Abstract: Thermally compensated waveguides are disclosed herein. According to one aspect, the present disclosure proposes new ways to combine negative TOC (NTOC) material layers within the waveguides. NTOC materials can be implemented in one or more of a cladding layer, a core rib/channel waveguide, a horizontally segmented waveguide, a vertically segmented waveguide, a sub-wavelength grating structure, and/or in various other waveguide structure implementations including arbitrary core or cladding shapes. The integration of NTOC materials improves the temperature dependence of the waveguide spectrum. The need for fast and efficient optical-based technologies is increasing as Internet data traffic growth rate is overtaking voice traffic, pushing the need for optical communications.

Abstract: A fiber array unit (FAU) structure and the method for forming the same are provided. The FAU structure includes a FAU, a passive optical component structure, and a carrier board. The FAU includes a fiber holder holding optical fibers. The passive optical component structure includes a reflective layer and a lens layer. The reflective layer includes reflectors adjacent to the optical fibers. The lens layer includes silicon lenses adjacent to the reflectors. The carrier board is configured to support the FAU and the passive optical component structure. The FAU and the passive optical component structure are adjacent to each other. The lens layer is located between the reflective layer and the carrier board.

Abstract: A photoplethysmographic device has a monitor with a monitor connector and a patient cable. The patient cable has a patient cable connector, a cable, and a sensor. The monitor connector and the patient cable connector each have an electrical portion with two or more electrical connections and an optical portion with two or more optical connections. The monitor connector and the patient cable connector are removably couplable to each other. The optical connections of the optical portions of the monitor connector and the patient cable connector are physical contact connections. At least one of the optical portions of either the monitor connector or the patient cable connector is movably positioned within the associated monitor connector or patient cable connector.

Abstract: A device may include a first waveguide with an optical input at a first port. A device may include a second waveguide. A device may include a first coupler that optically couples the first waveguide to the second waveguide at a first position. A device may include a waveguide delay arm. A device may include a second coupler that optically couples the first waveguide to the second waveguide at a second position, the second position different from the first position.

Abstract: A fiber optic beam splitter includes housing, a single first optical fiber and a pair of second optical fibers which meet and abut the single first optical fiber at inside the housing. An optical communication module includes a light-emitting diode (LED); a photodiode; and two such fiber optic beam splitters. In each beam splitter, a tip of a first of the pair of second optical fibers is connected outside of the housing to the LED, and a tip of a second of the pair of second optical fibers is connected outside of the housing to the photodiode; and a tip of the single first optical fiber which is outside of the housing, is in optical communication with an exterior of the module. An optical communication network includes two or more such optical communication modules. An irrigation system configured to support a field of crops includes such an optical communication network.

Abstract: The optical fiber sensing system includes: a host sensing device including a first optical sensor for receiving, from a first optical fiber, first light corresponding to first pulse light input into the first optical fiber and first signal light and outputting first data for the first optical fiber corresponding to the first light and second data included in the first signal light, and a first data communicator for outputting a data signal including the first data and second data; and a remote sensing device including a second optical sensor for receiving, from a second optical fiber, second light that corresponds to second pulse light input into the second optical fiber and outputting second data including sensing results for the second optical fiber corresponding to the second light, and a second data communicator for outputting, to the first optical fiber, first signal light including the second data.

Abstract: A sealing structure for an optoelectronic transceiver device includes a first casing, a second casing, and a sealing element. The optoelectronic transceiver device is arranged between the first casing and the second casing. At least a notch portion is arranged between peripheral portions of the first casing and the second casing. The sealing element includes at least a retaining block positioned in the notch portion and encompassing a part of an optical fiber assembly, which is included in the optoelectronic transceiver device and extends out of the notch portion.

Abstract: One or more active components can be strand mounted within a cabinet that also has passive optical components. Certain types of strand mounts are slidable relative to the cabinet to enhance access to the components. Each component may be independently slidable.

Abstract: A system comprises an optical fiber, a manipulator assembly, and a control unit. The manipulator assembly comprises a chassis, an optical fiber cleaning assembly housed within the chassis, and a drive mechanism housed within the chassis. The optical fiber cleaning assembly comprises a cleaning tape, a first spool on which the cleaning tape is wound, and a second spool onto which the cleaning tape is drawn after use. The drive mechanism is configured to advance the cleaning tape from the first spool to the second spool such that a portion of the cleaning tape wipes a face of the optical fiber. The control unit is configured to control the drive mechanism to advance the cleaning tape.

Abstract: A fiber optic installation device is disclosed for easily and efficiently installing fiber into an existing conduit in order to provide telecommunication and other services. The installation device includes a housing having first and second entry points. A first tube is releasably coupled to the first entry point, and configured for receiving a fiber cable, and a second tube is releasably coupled to the second entry point, and configured for receiving and securing an existing conduit so that the fiber optic cable can be pushed through and installed into the conduit. The cable is driven through the device via a drive wheel that is coupled to a drive shaft being driven by a standard electric drill. To prevent slippage of the cable, a pincher wheel is adjusted up or down via a knob to ensure the fiber optic cable remains in contact with the drive wheel throughout the installation process.

