Abstract: An additive latency circuit for a DDR2 standard compliant integrated circuit memory includes a half flip-flop register assigned for each case of additive latency. A unique clock is generated to control each bit in the register chain. Sufficient register bits are required in the chain to support the highest additive latency specified. For latency settings less than the maximum, those clocks assigned to the bits above the chosen latency are enabled so the data passes through un-clocked. For the additive latency zero case, a separate bypass path is provided. Both address and command information is delayed by the additive latency delay chain. Once delayed by the proper number of cycles, the address information remains in that state until the time when a new state is required. Command information remains valid for one cycle upon reaching the proper delay point. A reset circuit is provided to reset command signals.

Abstract: A memory array including a first region in which a first memory sub-array is located and a second region separated from the first region in which a second memory sub-array is located. The first and second memory sub-arrays have flash memory cells coupled to a plurality of word lines. A driver region separates the first and second regions and includes word line driver circuits coupled to the word lines of the first and second memory sub-arrays. A row decoder region adjacent the first region and separate from the driver region includes at least some sub-circuits of row decoder circuits located therein. The row decoder circuits are coupled to the word line driver circuits located in the driver region and are configured to activate driver circuits to drive word lines of the first and second memory sub-arrays in response to decoding address signals selecting the particular row decoder circuit.

Abstract: The present invention provides a high-capacity and reliable semiconductor device which does not require additional circuits for use at power ON/OFF, additional steps nor high manufacturing cost, and which has a rectifier means for rectifying a defect easily. A semiconductor device comprises a first memory means including a memory cell and a redundant memory cell each including a memory element in the region where a bit line and a word line cross each other with an insulator interposed therebetween, a second memory means for storing an address of a defective memory in the first memory means, a rectifier means including a holding means and a replacement means, and an inspection means for writing data of the second memory means to the holding means. The replacement means replaces the defective memory cell with the redundant memory cell. In addition to the aforementioned four means, a display means for displaying images is provided as well.

Abstract: Erasing is performed with respect to a nonvolatile memory cell without causing depletion halfway therethrough. A control circuit for reversibly and variably controlling the threshold voltage of the nonvolatile memory cell by electrical erasing and writing controls an erase process of performing erasing to the plurality of nonvolatile memory cells assigned to one unit in an erase operation, a first write process of performing writing to the nonvolatile memory cell exceeding a pre-write-back level before a depletion level, and a second write process of performing writing to the nonvolatile memory cell exceeding a write-back level after the first write process. Since the occurrence of depletion is suppressed by successively performing the first write process with respect to the nonvolatile memory cells which may exceed the depletion level in the erase process, erasing can be performed to the nonvolatile memory cell without causing depletion halfway therethrough.

Abstract: A method of erasing a chalcogenide variable resistance memory cell is provided. The chalcogenide variable resistance memory cell includes a p-doped substrate with an n-well and a chalcogenide variable resistance memory element. The method includes the step of applying to the variable resistance memory element a voltage that is less than a fixed voltage of the substrate. The applied voltage induces an erase current to flow from the p-doped substrate through the n-well and through the variable resistance memory element.

Abstract: In a dynamic random access memory device, an auto-refresh method comprises receiving a command for the memory device to operate in a half-density mode. This causes a remapping circuit to remap a first memory address bit to an unused memory address location. Using the new addressing scheme, an auto-refresh operation is performed on the memory array operating in the half-density mode without skipping refresh commands.

Abstract: Flash memory cells are presented which comprise a dielectric material formed above a substrate channel region, a charge trapping material formed over the dielectric material, and a control gate formed over the charge trapping material. The cell may be programmed by directing electrons from the control gate into the charge trapping material to raise the cell threshold voltage. The electrons may be directed from the control gate to the charge trapping material by coupling a substrate to a substrate voltage potential, and coupling the control gate to a gate voltage potential, where the gate voltage potential is lower than the substrate voltage potential. The cell may be erased by directing electrons from the charge trapping material into the control gate to lower a threshold voltage of the flash memory cell, such as by coupling the substrate to a substrate voltage potential, and coupling the control gate to a gate voltage potential, where the gate voltage potential is higher than the substrate voltage potential.

Abstract: The present invention relates to a structure for directly burning a program into a motherboard comprising a burning plate having a series connected first transistor set, a resistor, a comparator and a series connected second transistor set mounted thereon, wherein the first transistor set, the resistor, and comparator are series connected, two input terminals of the first transistor set and an output terminal of the comparator are electrically connected to a burner, an output terminal of the first transistor set is coupled to a serial data pin of a memory on the motherboard, an input terminal of the second transistor set is electrically connected to the burner, and an output terminal of the second transistor set is coupled to a serial clock pin of the memory for directly burning the program into the memory and checking the program burned therein.

Abstract: Methods and circuitry are present for improving performance in non-volatile memory devices by allowing the inter-phase pipelining of operations with the same memory, allowing, for example, a read operation to be interleaved between the pulse and verify phases of a write operation. In the exemplary embodiment, the two operations share data latches. In specific examples, at the data latches needed for verification in a multi-level write operation free up, they can be used to store data read from another location during a read performed between steps in the multi-level write. In the exemplary embodiment, the multi-level write need only pause, execute the read, and resume the write at the point where it paused.

