Abstract: An object of the invention is to provide an electronic component mounting system and an electronic component mounting method which can execute component mounting work on a plurality of boards simultaneously, concurrently and efficiently so that high productivity and responsiveness to production of many items can be achieved consistently.

Abstract: In an electronic components mounting process fabricating a mount circuit board due to an electronic components mounting system formed of a plurality of electronic components mounting apparatuses by connecting them to each other, data of solder paste position which is printed on the circuit board is transmitted as feedforward data to an electronic components placement apparatus and a placement state inspecting apparatus. A control parameter which controls a placing position in a components placement operation due to the electronic components placement apparatus and an inspection parameter which indicates a standard position of the components in a placement state inspection are updated on the basis of the soldering position data. Therefore, it is possible to achieve a precise mounting by effectively and properly using inspection information obtained from each process.

Abstract: A randomized elliptical grid disposed on a sensor window for electro-magnetic and/or radio-frequency shielding of sensors, and a method of applying same. Grids may be made of electrically conductive or resistive material and may include elliptical or circular shapes. The shapes are in physical contact with each-other and preferably do not contain straight lines to reduce detection artifacts caused by the coating. Grid element shape, size, orientation, and grid pattern density may be randomized or varied across a sensor window.

Abstract: A head assembly for a chip mounter is provided. The head assembly includes a nozzle module disposed above a printed circuit board (PCB) and configured to pick up and move an electronic component to mount the electronic component on the PCB, and a component recognition module electrically connected to the nozzle module and configured to recognize presence of the electronic component, a distance between the PCB and the nozzle module, and alignment of the electronic component at least one given moving position of the electronic component.

Abstract: A method for producing a device having a transponder antenna connected to contact pads. An antenna with terminal connections is provided in contact with a substrate. The contact pads are placed on the substrate and connected to the terminal sections of the antenna. The connection is produced by means of a soldering by introducing energy between the pads and the terminal sections. The pads are placed such as to provide a surface facing an antenna terminal connection section. The section is arranged on the substrate and the soldering energy is directly applied to the pads. The invention also relates to the device obtained.

Abstract: A connector compression tool is provided wherein the tool includes a handle, pivotally moveable from a second position to a first position, a body, configured to compress together when the handle is moved to the first position, wherein the body includes at least two centering openings having different widths to accommodate differently configured connectors having different diameters and different lengths.

Abstract: A disassembly apparatus of a power generator installed in a nacelle has an I-shaped beam, a pressing plate, anchor bolts, a trolley and a chain block. The I-shaped beam extends horizontally above the frame of the power generator. The pressing plate is disposed on the I-shaped beam. The anchor bolts extend along both sides of the I-shaped beam to pierce the pressing plate and are screwed into threaded holes extending downward of the frame. The trolley is provided movably to roll on the upper surface of the lower flange. The chain block is hung from the trolley. The flange removed from the frame is hung and moved vertically by the chain block, and is moved horizontally by the trolley.

Abstract: A method for fabricating an antenna device of a mobile communication terminal, the method including selecting radiation patterns according to a usable frequency band, selecting and fabricating magneto dielectric modules for adjusting resonance frequencies of the selected radiation patterns, selecting and fabricating dielectric modules for adjusting resonance frequency of the selected radiation patterns, selecting and fabricating a radiation pattern having a number of resonance frequencies required for the terminal from among the radiation patterns selected in the pattern selection step, and selecting at least one of the magneto dielectric modules and the dielectric modules and installing it in the radiation pattern to tune a resonance frequency of the radiation pattern to the resonance frequency required for the terminal.

Abstract: A procedure for centrifugally casting a shorted structure around induction motor rotors is described. The method is commonly applied to a plurality of rotors disposed and arranged for rotational balance and supported on a suitable support, or optionally, on a plurality of supports arranged in layered fashion about a common rotational axis. The method comprises forming a wax representation of the shorted structure around a lamination stack; mounting a plurality of such lamination stacks in a mounting fixture and-attaching a suitable gating and runner system; forming an investment by coating the structure with refractory followed by melting out the wax; casting molten metal into the investment while it is rotating and aligning the mold to allow the centrifugal force generated to promote mold filling; and, continuing to rotate the investment until solidification is substantially complete.

Abstract: A device suitable for placing a component on a substrate is provided with a component feeding device, a component pick-and-place device comprising a nozzle, a substrate carrier, means for moving the component pick-and-place device from the component feeding device to the substrate carrier and vice versa. A global measuring system is provided for determining the position of the component pick-and-place device during movement of the component pick-and-place device from the component feeding device to the substrate carrier and vice versa. The device is further provided with a local measuring system, remote from the global measuring system, for almost continually determining, in the proximity of a desired position of the component on the substrate, the position of the component pick-and-place device with respect to the substrate. The local measuring system is located closer to the substrate carrier than the global measuring system.

