Patents Examined by Michail V Datskovskiy
  • Patent number: 8958207
    Abstract: The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.
    Type: Grant
    Filed: May 7, 2012
    Date of Patent: February 17, 2015
    Assignee: Fujitsu Limited
    Inventors: Yoshitaka Yamaguchi, Taisuke Iwai, Shinichi Hirose, Daiyu Kondo, Ikuo Soga, Yohei Yagishita, Yukie Sakita
  • Patent number: 8953306
    Abstract: A load center featuring a two-piece dielectric barrier that securely retains a plug-on neutral rail and methods of assembling the same. The barrier includes a shield and a base having a protrusion that cooperates with fingers of the shield to securely retain the conductor in the load center. The shield is installed over the base and rests on hooks protruding from the base. This creates a distance between the protrusion and the fingers to allow the conductor to be inserted through a gap between the fingers along the conductor's skinny edge. The conductor rotates 90 degrees until it rests on the protrusion. The base and shield are snapped together, causing the hooks of the base to attach to the shield. At the same time, the fingers of the base move downward to rest against the conductor so that it is sandwiched securely between the protrusion and the fingers.
    Type: Grant
    Filed: December 19, 2012
    Date of Patent: February 10, 2015
    Assignee: Schneider Electric USA, Inc.
    Inventors: Kim D. Wheeler, Jeffrey O. Sharp, Jason D. Potratz
  • Patent number: 8953325
    Abstract: An electronic device, including a circuit board, a communication chip, a first heat sink, a fixer and a shielding mask, is provided. The circuit board has a frame having an opening and several rims surrounding the opening. The communication chip, disposed on the circuit board, is located in the opening of the frame. The first heat sink, disposed on the communication chip, has a first surface facing and contacting the communication chip. The fixer is fixed into the circuit board and the first heat sink, such that the first heat sink remains contacting the communication chip. The shielding mask, disposed on the circuit board, includes a cover and several side boards. The cover covers the communication chip and the first heat sink, such that the cover contacts a second surface of the first heat sink. The side boards are opposite and connected to the rims in parallel.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: February 10, 2015
    Assignee: SerComm Corporation
    Inventors: Yi-Fei Yu, Yuan-Heng Huang
  • Patent number: 8953322
    Abstract: An electronic control unit for a motor of an electric fan, has a support casing including a metal body adapted to act as a heat dissipator, a shell of an electrically insulating material coupled with the metal body, and a circuit board, mounted in contact with the dissipator body. The circuit board has a conductive connection member in the form of a flexible metal blade, electrically connected to the dissipator body, to provide an earth connection for the circuit board. The blade has a portion that projects beyond the edge of the board. The insulating shell has an internal formation which, upon coupling the shell with the dissipator body, interacts with the projecting portion of the blade, deforming it so as to bring it and thereafter maintain it in contact with the dissipator body in a resiliently loaded manner.
    Type: Grant
    Filed: December 19, 2012
    Date of Patent: February 10, 2015
    Assignee: Johnson Electric S.A.
    Inventors: Marco Bussa, Franco Quagliata
  • Patent number: 8934217
    Abstract: A power operator for switchgear for use in mains power distribution systems such as public medium high voltage distribution systems, where the switchgear comprises a closed cabinet (5) with an operating shaft protruding therefrom that is rotatable between two positions and has a coupling part. The motor operator includes a housing (11, 20, 21, 27) which is mountable on an external surface (4) of the switchgear cabinet (5), and a rotatable connection shaft connected to an electromechanical linear actuator. The connection shaft has a first coupling part which connects with the coupling part of the switchgear in a longitudinal axial sliding and non-rotational interlocking manner. The housing (11, 20, 21, 27) is a tube element which is tamper resistant, is relatively easy to seal against dust and moisture, and is inexpensive to manufacture.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: January 13, 2015
    Assignee: Linak A/S
    Inventors: Bruno Christensen, Anders Lorenzen, Verner Smidt, Jens N. Paulsen, Glenn Smith
  • Patent number: 8929079
    Abstract: An electronic control device comprises a circuit board having a heat generating part mounted thereon; a case for installing therein the circuit board, the case having a heat receiving portion that is in contact with the heat generating part; at least two first fixing units that are constructed and arranged to fix a peripheral portion of the circuit board to the case; and at least one second fixing unit that is arranged to fix a given area of the circuit board to the case while pressing the given area against the heat receiving portion through the heat generating part, the given area being an area where the heat generating part is placed.
    Type: Grant
    Filed: September 7, 2012
    Date of Patent: January 6, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Hirofumi Watanabe, Kazuhiko Nakano, Daisuke Yasukawa
  • Patent number: 8929077
    Abstract: A thermal connector for use with a printed circuit board assembly is disclosed. The thermal connector includes a top segment configured for thermal engagement with a heat source disposed on a top surface of a printed circuit board and for insertion through an opening of the printed circuit board to thermally engage the heat source. A middle segment of the thermal connector extends from the top segment and includes a flanged portion configured to engage a bottom surface of the printed circuit board when the top segment is inserted through the opening of the printed circuit board. A bottom segment of the thermal connector extends from the middle segment and is configured for thermal engagement to a heat dissipating element.
