Abstract: An information handling system includes: an immersion server drawer (ISD) having: an impervious enclosure which holds a volume of dielectric cooling liquid within/at the enclosure bottom. The ISD is configured with dimensions that enable insertion of liquid-cooled servers within the enclosure bottom. A plurality of liquid-cooled servers can be placed in a side-by-side configuration along one dimension of the ISD, with one or more heat dissipating components of the servers being placed below a surface layer of the cooling liquid. Submerged components of the immersion server are liquid-cooled, while the other heat generating components above the liquid surface are air cooled by rising vapor generated by boiling and vaporization of the cooling liquid. The ISD is placed in an ISD cabinet, which is configured with an upper condenser that allows for multi-phase cooling of the electronic devices placed within the immersion server drawer. The ISD cabinet can be rack-mountable.

Abstract: An apparatus (e.g., an audio amplifier) includes a housing cover configured to be fitted to a heat sink for enclosing a circuit board therebetween. The apparatus also includes a contact member formed separately from and mounted to the housing cover to cause electrical components on the circuit board to engage with the heat sink when the housing cover is fastened to the heat sink. The contact member includes first and second projections connected to each other and configured such that displacement of the first projection in a first direction causes a proportional displacement of the second projection in a second direction opposite the first direction.

Abstract: Disclosed herein are various systems and methods relating to communication devices that include modular transceivers, such as small form pluggable transceivers. According to one embodiment, a communication device may include a chassis defining an interior and an exterior of the communication device. The chassis includes a top, a bottom, and a plurality of sides that together with the top and the bottom form an enclosure. One of the sides may include a first segment disposed in a first plane and a second segment disposed in a second plane. The second segment includes an outwardly extending communication transceiver housing configured to receive a communication transceiver. The communication transceiver may extend through an aperture in the second segment and into interior of the communication device to contact an electrical connector, while a second portion of the communication transceiver in the communication transceiver housing remains on the exterior of the communication device.

Abstract: An apparatus for passively cooling electronics. The apparatus for passively cooling electronics includes at least one heat pipe and at least one heat sink thermally coupled to a bridge plate. When a cradle is thermally coupled to the at least one heat pipe, the at least one heat sink draws heat from the cradle.

Abstract: Methods of and apparatuses for electronic board assembly are provided. The apparatus can comprises one or more thermal heads controlled by a programmable logic controller. A user is able to enter the controlling parameters into the programmable logic controller through an human operator interface. The thermal heads are able to be connected with one or more pneumatic solenoid to make the thermal heads moving vertically until the thermal head in contact with the heat sink. The thermal head is able to provide a temperature, at or above the operating temperature of the thermal pad, capable of making the phase change thermal interface material to bond the heat sink and the electronic boards.

Abstract: A heat dissipating module includes a housing, a first fan and a second fan. The housing has a partition. The first fan is disposed at a side of the partition, and the second fan is disposed at the other side of the partition. The second fan has a plurality of wind deflectors, which are disposed higher than the partition.

Abstract: This disclosure relates to an apparatus and method 10 for protecting an electronic circuit from an airflow. The apparatus 10 comprises a base 12, wherein said base 12 comprises a cover means for covering at least part of the electronic circuit. The apparatus further comprises a guide means for guiding an airflow around the electronic circuit.

Abstract: The present disclosure relates to an apparatus for fastening a power semiconductor using an integral springy (elastic) clip, capable of fixing a power semiconductor, such as a diode and a MOSFET, using elasticity of a U-shaped clip by integrally molding the clip onto a housing of a plastic module. The apparatus includes an elastic (springy) clip integrally molded onto a lower surface of the housing and downwardly curved into a U-like shape in a bridge module in which a bridge of the power semiconductor protrudes through a through hole of the housing to be connected to a printed circuit board, whereby the power semiconductor is fixed by a force that the housing presses the power semiconductor.

Abstract: A telecommunication distribution box includes a housing and an electrical component mounted in the housing. A cover plate is movably connected to the housing and is movable between open and closed positions. A lip extends outwardly from the cover plate. The lip covers the electrical component when the cover plate is in the closed position to prevent accessing and removing the electrical component.

Abstract: Methods and means related to rejecting heat through thermal storage are provided. A heat sink includes internal cavities containing a phase-change material. Heat from a thermal load is rejected by flowing fluid coolant at a normal operating temperature. Failure of the fluid coolant system causes heat storage within the phase-change material at a temperature slightly greater than the normal operating temperature. Restoration of the fluid coolant system results in stored heat rejection and a return to a normal operating temperature. Normal operation of the thermal load can be performed while efforts are made to restore the fluid coolant system.

