Abstract: A rework soldering jig is used for heating a surface mounted slot. The rework soldering jig includes a body and an assembly frame. The assembly frame is detachably disposed on the body. The body and the assembly frame together wrap the surface mounted slot. Since the rework soldering jig has the detachable assembly frame, a size thereof can be adjusted according to different forms of slots.

Abstract: The invention relates to a device for applying an electronic component having terminal faces, to a substrate, also having terminal faces, wherein the component is removed from a feeding device by means of an application device. An application device subsequently positions the component on the substrate in such a manner that the component terminal faces which extend from a contact side of the component up to a component rear side and the substrate terminal faces are in an overlapping position. A direct application of laser energy subsequently contacts the terminal faces to the component terminal faces. The application device has a contact nozzle with a component accommodating area for accommodating the component. The contact nozzle has a vacuum opening coupled to a vacuum duct and an emission opening for applying laser radiation to the component.

Abstract: A method of manufacturing a laminated stator core includes: forming a band-shaped yoke core sub-piece having a shape that an outer half is developed in a straight line when a yoke portion of the laminated stator core is divided into two halves in the width direction by punching a metal plate; forming an outer laminated yoke body by winding and laminating the band-shaped yoke core sub-piece in a spiral shape and coupling it in a caulking manner; forming an inner yoke-attachment magnetic core sub-piece having an inner yoke sub-portion obtained by dividing the inner half in a unit of magnetic poles when the yoke portion of the laminated stator core is divided into two halves in the width direction, by punching a metal plate; forming an inner yoke-attachment laminated magnetic sub-body by laminating and coupling a predetermined number of the inner yoke-attachment magnetic core sub-pieces to each other in a caulking manner; forming an intermediate assembly in which the inner yoke sub-portions form a ring shape by

Abstract: A method of forming a multi-lobed nozzle in a nozzle plate. A mask may be used to pattern photoresist on the nozzle plate or for patterning a polymer dry film, for example, which is then used for etching the plate to form multi-lobed nozzles. The formed nozzle plate is disposed over a substrate having a chamber for fluid formed therein and the chamber may include walls for supporting the nozzle plate. The fluid chamber includes a heater over the substrate for ejecting fluid through the nozzle via rapid heating of the fluid. Continuous supply of fluid is provided by forming a fluid supply channel in communication with the fluid chamber.

Abstract: A method of mounting supply components includes the step of inserting dish-like members into a base. Each dish-like member holds components. One dish-like member can stay inserted in the base while the other dish-like member is removed from the base and refilled with components.

Abstract: Staking apparatus (22) disclosed performs a method for staking one or more fasteners (44) of a part assembly (18) are provided by a conveyor (14), a lower lift and lock assembly (24) including a lower lifter (28) and a lower lock (30), and an upper press (26). Lower and upper staking punches (40, 60) of the lower lifter (28) and the upper press (26), respectively, provide the staking while at least one and preferably a plurality of springs (36) resiliently support a pallet assembly (16) on which the part assembly (18) is positioned.

Abstract: An electronic component installation apparatus 4 which constructs an electronic component mounting line 1 and installs an electronic component on a substrate is configured to include substrate conveyance lanes L1, L3 as two conveyance paths for feed which respectively feed the substrate carried from the upstream side to the downstream side, the conveyance paths for feed in which substrate positioning parts for positioning and holding the substrate in installation work positions are disposed between two component installation parts 22A, 22B for taking the electronic components out of component supply parts 23A, 23B and transferring and installing the electronic components to the substrate, and a substrate conveyance lane L2 as a return conveyance path which returns the substrate carried from the downstream side to the upstream side and is disposed in a state of being sandwiched between the substrate conveyance lanes L1, L3.

Abstract: Methods of making an radio frequency (RF) antenna containing element are provided. The methods comprise providing a metal foil laminate bonded to a carrier layer. The metal foil laminate can have a metal foil layer bonded to a reinforcement layer. The methods further comprise cutting an antenna pattern through the metal foil laminate to the carrier layer, and removing an undesired matrix portion of the reinforced metal foil laminate to provide a metal foil laminate antenna disposed on the carrier layer.

Abstract: A system and apparatus that removes and collects non-functional wire assemblies from dicorotron units is described. It has a removal tool with flexible levers mounted on the top of a storage box. The removal tool has an open top and bottom, the open bottom is aligned with an opening in the top of the box to permit a dislodged anchor and wire assembly to fall therethrough.

Abstract: A method for manufacturing an antenna includes steps as follows. First, a substrate is provided, wherein a surface of the substrate has an antenna region. Then, the surface of the substrate is electroless plated with a metal medium, so that the surface is covered with the metal medium. Then, the metal medium is covered with a resist. Then, a portion of the resist in the antenna region is removed. Then, the antenna region is electroplated with metal material to form an antenna main body. Then, a remaining portion of the resist is removed, and excluding a portion of the metal medium in the antenna region, the other portion of the metal medium is also removed from the substrate.

