Patents Examined by Michael Stahl
  • Patent number: 11809009
    Abstract: A data communication system for deploying outside plant fiber optics includes a cassette releasably engageable in a tray pivotably connectable to a tray fastening member disposed in an inside of an enclosure. A test port in the cassette is accessible without pivoting the tray and without pivoting any one or more trays pivotably connected to the tray fastening member.
    Type: Grant
    Filed: June 14, 2021
    Date of Patent: November 7, 2023
    Assignee: Telect, Inc.
    Inventors: Donald Gross, Iuliu Cosmin Gordea
  • Patent number: 11803009
    Abstract: Photonics structures including an optical component and methods of fabricating a photonics structure including an optical component. The photonics structure includes an optical component, a substrate having a cavity and a dielectric material in the cavity, and a dielectric layer positioned in a vertical direction between the optical component and the cavity. The optical component is positioned in a lateral direction to overlap with the cavity in the substrate.
    Type: Grant
    Filed: February 25, 2022
    Date of Patent: October 31, 2023
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Shesh Mani Pandey, Yusheng Bian, Steven M. Shank, Judson Holt
  • Patent number: 11789296
    Abstract: An optical modulator includes a dielectric layer and a waveguide. The waveguide is disposed on the dielectric layer. The waveguide includes an electrical coupling portion, a slab portion, and an optical coupling portion. The slab portion is directly in contact with both of the electrical coupling portion and the optical coupling portion. The slab portion has a first sub-portion and a second sub-portion connected to the first sub-portion. A top surface of the electrical coupling portion, a top surface of the first sub-portion, and a top surface of the second sub-portion are located at different level heights.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: October 17, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Lan-Chou Cho, Chewn-Pu Jou, Feng-Wei Kuo, Huan-Neng Chen, Min-Hsiang Hsu
  • Patent number: 11789203
    Abstract: Embodiments are disclosed for a coupling element with embedded modal filtering for a laser and/or a photodiode. An example system includes a laser and an optical coupling element. The laser is configured to emit an optical signal. The optical coupling element is configured to receive the optical signal emitted by the laser. The optical coupling element is also configured to be connected to an optical fiber such that, in operation, the optical signal is transmitted from the laser to the optical fiber via the optical coupling element. Furthermore, the coupling element comprises a tapered section that provides modal filtering of the optical signal.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: October 17, 2023
    Assignee: MELLANOX TECHNOLOGIES, LTD.
    Inventors: Dimitrios Kalavrouziotis, Yaakov Gridish, Paraskevas Bakopoulos, Anders Gösta Larsson, Elad Mentovich
  • Patent number: 11782202
    Abstract: A light guide receptacle for mounting a plurality of light guides in the interior of a housing part, with a plurality of light bulkheads, is configured to arrange the plurality of light guides, which are mechanically coupled to one another by means of a web, in each case in intermediate spaces between two light bulkheads of the plurality of light bulkheads and to optically decouple spatially adjacent light guides from one another by means of the respective light bulkhead, wherein the plurality of light bulkheads are integrated components of the housing part.
    Type: Grant
    Filed: March 4, 2022
    Date of Patent: October 10, 2023
    Assignee: ABB AG
    Inventor: Stefan Gutermuth
  • Patent number: 11782208
    Abstract: Structures for a wavelength splitter used in a wavelength-division-multiplexing filter stage and methods of forming same. The structure comprises a first waveguide core including a first section, a second section, and a phase delay line between the first section and the second section. The phase delay line of the first waveguide core includes a delay section and a plurality of segments longitudinally arranged in the delay section. The structure further comprises a second waveguide core including a first section, a second section, and a phase delay line between the first section and the second section. The first section of the second waveguide core is positioned adjacent to the first section of the first waveguide core to define a first directional coupler, and the second section of the second waveguide core is positioned adjacent to the second section of the first waveguide core to define a second directional coupler.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: October 10, 2023
    Assignee: GlobalFoundries U.S. Inc.
    Inventor: Yusheng Bian
  • Patent number: 11762155
    Abstract: Embodiments herein describe an optical system that includes a photonic integrated circuit (PIC) bonded to a package containing an electrical integrated circuit (EIC). However, this bond can prevent an edge coupler from optically aligning an optical fiber to an edge of the PIC in order to transfer optical signals. To provide room for the edge coupler, the PIC is arranged to overhang the package containing the EIC so that the package does not interfere with the ability of the edge coupler to align with the side or edge of the PIC. In this manner, an optical fiber can be optically aligned (e.g., butt coupled) to the edge of the PIC rather than having to use a grating coupler or some other less efficient optical coupling in order to transfer optical signals between the PIC and the optical fiber.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: September 19, 2023
    Assignee: Cisco Technology, Inc.