Abstract: A rack server system includes a container, an electrically conductive component, a power supply, a signal connecting base, a server, and an RMC. The electrically conductive component and the signal connecting base are fixed in the container. The power supply is electrically connected to the electrically conductive component for supplying a direct current power. The signal connecting base includes multiple connectors. The server, disposed in the container removably, includes a power input port and a connecting element. The power input port is electrically connected to the electrically conductive component removably. The connecting element is connected to the connector removably. When the connecting element is electrically connected to the connector, the RMC communicates with the server via the connecting element and the one of the connectors and determines the position of the server in the container according to another position of the connector which is electrically connected to the server.

Abstract: A method of fabricating a cooling unit is provided to facilitate cooling coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure.

Abstract: A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.

Abstract: The purpose of the present invention is to provide a power semiconductor device which has a light weight, high heat dissipation efficiency, and high rigidity. The power semiconductor device including a base 1, semiconductor circuits 2 which are arranged on the base 1, and a cooling fin 3 which cools each of the semiconductor circuits 2, in which one or more protruding portions 1a, 1b are formed on the base 1, widths of the protruding portions 1a, 1b in a direction parallel to the base 1 surface being longer than a thickness of the base 1, thereby providing power semiconductor devices 100, 200, 300, 400 which have a light weight, high heat dissipation efficiency, and high rigidity.

Abstract: A heat dissipation device for an electronic device includes a base, a plurality of fins and at least one heat pipe. The base has a front surface and a rear surface opposite to the front surface. A heat-generating component of the electronic device is disposed adjacent to the rear surface. The plurality of fins extend from the front surface of the base. The heat pipe is disposed on the front surface of the base and in a cutout portion of the plurality of fins. The heat dissipation device, which removes heat from the heat-generating component, has a low profile and improved heat dissipation capability.

Abstract: A module assembly for the application-specific construction of power factor correction, filter, and absorption circuit systems in selectively non-choked, choked, protective or thyristor-connected design, comprising a busbar system, fuse holders, switch components, at least one choke, and power capacitors. A first module unit has a first section for receiving busbars, fuse holders, fuses, a busbar cover as protection against accidental contact with the busbar, and a second, trough-like section for receiving switch components that can be mechanically fixed and electrically contacted. A second module unit is designed to receive switchable capacitor winding blocks, enclosing the at least one winding block, insulating the same. The first and the second module unit each have a base region, wherein mechanical and/or electrical connections are led via apertures in the base regions, such that either a back-to-back assembly with direct docking of the first and second module units can be affected.

Abstract: An electronic component and cooling system has a printed wiring board, which is planar. An electrical component is mounted on one side of the planar surface of the printed wiring board. A hood is positioned outwardly of the electronic component. Legs on the hood extend to the printed wiring board, and form an inner surface that is positioned away from the one side relative to the electrical component. A chassis has posts connected to the printed wiring board and on an opposed side of the planar surface of the printed wiring board from the electrical component. The chassis extends to a remote portion, beyond the printed wiring board. A heat pipe is generally elongate and positioned on an opposed side of the hood from the electrical component. The heat pipe extends to the remote portion of the chassis to transfer heat from the hood to the chassis.

Abstract: There is provided an electric device configured to cool a plurality of plug-in units, the electric device including a plurality of slots, each slot configured to install a plug-in unit, a first fan configured to create a current of air for cooling the plug-in units, a first plug-in unit installed into a first slot, and a second plug-in unit including a second fan configured to create a current of air for cooling the first plug-in unit, the second plug-in unit being installed into a second slot adjacent to the first slot, arranged to a side of mounting component of the first plug-in unit.

Abstract: A cabinet structure for a switchgear assembly. The cabinet structure includes a cabinet having upper and lower vents and a breaker cradle for holding a circuit breaker having primary disconnects for connecting the circuit breaker to bus bars. The cabinet further includes an air passageway located between the upper and lower vents, wherein the air passageway extends vertically through the primary disconnects and the cabinet. Further, the cabinet includes a fan module having at least one fan for drawing outside air through the lower vent, the air passageway and the primary disconnects for cooling the primary disconnects.

Abstract: A semiconductor switch insulation protection device and a power supply assembly. Said semiconductor switch protection device comprises a semiconductor switch having a metal component, an insulation component, and a pin installed at a bottom plane of said insulation component, and an insulation protection cover having a body with a second hole and a side belt. A front surface of said metal component is installed on a back surface of said insulation component. A metal portion, with a first hole and having a first height, is extended above an upper plane of said insulation component. Said second hole and said side belt are extended toward a back surface of said body, respectively, to form a hole column having a second height and a sidewall having a third height. Said metal portion is disposed in a groove formed by said back surface of said body, hole column and sidewall.