Abstract: An apparatus includes a silicon (Si) optical phase shifter. In an embodiment, the optical phase shifter comprises a planar optical waveguide having a silicon optical core, and a pair of biasing electrodes located along opposite sides of a segment of the silicon optical core. The segment of the silicon optical core comprises a series of p-n junctions. The series extends in a direction transverse to an optical propagation direction in a segment of the planar optical waveguide including the segment of the silicon optical core. At least two of the p-n junctions are configured to be reverse biased by applying a voltage across the biasing electrodes.

Abstract: An integrated optical waveguide device, an endoscopic probe, and an all-optical photoacoustic endoscopy (PAE) sensing system are provided. The integrated optical waveguide device features a core layer that sequentially includes a splitter, a first wavelength transmission region, and a sensing reflection region, all connected along the light transmission direction. The splitter is configured to separate light of different wavelengths. The first wavelength transmission region is configured to transmit pulsed light, while the sensing reflection region is configured to realize transmission, reflection or resonance of a light signal at a preset wavelength. By monitoring changes in the resonant or reflective wavelength, environmental parameter changes can be monitored.

Abstract: Configurations for a one by four light splitting device are disclosed. The light splitting device may include a primary waveguide, a first coupling waveguide, and a second coupling waveguide. The primary waveguide may couple light from the primary waveguide into both the first and second coupling waveguides. Due to the manipulation of the coupling modes, a fundamental mode of light may be input and four fundamental modes of light may be output. In some examples, the primary waveguide may input a fundamental mode of light that may be converted into a first hybrid mode, which may be a four lobe mode. The first and second coupling waveguides may be tapered and separated by a gap such that the first hybrid mode may be converted into two second hybrid modes, which may then be converted back into four fundamental modes of output light.

Abstract: A capillary combiner housing for an optical fiber combiner has an inner combiner casing supporting optical fibers. The capillary combiner housing includes a non-metallic body defining a lumen between an input side and an output side, the lumen sized to receive the inner combiner casing, the non-metallic body having a coefficient of thermal expansion substantially matching that of the inner combiner casing. Also included is a first aperture in the input side, the first aperture having a first inside diameter sized to receive multiple input optical fibers, and a second aperture in the output side, the second aperture having a second inside diameter sized to receive an output fiber.

Abstract: A liquid crystal includes first and second substrates, the first substrate including intersecting data lines and scan lines. A liquid crystal layer is sandwiched therebetween. Also, a plurality of sub-pixels districted by data lines and gate lines, and arranged along the long-axis and the short-axis directions in a matrix. A pixel electrode in the sub-pixels includes a central portion. A common electrode including linear electrodes arranged along the data lines and disposed with gaps therebetween. Sub-pixels are bent at the center portion, such that the linear electrodes or the gaps in both sides of the sub-pixels are inclined in opposite directions with respect to the long-axis direction. At least one of the linear electrodes or at least one of the gaps has a bent portion at the central portion of the respective pixel electrode. The common electrode is provided on liquid crystal layer side over the pixel electrode.

Abstract: An optical fiber array module that can accommodate variations in diameters of the optical fibers in the fiber array within anticipated tolerance, to accurately and securely retain the optical fibers in grooves in the module without using any solder interface or epoxy interface between the optical fibers and the supporting components. The fiber array module of the present invention relies on elasto-plastic interfaces for mechanical deformation, as opposed to solder reflow or epoxy curing, to accommodate variations in diameters of the optical fibers in the fiber array as supported in grooves between a substrate and a cover.

Abstract: An optical modulator. The optical modulator comprising: a micro-ring resonator; and a bus waveguide, including an input waveguide region, an output waveguide region, and a coupling waveguide region optically coupled to the micro-ring resonator and located between the input waveguide region and the output waveguide region. The micro-ring resonator includes a modulation region, the modulation region being formed of a silicon portion and a III-V semiconductor portion separated by a crystalline rare earth oxide dielectric layer.

Abstract: An optical connection component includes: an input end that separates each of light beams output from an output end surface of a multi-core fiber toward single-core fibers, and enlarges each beam diameter of the light beams; and an output end that allows the light beams from the input end to be parallel to an axial direction of the multi-core fiber. The optical connection component guides the light beams output from the output end surface, inclined with respect to a plane perpendicular to the axial direction, to the single-core fibers, wherein the light beams output from the output end surface propagate in a direction inclined with respect to the axial direction.

Abstract: A cable pulling device including a clamshell housing including a first elongate clamshell and a second elongate clamshell configured to engage the first elongate clamshell such that the clamshell housing can house a distal end piece disposed at a distal end of a cable. The device can include a cord extending from a first end to a second end, wherein the first end and the second end being configured to extend through a bifurcate aperture disposed at a distal end of the distal end piece to form a loop. The cable pulling device can include a locking ring configured to surround and hold together the first elongate clamshell and the second elongate clamshell.

