Abstract: A method for detachably attaching a linking unit, including an end with a hole and a slit, to a mold, the method comprising inserting a first attachment member connected to the mold through the hole; and inserting a second attachment member connected to the mold through the slit, wherein the linking unit is detached from the mold by moving the linking unit in a direction opposite to a direction in which the slit is formed in a state where the first attachment member is disconnected from the mold and the second attachment member remains connected to the mold.

Abstract: A component supply device supplies a component accommodated in a carrier tape including a base tape and a cover tape pasted on the base tape and having a length to a forward end thereof that is longer than that of the base tape. The component supply device includes a tape conveying part, a turning over correcting part, and a peeling part. The tape conveying part conveys the carrier tape along a conveyance path. The turning over correcting part moves the forward end of the cover tape folded to a side opposite to a side of a conveyance direction, to a position located ahead of a forward end of the base tape in the conveyance direction in the conveyance path. The peeling part captures the forward end of the cover tape, and peels off the cover tape from the base tape.

Abstract: A method for fabricating wide and continuous double-sided lithium metal anodes includes thermally evaporating lithium to form first and second continuous lithium layers on respective first and second continuous polymer substrates, so as to form respective first and second continuous lithium/polymer sheets. The first and second continuous lithium/polymer sheets are laminated onto respective top and bottom surfaces of a continuous metallic substrate, which may be made of copper, with the first and second continuous lithium layers being disposed in direct contact with the respective top and bottom surfaces to form a continuous polymer/lithium/metal/lithium/polymer structure. The first and second continuous polymer substrates are then removed from the continuous polymer/lithium/metal/lithium/polymer structure to provide a continuous lithium/metal/lithium anode structure.

Abstract: Methods and related structures to splice two sizes of cores in a manner to directly interface the facets of the cells and avoid the common practice of using fillers, casting materials, and expanding adhesives is useful to optimize the specific strength of the design and minimize the weight while maximizing the load carrying capability of the structure and to allow the core to vent moisture and other gasses.

Abstract: A filler material is applied to a plurality of wood elements. The plurality of wood elements is bonded into a composite wood product, where the bonding includes delivering ultrasound energy to the plurality of wood elements. The ultrasound energy has a frequency within a frequency range of 10 kHz-20 MHz.

Abstract: An adhesive set includes a main agent containing a decomplexing agent and an initiator containing an organoborane complex. At least one of the main agent and the initiator further contains a compound having a radically polymerizable group. At least one of the main agent and the initiator further contains a compound having a thiocarbonylthio structure.

Abstract: A method is provided for manufacturing panels having a substrate and a decorative top layer that may include a printed motif and a transparent or translucent protective layer formed there above. The method may involve providing the substrate. A finishing layer may be applied for forming a portion of the protective layer. Recesses may be formed at a surface of the finishing layer. Forming the recesses may involve applying a surface structure-altering agent that is colored.

Abstract: The present disclosure relates to an integrated chip processing tool. The integrated chip processing tool includes a gas distribution ring configured to extend along a perimeter of a process chamber. The gas distribution ring includes a lower ring extending around the process chamber. The lower ring has a plurality of gas inlets arranged along a bottom surface of the lower ring and a plurality of gas conveyance channels arranged along an upper surface of the lower ring directly over the plurality of gas inlets. The gas distribution ring further includes an upper ring disposed on the upper surface of the lower ring and covering the plurality of gas conveyance channels. A plurality of gas outlets are arranged along opposing ends of the plurality of gas conveyance channels. A plurality of gas conveyance paths extending between the plurality of gas inlets and the plurality of gas outlets have approximately equal lengths.

Abstract: Co-molding of non-crimped fabric and sheet molding composition. The pre-preg of non-crimped fabric is dried to achieve suitable stiffness for molding. The pre-preg allows the pre-formed non-crimped fabric feature to retain its shape during molding. A plurality of thorns is provided in the molding tooling to further prevent movement of pre-preg during molding. The method of co-molding includes, drying of the pre-preg to achieve suitable stiffness for molding, pre-forming of the pre-preg, and incorporating a plurality of stand-off features or thorns in the molding tool to prevent movement of pre-preg during co-molding so that predetermined full coverage of non-crimped fabric is maintained in predetermined area(s) of the molded part and the continuous fibers of the non-crimped fabric are not distorted.

Abstract: Provided is a back grinding adhesive sheet which can adequately protect protrusions provided to a semiconductor wafer, and with which back grinding can be adequately performed. The present invention provides a back grinding adhesive sheet for a semiconductor wafer having protrusions, the back grinding adhesive sheet comprising a non-adhesive cushion layer, and an adhesive layer provided on the cushion layer. The adhesive layer has an opening with a smaller diameter than the diameter of the semiconductor wafer, and the outer edge of the semiconductor wafer is adhered to the adhesive layer such that the protrusions on the semiconductor wafer are positioned inside the opening. The protrusions are protected by the cushion layer when the semiconductor wafer is in the state of being adhered to the adhesive layer. The adhesive sheet satisfies at least one of the following conditions (1)-(2).

Abstract: A method of laying an optical cable according to the present disclosure includes: installing a laying strip, in which the optical cable is to be embedded, on a road surface or a wall surface; forming a cut line, for embedding the optical cable, on the installed laying strip; and embedding the optical cable in the formed cut line.