    Type: Grant
    Filed: October 3, 2012
    Date of Patent: January 6, 2015
    Assignee: TEM Products Inc.
    Inventor: Dean Gouramanis
  • Patent number: 8929070
    Abstract: An expansion apparatus suitable for an electronic apparatus is provided. The expansion apparatus includes a base, a supporter and an airflow guiding structure. The base has a first fan disposed therein. The supporter is pivoted to the base along a rotating axis and has a cooling channel. The cooling channel has a first port and a second port opposite to the first port. When the electronic apparatus is assembled to the supporter, the second port of the cooling channel faces to the electronic apparatus. The airflow guiding structure is disposed between the supporter and the base movably. When the supporter is pivoted relative to the base to an expanded state, an active airflow generated by the first fan is guided by the airflow guiding structure to pass through the base and the electronic apparatus. An electronic equipment including the expansion apparatus is also provided.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: January 6, 2015
    Assignee: Compal Electronics, Inc.
    Inventors: Shih-Huei Liu, Chun-Jen Shih, Ching-Hsuan Wang, Pan-Jen Chen, Po-Han Chen
  • Patent number: 8929055
    Abstract: A plug-on load center featuring snap-in or snap-on neutral rails that are retained securely in the load center on or between a dielectric barrier without requiring any fasteners and assembled by installing the dielectric components and neutral rail along the same direction orthogonal to a rear wall of an enclosure that houses the load center. The snap-in configurations feature dielectric barriers with fingers that create a snap-fit connection between the neutral rail and a shield member. The neutral rail is forced between the fingers, which separate and then snap back to their original position once the neutral rail is fully seated in the dielectric barrier. The snap-on configurations feature a neutral rail that is snapped onto the dielectric barrier and retained in the load without any fasteners. The barrier can include retention members that snap-fit into corresponding features of the neutral rail when it is installed onto the barrier.
    Type: Grant
    Filed: December 19, 2012
    Date of Patent: January 6, 2015
    Assignee: Schneider Electric USA, Inc.
    Inventors: Jason D. Potratz, David R. Pearson, William J. Broghammer
  • Patent number: 8923004
    Abstract: Several embodiments of stacked-die microelectronic packages with small footprints and associated methods of manufacturing are disclosed herein. In one embodiment, the package includes a substrate, a first die carried by the substrate, and a second die between the first die and the substrate. The first die has a first footprint, and the second die has a second footprint that is smaller than the first footprint of the first die. The package further includes an adhesive having a first portion adjacent to a second portion. The first portion is between the first die and the second die, and the second portion being between the first die and the substrate.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: December 30, 2014
    Assignee: Micron Technology, Inc.
    Inventors: Peng Wang Low, Leng Cher Kuah, Hong Wan Ng, Seng Kim Ye, Chye Lin Toh
  • Patent number: 8922991
    Abstract: A computer assembly includes a processor integrated circuit; a hard disk drive electrically connected to the processor integrated circuit and a power supply assembly, powering the processor integrated circuit and hard disk drive; a liquid-tight case, entirely containing and physically isolating and protecting the processor integrated circuit, hard disk drive and power supply assembly, the liquid-tight case defining fluid channels; electrical connectors to permit connection of the computer to outside devices; and a fan in the liquid-tight case, adapted to drive fluid through the fluid channel, thereby facilitating the movement of heat through the computer assembly.
    Type: Grant
    Filed: October 5, 2012
    Date of Patent: December 30, 2014
    Assignee: Aplus Mobile Inc.
    Inventors: Tim Faucett, Scott Westfall
  • Patent number: 8922977
    Abstract: In an electrical distribution cabinet a mechanism providing quick, reliable, passive arc blast control has a flue chamber surrounding the likely arc site such as an electrical connection point. The flue chamber provides a flue channel which lengthens the arc and attenuates the current and temperature until the arc is extinguished. Preferably, the flue chamber and channel are formed of opposable open-faced polyhedral structures, one fitting inside the other. The mechanism is particularly suited for draw-out circuit breaker connections in a switch gear cabinet.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: December 30, 2014
    Assignee: Schneider Electric USA, Inc.
    Inventor: Timothy Robert Faber
  • Patent number: 8913385
    Abstract: A cooling system comprises an electronics module and a duct. The electronics module produces more heat at a first location than at a second location, and is rated to a safe operating temperature. The duct surrounds the electronics module, and has a shaped baffle with a constricted region near the first location and an open region near the second location. The expanded region has greater cross-sectional flow area than the constricted region. Airflow through the duct cools both the first location and the second location to within an efficiency margin below the safe operating temperature.