Abstract: A connector assembling jig is used for a housing (20) that includes a main body (22) with terminal accommodating portions (21) and locking pieces (23) for locking terminal fittings (10) in the terminal accommodating portions (21) and in which each locking piece (23) projects from the main body (22) in an insufficient inserted state of the corresponding terminal fitting (10), and can detect insufficient insertion of the terminal fitting (10) when the terminal fitting (10) is inserted into the terminal accommodating portion (21). The connector assembling jig has a holder (30) including an accommodating recess (34) for the housing (20) and a detection arm (32) which is set to an insufficient insertion detecting posture when any locking piece (23) projects, and the accommodating recess (34) is formed with a positioning groove (68) for receiving a positioning rib (24) of the housing (20).

Abstract: A method for manufacture of an electronic interface card including defining a pair of apertures in a substrate layer, associating an antenna with the substrate layer such that opposite ends of the antenna terminate at the apertures, placing a conductor in each of the apertures, connecting the antenna to the conductor, forming a recess in the substrate layer, attaching continuous connection wires to a plurality of chip modules, attaching the continuous connection wires to a plurality of conductors on a corresponding plurality of the substrate layers, cutting the continuous connection wires so as to retain portions thereof which connect each chip module to a corresponding pair of conductors and sealing the chip module in the recess.

Abstract: In an electronic component mounting apparatus that is used in an electronic component mounting line for producing a mounted substrate by mounting electronic components on a substrate and that subjects the substrate to predetermined operation, a working unit attachment section 30 is provided within a range of movement of a working head, such as a loading head and a paste coating head, wherein a nozzle stocker 9 and a paste trial coating unit 10 can be removably attached as a working unit for performing specific additional operation appropriate for working function of the working head. The nozzle stoker 9 and the paste trial coating unit 10 are attached to the working unit attachment section 30 according to the type of working head.

Abstract: The disclosure is related to a method and a device of manufacturing a speaker. First, a roll element is fabricated by a roll-based manufacturing process and by using a material feeder, and the roll element is cut into many sheet elements by using a cutter. An inserting device is used to insert the sheet elements into a temporary storage device, and an extracting device is used to extract the sheet elements from the temporary storage device and place the sheet elements on another roll element fabricated by another roll-based manufacturing process and by using another material feeder. The sheet elements and the other roll element are combined. The roll elements and sheet elements may be vibrating membranes and porous electrodes of a flat speaker.

Abstract: A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate.

Abstract: Equipment for manufacturing a stator comprises a coil conduction mechanism which can supply a current to input terminals of a stator, and a heater mechanism having first and second panel heaters which are provided to face the stator. Heat is generated from a coil by supplying a current to the coil from the coil conduction mechanism and sealants filling the stator are heated. On the other hand, the first and second panel heaters are heated by supplying a current and the sealants are heated from the outside. The operation is controlled such that the heating temperature for the sealants by heat generated from the coil and the heating temperature for the sealants by the heater mechanism are uniform.

Abstract: A method of manufacturing a circuit board (PCB) with light emitting diodes includes a channel through the PCB to define first and second sides diametrically opposed from each other, a plurality of first legs from the first side towards the second side, and a plurality of second legs from the second side towards the first side, and alternating across the PCB from the first side to the second side the plurality of legs. The channel thus runs along top and bottom edges defined between a pair of adjacent first and second legs. Bridges are provided along the channel physically connecting the first side to the second legs, and/or connecting the second side to the first legs, and/or connecting between the first and second legs. Lastly, LEDs are populated along the sides and legs.

Abstract: A multi-frequency GNSS antenna is provided which can be manufactured from PCB materials and exhibits good multipath rejection. The antenna is capable of receiving RHCP signals from all visible GNSS satellites across a wide beamwidth. A multi-frequency GNSS antenna manufacturing method includes the steps of providing PCB base and support assemblies, first and second feed networks and connecting said first and second feed networks to first and second hybrid connector outputs.

Abstract: An apparatus for manufacturing wireless communication devices for use in tracking or identifying other items uses cutting techniques that allow the size of an antenna for the wireless communication device to vary. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each one effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.

Abstract: A component mounting system including mounting machines along a direction of conveying a circuit board; a feeder mount base in each of the mounting machines; a feeder removably mounted on the feeder mount base of each of the mounting machines; a mounting head in each of the mounting machines, the mounting head sucking a component supplied from the feeder for mounting on the circuit board; a moving mechanism in each of the mounting machines, the moving mechanism configured to removably mount and move the mounting head; an inspection camera unit configured to image an inspection target part of the circuit board; and an inspection image processing unit mounted, replaceably with the feeder, on the feeder mount base where the inspection camera unit is mounted, the inspection image processing unit processing an image signal output from the inspection camera unit to inspect the inspection target part.