Abstract: A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate.

Abstract: A method of mounting electronic components on a printed board includes providing a storage tape including a first portion and a second portion that are connected by a connection tape and containing electronic components stored therein, advancing the storage tape so that an electronic component is advanced to a component pickup position where electronic components are picked up by a suction nozzle, picking up the advanced electronic component at the component pickup position by the suction nozzle, and mounting the picked up electronic component on a printed board. The advancing of the storage tape, the picking up of the electronic component and the mounting of the electronic component are repeated, and the component pickup position is adjusted when the second portion of the storage tape is advanced to the component pickup position.

Abstract: An apparatus and method for aligning one or more components while attaching the component to a substrate. The component is positioned over the substrate. An alignment tool is attachable to the component. The alignment tool includes a tool alignment element, an optical tool, and a substrate alignment element attached to the substrate. The tool alignment element being alignable with the substrate alignment element such that the components are positioned at specified locations on the substrate for attachment to the substrate. Further, in the method according to the disclosure, the tool alignment element aligning with the substrate alignment element to position one or more components at a specified location on the substrate.

Abstract: A method for forming an antenna structure is provided, including the following steps of: providing a non-conductive frame and disposing a plating resist material on the non-conductive frame, removing a part of the plating resist material within a predetermined region on the non-conductive frame and forming a roughened surface on the non-conductive frame within the predetermined region by laser marking, forming a medium layer on the roughened surface, wherein the medium layer comprises Pd or Ag, removing the plating resist material on the non-conductive frame, and forming a metal layer on the medium layer.

Abstract: A method of making a ceramic waveguide delay line includes the step of providing several slices or slabs of dielectric material, each including a layer of metal material applied to respective opposed side surfaces thereof. The slices are then fired in an oven to fuse the layers of metal material to the slices. The slices are then stacked together to form a core which is then dried and subsequently fired. An area of metal material is applied to the outer surface of the core. The core is subsequently dried and fired in an oven.

Abstract: A method of preparing wireless communication chips for later processing includes receiving a carrier tape that is carrying a wireless communication chip positioned inside a container on the carrier tape and beneath a protective adhesive. The protective adhesive is stripped from the carrier tape. Using an apparatus having a first roller, the carrier tape is passed over the first roller, and the wireless communication chip is forced into contact with an adhesive tape for later processing. Also disclosed is a system for preparing wireless communication chips for later processing.

Abstract: An apparatus for mounting semiconductor chips as flip chips on a substrate includes a chip supply, a pick-and-place system with a bonding head having a chip gripper, a flipping apparatus operable to rotate the chip from a first position to a second (flipped) position through an angle with a gripper and two cameras. The first camera determines a position of the chip before the flipping apparatus receives the chip and also determines a position of the flipped chip received by the chip gripper of the bonding head once the flipping apparatus has transferred the chip to it. The apparatus also comprises an optical switch, e.g., a rotatable mirror located in the field of view of the first camera. The mirror operates to rotate with the gripper of the flipping apparatus but at half the angle.

Abstract: A mold houses a least one cutting die that defines a die axis. The mold has at least one punch aligned with the die axis and movable in a reciprocating manner that cooperates with the at least one cutting die to cut the laminate into the laminations by carrying out cutting steps. The mold has a centering device within the mold that locks the at least one cutting die into a desired position prior to each of the cutting steps. A punching movement of the at least one punch is coordinated with a feeding movement of the laminate to a location within the mold that is interposed between the at least one punch and the cutting die.

Abstract: Methods of fabricating an array capacitor are disclosed, in which via structures of the array capacitor have increased uniformity in their transverse areas. One method involves perforating a capacitor body to form first holes extending from a first surface and partially through the capacitor body. The capacitor body may be further perforated to form second holes extending from a second opposed surface of the capacitor body. The second holes are to connect to the first holes to provide through holes extending across a thickness of the capacitor body. An appropriate conductive material may then be filled in the through holes to form via structures with increased uniformity in their transverse areas.

Abstract: A rotor attachment apparatus for attaching a rotor of a motor coaxially to a crankshaft by inserting the rotor into a rotor housing that is attached to an engine, including: a rotor support member; rotor positioning members that engage some of a plurality of bolt insertion holes provided in the rotor, to thereby position the rotor; a temporary fixation bolt that temporarily fixes the rotor on the rotor support member; a drive shaft a tip portion of which is engaged with a shaft end portion of the crankshaft, and which supports the rotor support member movably in an axis direction via a screw mechanism; a base member that moves the rotor support member toward and away from the rotor while rotatably supporting a base end of the drive shaft; base positioning members that engage the rotor housing; and a fastening mechanism which engages a head of a coupling bolt inserted into at least one of the bolt insertion holes, and which is supported by the rotor support member so as to bias the coupling bolt toward the rot