    Type: Grant
    Filed: October 8, 2012
    Date of Patent: December 16, 2014
    Assignee: Hamilton Sundstrand Corporation
    Inventor: Robert Scott Downing
  • Patent number: 8913370
    Abstract: A spout assembly is provided. The spout assembly includes a spout and a spout base. The spout base has a cross-sectional area that is smaller than a spout sized to enclose an electrical switching apparatus electrical coupling. That is, the spout base includes a CT support surface with a cross-sectional area that is smaller than the spout cross-sectional area. Current transformers are disposed upon the spout base CT support surface.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: December 16, 2014
    Assignee: Eaton Corporation
    Inventors: James E. Smith, Brad Robert Leccia, Steven Z. Chen
  • Patent number: 8913381
    Abstract: A server cooling device is described that includes an enclosure defining an interior space and at least one server rack port configured to engage a rack such that one or more rack mounted units installed in the rack interface with the interior space. The server cooling device also includes a mixing chamber including one or more cooling coils that is connected to the interior space defined by the enclosure.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: December 16, 2014
    Assignee: Yahoo! Inc.
    Inventors: Scott Noteboom, Albert Dell Robison, Jesus Suarez, Norman Holt
  • Patent number: 8913390
    Abstract: An electronic device may have electrical components that generate heat. The components may be mounted on a printed circuit board having a peripheral edge with an edge surface. The edge surface may be coated with a layer of metal. Metal traces in the printed circuit board such as ground plane traces may be used to conduct heat from the electrical components to the layer of metal on the edge surface. The edge surface may be separated from an adjacent thermally conductive electronic device housing structure by an air gap. Thermally conductive elastomeric bumper structures may bridge the air gap between the edge surface of the printed circuit and the housing structure. The thermally conductive elastomeric bumper structures may conduct heat from the layer of metal on the edge surface to the housing structure and may serve as a cushioning interface between the printed circuit and the housing structure.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: December 16, 2014
    Assignee: Apple Inc.
    Inventors: Shayan Malek, Michael B. Wittenberg, Miguel C. Christophy
  • Patent number: 8908356
    Abstract: An electrical cabinet for housing and interconnecting photovoltaic BOS components can include a plurality of busbars and adjustable fuse mounts to allow for integration of BOS components in a compact space. The cabinet may comprises a base, a busbar mounted on the base, a plurality of standoff devices, and a cover containing the base, the busbar, and the standoff devices. The standoff devices are spaced apart from the busbar. Each standoff device includes a standoff member slideably mounted on the base.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: December 9, 2014
    Inventor: Xuejun James Wang
  • Patent number: 8902589
    Abstract: A semiconductor module and a cooler capable of cooling a semiconductor element efficiently. The semiconductor module supplies a refrigerant to a water jacket configuring the cooler, to cool a circuit element part disposed on an outer surface of a fin base. This semiconductor module has: a fin connected thermally to the circuit element part; a refrigerant introducing passage in the water jacket, which has a guide part that has one surface and another surface inclined to guide the refrigerant toward one side surface of the fin; a refrigerant discharge passage disposed in the water jacket to be parallel to the refrigerant introducing passage, which has a side wall parallel to another side surface of the fin; and a cooling passage formed in a position for communicating the refrigerant introducing passage and the refrigerant discharge passage with each other in the water jacket. The fin is disposed in the cooling passage.
    Type: Grant
    Filed: April 21, 2011
    Date of Patent: December 2, 2014
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Hiromichi Gohara, Takeshi Ichimura, Akira Morozumi
  • Patent number: 8902582
    Abstract: A coldplate for use with a transformer in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having a recess formed therein, the recess having a floor configured for contacting a bottom surface of a transformer for dissipating heat generated by the transformer. The main portion includes a raised feature configured for contacting a winding of the transformer for dissipating heat generated by the transformer. The coldplate also includes a bracket member for use in securing the transformer in the recess of the main portion, the bracket member configured for contacting the main portion and the transformer for dissipating heat generated by the transformer. The bracket member includes a contact surface for contacting a top surface of the transformer, the contact surface having an area sufficient to contact substantially all of the top surface of the transformer.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: December 2, 2014
    Assignee: Lear Corporation
    Inventors: Venkat Yalamanchili, Rutunj Rai
  • Patent number: 8896988
    Abstract: A system having electrical equipment integrated on a structure is provided. The system includes at least one electrical equipment located at a spaced apart relationship and mounted on at least one structure. A method is provided for isolation of electrical equipment. The method includes opening and closing a contact by engaging or disengaging one or more terminals of the electrical equipment correspondingly with a supply line or a distribution line by a mechanism for isolation. The mechanism can be a handle or a moving mechanism which is associated with a movement in a vertical direction or horizontal direction or with a movement that provides isolation.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: November 25, 2014
    Assignee: ABB Technology AG
    Inventors: Dukkaiappan Subbaiahthever, Ramesh Viswanathan, Balachandra Narayan Varade, Maheswaran Chandrasekaran, Satish Baburao Bhalerao, Kishor Bhikaji Wadhe