drive wheel throughout the installation process.

Abstract: An optical waveguide device includes an optical waveguide substrate including a first cladding layer disposed on a support, a core layer disposed on the first cladding layer, and a second cladding layer selectively covering the core layer, and a silicon photonic chip including a silicon substrate and a silicon waveguide disposed on one side of the silicon substrate, wherein part or all of a thickness of one end of the silicon waveguide is embedded in the core layer exposed from the second cladding layer, wherein a thickness of the core layer in a place covered with the silicon substrate is less than that of the core layer in a place not covered with the silicon substrate, and wherein a width of the core layer at a point of contact with the silicon substrate is wider than that of the core layer in a place covered with the second cladding layer.

Abstract: Described herein are techniques for intra-chip communication within tiled photonic interposers. A photonic interposer may rely on a combination of photonic lanes and electric lanes. For example, a photonic interposer may comprise a photonic integrated circuit (PIC) lithographically patterned with an array of photonic tiles, each photonic tile comprising an on-chip communication unit. The array of photonic tiles is arranged in rows and columns. A plurality of electric lanes place the on-chip communication units of photonic tiles of different rows in electrical communication with one another. A plurality of photonic lanes place the on-chip communication units of photonic tiles of different columns in optical communication with one another.

Abstract: An electro-optic device comprising a waveguide (WG)-device configured as an electro-absorption modulator (EAM) and electronics comprising an EAM driver. The electro-optic device comprising: a semi-insulating (SI) indium phosphide (InP) substrate; an epitaxial layer stack formed on the SI:InP substrate comprising a first plurality of semiconductor layers forming InP heterojunction bipolar transistors of the electronics and a second plurality of semiconductor layers structured to form a PIN waveguide of the EAM, the PIN waveguide comprising: an n-layer structure and a p-layer structure; an i-region comprising optical material located between the n-layer structure and the p-layer structure; the n-layer structure and the p-layer structure configured to optical confine one or more modes of an optical signal configured to propagate through the i-region; and at least one of the n-layer structure and the p-layer structure comprises a mode extending layer.

Abstract: Structures for a co-packaged photonics chip and electronic chip, and associated methods. The structure comprises a layer comprising a molding compound, an electronic chip and a photonics chip affixed in the layer, and a waveguiding structure including a waveguide core adjacent to the photonics chip. The photonics chip includes an optical coupler, the waveguide core includes a portion that overlaps with the optical coupler, and the waveguide core comprises a polymer.

Abstract: Photonic device, system and methods of making photonic devices and systems, the method including: providing a substrate, forming an insulator layer over the substrate, depositing a plurality of waveguide layers and a plurality of insulator spacers at different vertical levels over the insulator layer, wherein adjacent waveguide layers in the plurality of waveguide layers are isolated by one or more insulator spacers in the plurality of insulator spacers, and forming a plurality of waveguide patterns at the plurality of waveguide layers, wherein at least two waveguide patterns at different vertical levels in the plurality of waveguide patterns are coupled.

Abstract: Provided herein is a photonic modulator and methods for controlling a photonic modulator that can control the phase and/or amplitude of photons being transmitted through the modulator to minimize photonic loss while remaining power efficient and operating at high speeds. The photonic modulator can include a substrate with a pair of piezoelectric cantilevers spaced apart from one another by a gap, with a photonic waveguide disposed in the substrate that extends across the modulator and bridges the gap between the piezoelectric cantilevers. In one or more examples, the piezoelectric cantilevers can be configured to move away from the substrate in response to an electrical signal, such that a refractive index of the photonic waveguide is altered.

Abstract: An optical coupling structure for an optoelectronic integrated circuit includes a first connector and an optical fiber device. The first connector is disposed on the optoelectronic integrated circuit and includes a base including a lower surface and a front end, and a waveguide device assembled in the base and including a first surface, a first guide surface adjoining the first surface and located at the front end, and a plurality of optical waveguide paths extend to the first guide surface. The optical fiber device includes a second connector including a connecting surface and detachably connected to the first connector such that the connecting surface and the first guide surface directly face each other.

Abstract: In general, the present disclosure relates to a cable protection assembly for use on distribution cabinets and the corresponding methods of assembling the cable protection assembly onto the distribution cabinets.

Abstract: An electro-optical device includes a waveguide and a first electrode and a second electrode. The first electrode and the second electrode at first and second sides of the waveguide, wherein the first electrode and the second electrode directly contact and extend beyond the first and second sides of the waveguide respectively.