Abstract: An optical waveguide device includes an optical waveguide substrate including a first cladding layer disposed on a support, a core layer disposed on the first cladding layer, and a second cladding layer selectively covering the core layer, and a silicon photonic chip including a silicon substrate and a silicon waveguide disposed on one side of the silicon substrate, wherein part or all of a thickness of one end of the silicon waveguide is embedded in the core layer exposed from the second cladding layer, wherein a thickness of the core layer in a place covered with the silicon substrate is less than that of the core layer in a place not covered with the silicon substrate, and wherein a width of the core layer at a point of contact with the silicon substrate is wider than that of the core layer in a place covered with the second cladding layer.

Abstract: Described herein are techniques for intra-chip communication within tiled photonic interposers. A photonic interposer may rely on a combination of photonic lanes and electric lanes. For example, a photonic interposer may comprise a photonic integrated circuit (PIC) lithographically patterned with an array of photonic tiles, each photonic tile comprising an on-chip communication unit. The array of photonic tiles is arranged in rows and columns. A plurality of electric lanes place the on-chip communication units of photonic tiles of different rows in electrical communication with one another. A plurality of photonic lanes place the on-chip communication units of photonic tiles of different columns in optical communication with one another.

Abstract: An electro-optic device comprising a waveguide (WG)-device configured as an electro-absorption modulator (EAM) and electronics comprising an EAM driver. The electro-optic device comprising: a semi-insulating (SI) indium phosphide (InP) substrate; an epitaxial layer stack formed on the SI:InP substrate comprising a first plurality of semiconductor layers forming InP heterojunction bipolar transistors of the electronics and a second plurality of semiconductor layers structured to form a PIN waveguide of the EAM, the PIN waveguide comprising: an n-layer structure and a p-layer structure; an i-region comprising optical material located between the n-layer structure and the p-layer structure; the n-layer structure and the p-layer structure configured to optical confine one or more modes of an optical signal configured to propagate through the i-region; and at least one of the n-layer structure and the p-layer structure comprises a mode extending layer.

Abstract: Structures for a co-packaged photonics chip and electronic chip, and associated methods. The structure comprises a layer comprising a molding compound, an electronic chip and a photonics chip affixed in the layer, and a waveguiding structure including a waveguide core adjacent to the photonics chip. The photonics chip includes an optical coupler, the waveguide core includes a portion that overlaps with the optical coupler, and the waveguide core comprises a polymer.

Abstract: Photonic device, system and methods of making photonic devices and systems, the method including: providing a substrate, forming an insulator layer over the substrate, depositing a plurality of waveguide layers and a plurality of insulator spacers at different vertical levels over the insulator layer, wherein adjacent waveguide layers in the plurality of waveguide layers are isolated by one or more insulator spacers in the plurality of insulator spacers, and forming a plurality of waveguide patterns at the plurality of waveguide layers, wherein at least two waveguide patterns at different vertical levels in the plurality of waveguide patterns are coupled.

Abstract: Provided herein is a photonic modulator and methods for controlling a photonic modulator that can control the phase and/or amplitude of photons being transmitted through the modulator to minimize photonic loss while remaining power efficient and operating at high speeds. The photonic modulator can include a substrate with a pair of piezoelectric cantilevers spaced apart from one another by a gap, with a photonic waveguide disposed in the substrate that extends across the modulator and bridges the gap between the piezoelectric cantilevers. In one or more examples, the piezoelectric cantilevers can be configured to move away from the substrate in response to an electrical signal, such that a refractive index of the photonic waveguide is altered.

Abstract: An optical coupling structure for an optoelectronic integrated circuit includes a first connector and an optical fiber device. The first connector is disposed on the optoelectronic integrated circuit and includes a base including a lower surface and a front end, and a waveguide device assembled in the base and including a first surface, a first guide surface adjoining the first surface and located at the front end, and a plurality of optical waveguide paths extend to the first guide surface. The optical fiber device includes a second connector including a connecting surface and detachably connected to the first connector such that the connecting surface and the first guide surface directly face each other.

Abstract: In general, the present disclosure relates to a cable protection assembly for use on distribution cabinets and the corresponding methods of assembling the cable protection assembly onto the distribution cabinets.

Abstract: An electro-optical device includes a waveguide and a first electrode and a second electrode. The first electrode and the second electrode at first and second sides of the waveguide, wherein the first electrode and the second electrode directly contact and extend beyond the first and second sides of the waveguide respectively.

Abstract: A method includes connecting a first photonic package to a substrate, wherein the first photonic package includes a first waveguide and a first support over the first waveguide; connecting a second photonic package to the substrate adjacent the first photonic package, wherein the second photonic package includes a second waveguide, wherein the first photonic package and the second photonic package are laterally separated by a gap that has a width in the range of 15 ?m to 190 ?m; depositing a first quantity of an optical adhesive into the gap; and curing the first quantity of the optical adhesive, wherein after curing the first quantity of the optical adhesive, the first waveguide is optically coupled to the second waveguide through the first quantity of the optical adhesive.