    Inventors: Vipulkumar K. Patel, Matthew J. Traverso, Sandeep Razdan, Aparna R. Prasad
  • Patent number: 11762154
    Abstract: A first chip includes a first plurality of optical waveguides exposed at a facet of the first chip. A second chip includes a second plurality of optical waveguides exposed at a facet of the second chip. The second chip includes first and second spacers on opposite sides of the second plurality of optical waveguides. The first and second spacers have respective alignment surfaces oriented substantially parallel to the facet of the second chip at a controlled perpendicular distance away from the facet of the second chip. The second chip is positioned with the alignment surfaces of the first and second spacers contacting the facet of the first chip, and with the second plurality of optical waveguides respectively aligned with the first plurality of optical waveguides. The first and second spacers define and maintain an air gap of at least micrometer-level precision between the first and second pluralities of optical waveguides.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: September 19, 2023
    Assignee: Ayar Labs, Inc.
    Inventors: Manan Raval, Matthew Sysak, Chen Li, Chong Zhang
  • Patent number: 11762146
    Abstract: A plurality of waveguide structures are formed in at least one silicon layer of a first member. The first member includes: a first surface of a first silicon dioxide layer that is attached to a second member that consists essentially of an optically transmissive material having a thermal conductivity less than about 50 W/(m·K), and a second surface of material that was deposited over at least some of the plurality of waveguide structures. An array of phase shifters is formed in one or more layers of the first member. An array of temperature controlling elements are in proximity to the array of phase shifters.
    Type: Grant
    Filed: April 13, 2022
    Date of Patent: September 19, 2023
    Assignee: Analog Photonics LLC
    Inventors: Michael Robert Watts, Benjamin Roy Moss, Ehsan Shah Hosseini, Christopher Vincent Poulton, Peter Nicholas Russo
  • Patent number: 11754790
    Abstract: An exchangeable optic fiber connector assembly, including a pair of optic fiber connectors and a switching structure, is provided. Each optic fiber connector has a first locking portion and a first stopping portion. The switching structure has a pair of guiding slots. The optic fiber connectors respectively pass through the guiding slots to be movable and rotatable along the corresponding guiding slots. The switching structure further has a plurality of second locking portions and a plurality of second stopping portions disposed at two opposite ends of each guiding slot. Each optic fiber connector is locked with one of the second locking portions through the first locking portion, and the second stopping portion next to the locked second locking portion is located on a moving path of the first stopping portion.
    Type: Grant
    Filed: September 7, 2022
    Date of Patent: September 12, 2023
    Assignee: ACON OPTICS COMMUNICATIONS INC.
    Inventors: Jia Rong Wu, Tsung Yao Hsu
  • Patent number: 11754785
    Abstract: Methods and apparatuses for mode conversion. An apparatus that includes a substrate, a first waveguide, a second waveguide, a micro-electro-mechanical systems (MEMS) perturber, and a controller is provided. The first waveguide is formed on the substrate includes: (i) an input section, (ii) a bend section, and (iii) an output section. The second waveguide is also formed on the substrate and is disposed adjacent to a portion of the input section of the first waveguide. A portion of the second waveguide is separated from the input section of the first waveguide by a coupling gap. The perturber is disposed above the first waveguide and configured to move between a first position that is distal from a surface of the input section of the first waveguide and a second position that is closer to the surface of the input section of the first waveguide than the second position. The controller is configured to control a movement of the perturber between the first position and the second position.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: September 12, 2023
    Assignee: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Marcel W. Pruessner, Dmitry A. Kozak, Todd H. Stievater, Brian J. Roxworthy
  • Patent number: 11747557
    Abstract: A wavelength checker includes an optical converter composed of a conversion material that converts infrared light into visible light. The optical converter is disposed, on an output side (side from which light is output to an external space) of a plurality of first output waveguides of an optical waveguide chip, to receive emitted light that is guided through the first output waveguides and reflected on and emitted from the light emitting-side end surface. The light emitting-side end surface is a reflection surface that is inclined to face a main substrate.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: September 5, 2023
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Takuya Tanaka, Hiroshi Ishikawa, Kota Shikama, Atsushi Aratake
  • Patent number: 11747559
    Abstract: Disclosed is a photonic integrated circuit (PIC) structure including: a first primary waveguide, which has a first main body and a first end portion that is tapered; at least one supplemental waveguide positioned laterally adjacent to and extending beyond the first end portion of the first primary waveguide; and a second primary waveguide, which has a second main body and a second end portion that at least partially underlays/overlays the first end portion of the first primary waveguide and the supplemental waveguide(s). The arrangement the end portions of the primary waveguides and the supplemental waveguide(s) allows for mode matching conditions to be met at multiple locations at the interface between the primary waveguides, thereby creating multiple signal paths between the primary waveguides and effectively reducing the light signal power density in any one path to prevent or at least minimize any power-induced damage.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: September 5, 2023
    Assignee: GlobalFoundries U.S. Inc.