Abstract: A method includes connecting a first photonic package to a substrate, wherein the first photonic package includes a first waveguide and a first support over the first waveguide; connecting a second photonic package to the substrate adjacent the first photonic package, wherein the second photonic package includes a second waveguide, wherein the first photonic package and the second photonic package are laterally separated by a gap that has a width in the range of 15 ?m to 190 ?m; depositing a first quantity of an optical adhesive into the gap; and curing the first quantity of the optical adhesive, wherein after curing the first quantity of the optical adhesive, the first waveguide is optically coupled to the second waveguide through the first quantity of the optical adhesive.

Abstract: An optical system includes a substrate and, being formed on the substrate, a reflective structure including a first inner reflection face with a parabolic profile, a second inner planar reflection face and a third inner planar reflection face, a photoelectric transducer including an active region configured to emit light waves or configured to receive light waves and positioned in the reflective structure, at a part of the foci, the material of the reflective structure being chosen to be transparent to the light waves, a waveguide arranged so that its longitudinal axis is parallel to the optical axes and its proximal end is adjoining the reflective structure between the second and third reflection faces and at the active region.

Abstract: To install a connectorized cable assembly, a cable terminated at a connector core is pushed through a duct. The connector core has a maximum outer diameter of no more than 5 mm to facilitate passage of the connector core through the duct. A plug body is mounted over the connector core after the connector core exits the duct. No intermediate assembly steps are performed on the connector core between being pushed through the duct and being inserted into the plug body.

Abstract: The invention refers to a multifunctional self-sustained hosting apparatus for photonic integrated circuit and/or related chipset system packaging comprising a processed wafer (1); and at least a cavity (2), wherein said cavity (2) is configured to receive a chipset or an optical lens; and at least a V-groove (3), which is configured for receiving at least an in/out optical fiber and optically align said optical fiber with an optical endface of a chipset. The invention also refers to a bidirectional optical sub assembly based on photonic integrated circuit, which comprises said hosting apparatus. The hosting apparatus enables PIC&IC co-packaging allowing to answer current and future requirements in diverse PIC applications.

Abstract: Proposed is a device for switching an optical signal, the device including a first waveguide constituting an input port and a first output port; and a second waveguide constituting a second output port, wherein the first waveguide is formed of a first material, wherein the second waveguide is formed of the first material and contains a second material, wherein a gap between the first and second waveguides has a first value in a first section, a gap therebetween has a value increasing from the first value to a second value in a second section, and a gap therebetween has a third value in a third section, wherein at least one portion of the first section and at least one portion of the second section overlap in the one section, and wherein a grating structure applies to the first and second waveguides in at least one portion of the first section.

Abstract: A locking ring for assembly onto a cable closure includes a locking ring includes at least two ring sections, with each ring section having at least one locking structure; and a lever that couples with the at least two ring sections. The lever includes at least one locking rib disposed therein, and the at least one locking rib is configured to engage and disengage from the at least one locking structure such that the lever moves from a closed position in which proximal ends of each ring section are substantially adjacent to an open position in which proximal ends of each ring section are separate.

Abstract: An optical connector for terminating a cable containing one or more multicore fibers. The connector has a plug housing, a ferrule disposed inside the housing, a rotatable frame, and a multicore fiber (MCF) stub having a length of a first MCF a portion of which is fixed inside the ferrule so that a first endface of the fiber is exposed at the front end of the ferrule. An opposite endface of the first MCF is cleaved for fusion splicing to a second MCF in the cable to be terminated. The ferrule also has a flange, and the frame is formed to engage the flange for rotation so that cores in the first MCF can be aligned and positioned in a prescribed orientation relative to the plug housing, and cores in the second MCF can be aligned with corresponding cores in the first MCF when the first and the second MCFs are fusion spliced to one another.

Abstract: An optical module includes a substrate, an optical element, and an optical coupling module. The substrate includes a glass cloth constituted of glass threads serving as weft and warp. An outer edge of the substrate has a rectangular shape defined by a pair of first side surfaces in a predetermined direction and a pair of second side surfaces in a direction orthogonal to the predetermined direction. The weft is inclined with respect to the first side surfaces and the second side surfaces. The warp is inclined with respect to the first side surfaces and the second side surfaces. A cavity is formed in the substrate. At least a part of the optical coupling module is accommodated in the cavity. A side surface of the cavity includes an inclined region inclined with respect to an extension direction of the weft and an extension direction of the warp.