Abstract: A semiconductor integrated circuit device includes a non-volatile memory having a pseudo pass function of returning a pass as a status even if a bit error reaching an allowable number of bits occurs after at least one of write or erase sequence is completed. The non-volatile memory includes an issue timing control section for controlling timing of issuing the pseudo pass function.

Abstract: An automated process for designing a memory having row/column replacement is provided. In one embodiment, a potential solution array (50) is used in conjunction with the row/column locations of memory cell failures to determine values stored in the actual solution storage circuitry (92). A selected one of these vectors stored in the actual solution storage circuitry (92) is then used to determine rows and columns in memory array (20) to be replaced with redundant rows (22, 24) and redundant columns (26).

Abstract: A method for reading data from a memory module over a bi-directional bus is provided. The method initiates with issuing a read command. Then, a strobe signal is transitioned from a mid-rail state. In one embodiment, the strobe signal is transitioned to a logical low state. A read enable signal is then transitioned prior to a first falling edge of the strobe signal. The strobe signal represents an earliest availability for valid read data being available. The valid read data is read in response to the read enable signal transition. A microprocessor and a system wherein data is read over a bi-directional bus are included.

Abstract: A dual-port memory includes a plurality of memory cells coupled to a row decoder and column logic. Each memory cell includes two storage nodes, where each storage node is coupled to a bit line via an access transistor. Each memory cell also includes a logic gate for logically combining a word line signal with a column address signal and providing the resulting output signal to the gates of the access transistors. In one embodiment, the logic gate is a NOR logic gate and in another embodiment, the logic gate is a transmission gate. This prevents a potential read disturb problem with unselected memory cells of a row. This also reduces power consumption in the memory.

Abstract: A static ram cell is described. The cell includes a pair of cross-coupled transistors and a pair of diode-connected transistors operated from a wordline that provides power to the cell. The cell has three main operating modes, reading, writing, and data retention. Reading is performed by sensing current flowing from a powered-up wordline through a conductive one of the cross-coupled transistors. Writing is performed by pulsing the source of the conductive one of the cross-coupled transistors with a positive voltage to flip the conductive states of the cross-coupled transistors. Data retention is performed by using leakage currents to retain the conductive states of the cross-coupled transistors. A decoder for an array of static ram cells may be operated synchronously and in a pipelined fashion using a rotary traveling wave oscillator that provides the clocks for the pipeline. The cell is capable of detecting an alpha particle strike with suitable circuitry.

Abstract: A ROM-type memory is provided that includes a matrix of memory cells made up of rows and columns, with each row allowing storage of a page of MUX words of N bits. An address decoder decodes addresses in order to extract the page to be read. At the output of the matrix, N multiplexers are each coupled to the columns that correspond to one of the bits of the output stage. An N-bit output stage includes at least one inverter, with each of the inverters being connected to the output of one of the multiplexers so as to restore inverted values of information to be stored to correct values. The inverted values are stored in all of the memory cells of all of the columns coupled to the one multiplexer. Storing the inverted values makes it possible to store less “0” values within the matrix and further makes LVS testing of the ROM memory considerably easier. Also provided is a method for sequentially checking groups of memory cells.

Abstract: A semiconductor storage device has a data transfer circuit capable of reducing the latency, including a control circuit for frequency-dividing external clock signal to generate readout clocks, first to fourth amplifier circuits for amplifying read data corresponding to first and fourth addresses, based on readout clock signals, a first multiplexer receiving and selectively outputting temporally preceding and temporally succeeding first and second output data from two amplifier circuits associated with two even addresses, a second multiplexer receiving and selectively outputting temporally preceding and temporally succeeding third and fourth output data from two amplifier circuits associated with two odd addresses, first and second latch circuits for latching and outputting second and fourth output data, a third multiplexer receiving first and third data and outputting the latched data in the read address sequence, a fourth multiplexer receiving second and fourth data and outputting the latched data in the rea

Abstract: Regulating a program voltage value during multilevel memory device programming includes utilizing a program path duplicate in an output pump regulator circuit. Further, the output pump regulator circuit is utilized to provide a regulated program voltage for memory cell programming, the regulated program voltage correcting for a program path voltage drop and compensating for temperature variation.

Abstract: A semiconductor memory device has common terminals shared between a part or all of address terminals for receiving n bits of an address signal and data terminals for outputting a data signal with its bit width of n bits or less and dedicated address terminals for receiving m bits of the address signal, wherein at the time of a read, after the n bits of the address signal have been input, a plurality of data signals within a selected page are consecutively read out through the common terminals using the m bits of the address signal input from the dedicated address terminals.

Abstract: A sense amplifier and a latch for sense data output the former 4 words of sense data to a latch for page data, and during a page mode reading period of the former 4 words of data as external data by the latch for page data, a selector circuit and an output buffer, perform a sense amplifying operation and a latch operation on the latter 4 words of memory cell information output from a Y gate under control of a sense signal and a latch signal.

Abstract: An apparatus and associated method for reducing power consumption in an electronic circuit comprising a refresh load device being employed alternatively between an operational mode and a state refresh mode. A supply voltage level to the refresh load device is adjusted in relation to which of the operational and state refresh modes is employed and in relation to which of a primary alternating current derived power source or a backup battery power source is employed.