    Inventor: Yusheng Bian
  • Patent number: 11747576
    Abstract: The clip for securing two fiber optic connectors may include a first engagement member having a top surface and a length; a second engagement member spaced apart from the first engagement member; and a linkage member extending between the first and second engagement members and connecting the first engagement member and the second engagement member. A space is defined between the first and second engagement members to house the connectors. The linkage member is configured to separate the two fiber optic connectors when they are sandwiched between the first and second engagement members.
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: September 5, 2023
    Assignee: Senko Advanced Components, Inc
    Inventor: Kim Man Wong
  • Patent number: 11747581
    Abstract: A fiber optic distribution cable includes a central inner jacket formed from one of a polyvinyl chloride or a low smoke zero halogen material, a plurality of optical fibers disposed within the inner jacket, and a plurality of first strength members disposed within the inner jacket. The fiber optic distribution cable further includes an outer jacket surrounding the central inner jacket, the outer jacket formed from the one of the polyvinyl chloride or the low smoke zero halogen material, and a plurality of second strength members disposed between the outer jacket and the central inner jacket. A fiber density of the cable is greater than 0.65 fibers per square millimeter.
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: September 5, 2023
    Assignee: AFL Telecommunications LLC
    Inventors: Rajesh Kamath, Michael Houck, Brett Villiger, Justin Quinn, Joseph Cignarale
  • Patent number: 11740407
    Abstract: Disclosed are integrated photonics systems including a coupling strategy to couple light in and out of optoelectronic flip-chips bonded to a photonics chip. The refined tolerances for flip-chip assembly and angled facets defined on both chips at optical couplings improve optical performance.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: August 29, 2023
    Assignee: Voyant Photonics, Inc.
    Inventors: Sajan Shrestha, William Sean Ring
  • Patent number: 11733458
    Abstract: Structures including an edge coupler and methods of fabricating a structure including an edge coupler. The structure includes a first waveguide core having a first inverse taper, a second waveguide core having a second inverse taper, and a third waveguide core having a third inverse taper that is laterally positioned between the first inverse taper and the second inverse taper. The structure further includes a fourth waveguide core having a fourth inverse taper that is positioned to overlap with the first inverse taper, and a fifth waveguide core having a fifth inverse taper that is positioned to overlap with the second inverse taper.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: August 22, 2023
    Assignee: GlobalFoundries U.S. Inc.
    Inventor: Yusheng Bian
  • Patent number: 11726270
    Abstract: The present disclosure provides an optical fiber connector, comprising an integrated ferrule assembly and an integrated outer housing assembly, the ferrule assembly being adapted to be fitted into the housing assembly. The ferrule assembly at least comprises an inner housing, a spring, a multi-hole ferrule, a multi-fiber optical cable, a sleeve and a thermal shrinkable tube. The housing assembly at least comprises an outer housing, an outer tail tube and an outer protection cap.
    Type: Grant
    Filed: August 12, 2021
    Date of Patent: August 15, 2023
    Assignee: COMMSCOPE TELECOMMUNICATIONS (SHANGHAI) CO. LTD
    Inventors: Zhaoyang Tong, Xingjun Cheng, Lei Liu, Longzhou Qi
  • Patent number: 11726288
    Abstract: A patch panel includes a cabinet and a cassette. A pair of cassette guides is positioned within the cabinet. The pair of cassette guides are spaced along a lateral direction such that the cassette is receivable between the pair of cassette guides. The cassette is slidable along a transverse direction on the pair of cassette guides. At least one of the pair of cassette guides includes a first rail and a second rail that are spaced apart along a vertical direction. The cassette is slidable along the transverse direction between the first and second rails. Each end of the first rail is cantilevered such that each end of the first rail is moveable along the vertical direction.
    Type: Grant
    Filed: January 4, 2022
    Date of Patent: August 15, 2023
    Assignee: AFL Telecommunications LLC
    Inventor: Zidi Ye
  • Patent number: 11714247
    Abstract: An optical splitting apparatus includes an enclosure, an even optical splitter and an uneven optical splitter that are disposed in the enclosure. A light inlet and a plurality of light outlets are disposed on the enclosure, and fiber adapters are disposed on the light outlets. The light inlet, the even optical splitter, the uneven optical splitter, and the light outlets are connected, so that optical paths are formed between the light inlet and the light outlets by using the even optical splitter and the uneven optical splitter. The light inlet is connected to at least one of a light input end of the even optical splitter and a light input end of the uneven optical splitter, and the fiber adapter on the light outlet is connected to at least one of a light output end of the even optical splitter and a light output end of the uneven optical splitter.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: August 1, 2023
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Jinjin Zhang, Xiaoqin Jia