Abstract: An adhesive composition comprising a first part comprising an epoxy resin and a second part comprising a multifunctional amine package. The multifunctional amine package comprises bis(hexamethylene)triamine and a synergist. The amine concentration is at least 10% less than the epoxy resin concentration and the adhesive composition demonstrates a sag resistance of greater than 40 mm.

Abstract: The present invention disclosed a wall-cloth with a laminated core coated through infiltration, a method for making the same and a method for an object, wherein, the wall-cloth comprises a prime coating layer, a laminated core complex covered on the prime coating layer; wherein the laminated core complex comprises a second coating layer which can be transparent or semi-transparent and a fiber sheet encapsulated in the second coating layer; and wherein, the fiber sheet possesses a network structure formed by fiber or fibers, and the second coating layer permeates into the meshes of the network structure. According to the present invention, the texture is controlled, because the fiber sheet can be produced according to a standard and large scale method to obtain identical texture. Meanwhile, the wall-cloth made by the present invention has excellence breathability and great gas transmission.

Abstract: A method to generate a non-woven fabric includes prearranging at least one thread guide arranged to guide at least one textile thread, prearranging moving means for actuating the thread guide according to at least one degree of freedom, prearranging at least one rigid support and handling each thread guide by the moving means for arranging at least one first portion of each textile thread along at least one first trajectory ?_1 on each rigid support. Each thread guide is handled by the moving means for arranging at least one second portion of each textile thread along at least one second trajectory ?_2 on each rigid support. Each second trajectory ?_2 overlaps with each first trajectory ?_1 at least at one intersection point P_i, joining each second portion of each textile thread with each first portion of each textile thread at each intersection point P_i.

Abstract: A method may include pressing a mat including a blend of paper and plastic fragments by applying a pressure to the mat using a heated press such that the mat is compressed to a first thickness, where the pressure is greater than a critical pressure threshold such that at least a portion of a moisture content of the mat is in a super-heated liquid state. The method may include maintaining the pressure on the mat above the critical pressure threshold until at least a portion of the plastic fragments of the mat are melted. The method may include decreasing the pressure on the mat below the critical pressure threshold such that the mat expands to a second thickness greater than or equal to a target thickness, and such that the portion of the moisture content of the mat in the super-heated liquid state is converted to steam.

Abstract: A method for continuously manufacturing a complex acoustic multi-element panel for an acoustic attenuation structure, the method including supplying a thermoplastic resin film at the entry of a stamping system including at least one pair of complementary cylinders, a heating of the thermoplastic resin film upstream of the entry of the stamping system, and a passage of the thermoplastic resin film between the at least one pair of complementary cylinders, the pair of complementary cylinders including a male cylinder with teeth radially protruding from the cylinder and a female cylinder with cavities on its radial surface, the cavities of the female cylinder being of shapes complementary to the shapes of the teeth of the male cylinder and a separation of the stamped film at the exit of the stamping system using a separator disposed at the exit of the stamping system between the stamped film and the female cylinder.

Abstract: A method for forming a composite component, the method comprising: providing a first mould tool and a second mould tool, the first and second mould tools being configured so as to be capable of defining at least part of a mould cavity between them, and the second mould tool having a moulding surface defined by at least two demountable mould bodies; attaching the first mould tool to a press at a first workstation; subsequently, at a second workstation spaced from the first workstation, loading at least part of the second mould tool with reinforcement material whilst the first mould tool remains attached to the press at the first workstation; moving the second mould tool to the press at the first workstation in such a position as to confront the first mould tool; causing the press to effect relative movement of the first and second tools to bring the first and second tools into mating arrangement so as to define a mould cavity therebetween; and setting in shape the reinforcement material located in the mould ca

Abstract: A multilayer strip intended to be wound on a form to manufacture a part in composite material, includes superposed fibrous layers, at least one of these layers being pre-impregnated, the superposed fibrous layers including a first layer including a first material on a first side of the width of the strip and a second material, differing from the first material, on a second side of the width of the strip opposite the first side, and a second layer superposed on the first layer and including the first material on the first side and the second material on the second side, with overlapping of a material of the second layer over a different material of the first layer.

Abstract: An apparatus for enrobing a product portion can include at least one polymer spray head adapted to create at least one flow of polymeric fibers to produce at least one polymer enrobing zone and a conveyor system adapted to move at least one product portion from at least one position below at least one polymer enrobing zone and to at least one position above at least one polymer enrobing zone to drop each product portion through one or more polymer enrobing zones a plurality times at different orientations to enrobe each product portion with polymeric fibers.

Abstract: Provided are methods and systems for manufacturing and using heat-shrink elastomeric. An example method of manufacturing a heat-shrink elastomeric element comprises providing a thermoplastic elastomeric element having a first shape; modifying the thermoplastic elastomeric element to produce a thermoset elastomeric element having the first shape; heating the thermoset elastomeric element to a temperature of at least the glass transition temperature of the thermoset elastomeric element; adjusting the first shape of the thermoset elastomeric element to produce a second shape with at least one dimension greater than that of the first shape; and cooling the thermoset elastomeric element to a temperature below that of the glass transition temperature of the thermoset elastomeric element to produce the heat-shrink elastomeric element.