Abstract: An optical waveguide device that enables single-mode coupling between cores to be coupled by controlling optical signal intensity variation due to an MPI. The optical waveguide device includes a first device end surface, a second device end surface, a waveguide, and a cladding layer. The waveguide has a first waveguide end surface and a second waveguide end surface, and light beams of a plurality of modes having different orders are guided. Further, the waveguide has one or more bent portions. The cladding layer has a refractive index lower than a refractive index of the waveguide. The waveguide has a waveguide length L of 5×106 [nm] or more and 100×106 [nm] or less, and has a structure in which an inter-mode group delay time difference ??1 satisfies a condition given by |??1|?½×10?12 [s]/L.

Abstract: The invention describes an apparatus that implements efficient coupling between a photonic integrated circuit (PIC) and a second optical element such as a fiber or laser, while at the same time allowing for efficient polarization management and/or optical isolation. It enables the packaging of PICs with large single mode fiber counts and in- and out-coupling of light with arbitrary polarization. The apparatus comprises a glass interposer that contains at least one polarization selective element together with a pair of lenses transforming a beam profile between the 2nd optical element and a polarization selective coupler on the PIC. The invention also comprises a method for fabricating the apparatus based on a subassembly of building blocks that are manufactured using wafer-scale high-precision glass-molding and surface treatment(s) such as thin-film coating.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to an identification system, method of manufacture and method of use. The structure includes at least one waveguide structure and at least one damaged region positioned in a unique pattern on the at least one waveguide structure.

Abstract: Heterogeneous package structures comprising photonic components are provided. For example, an exemplary package structure comprises at least one electronic device, at least one photonic device, at least one bridge interconnect device, and at least one optical waveguide device. The at least one bridge interconnect device is configured to electrically connect the at least one electronic device to the at least one photonic device. The at least one optical waveguide device is optically coupled to the at least one photonic device to implement an optical bus for routing optical signals in the package structure. The at least one photonic device is configured to implement an electro-optical interface between the at least one electronic device and the optical bus.

Abstract: The present disclosure relates to a fiber management device or system for facilitating routing and storing optical fibers. The fiber management device includes a flexible, film-like substrate that has optical fiber management, storing functionality, and splicing functionality all on one film-like substrate. The flexible, film-like substrate can provide a routing path for routing optical fibers onto a flexible planar substrate that can be temporarily supported by, mounted on or attached to the flexible planar substrate. The flexible, film-like substrate can accommodate fibers that are in a multi-fiber (e.g., ribbon) configuration or a single fiber configuration.

Abstract: Method of laser modifying an optical fibre to form a modified region at a target location within the fibre, comprising positioning at least a portion of an optical fibre in a laser system for modification by a laser, applying a correction to an active optical element of the laser system to modify wavefront properties of the laser to counteract an effect of aberration on laser focus, and laser modifying the optical fibre at the target location using the laser with the corrected wavefront properties to produce the modified region.

Abstract: Devices and systems having a vertical waveguide array are provided having a plurality of vertical waveguides disposed on a support substrate in an array, where each vertical waveguide further includes a reflective layer positioned to reflect impinging light toward the support substrate, a core region extending from the reflective layer to the support substrate, the core region further comprising, a first contact region and a second contact region electrically isolated from one another disposed between the reflective layer and the support substrate, and a low refractive index material disposed between the first contact region and the second contact region. The first contact region and the second contact region are operable to create a voltage drop across the low refractive index material and the low refractive index material has a lower refractive index compared to the refractive indexes of the first contact region and the second contact region.

Abstract: Examples described herein relate to an optical device that entails phase shifting an optical signal. The optical device includes an optical waveguide having a first semiconductor material region and a second semiconductor material region formed adjacent to each other and defining a junction therebetween. Further, the optical device includes an insulating layer formed on top of the optical waveguide. Moreover, the optical device includes a III-V semiconductor layer formed on top of the insulating layer causing an optical mode of an optical signal passing through the optical waveguide to overlap with the first semiconductor material region, the second semiconductor material region, the insulating layer, and the III-V semiconductor layer thereby resulting in a phase shift in the optical signal passing through the optical waveguide.

Abstract: Integrated circuit packages may be formed having at least one optical via extending from a first surface of a package substrate to an opposing second surface of the package substrate. The at least one optical via creates an optical link between the opposing surfaces of the package substrate that enables the fabrication of a dual-sided optical multiple chip package, wherein integrated circuit devices can be attached to both surfaces of the package substrate for increased package density.

Abstract: An optical device for coupling light propagating between a waveguide and an optical transmission component is provided. The optical device includes a taper portion and a grating portion. The taper portion is disposed between the grating portion and the waveguide. The grating portion includes rows of grating patterns. A first size of a first grating pattern in a first row of grating patterns is larger than a second size of a second grating pattern in a second row of grating patterns. A first distance between the first row of grating patterns and the waveguide is less than a second distance between the second row of grating patterns and the waveguide.

Abstract: Various embodiments are directed to systems, apparatus and methods for characterizing evanescent coupling parameters of a waveguide coupled to a resonator through variation of their relative positions. Various embodiments extend a local coupling approach with novel fitting capabilities that robustly determine the bare resonator modes and coupling parameters with quantified residual error and coupling parameter uncertainty estimates.