Abstract: Provided are a method for receiving/decoding a system information block by a terminal and a device for supporting same. The terminal can receive one or more MIBs and receive/decode a first SIB on the basis of the received MIBs and a first time offset. The first SIB is an SIB which has been newly defined for a terminal having low complexity.

Abstract: Systems, circuits and methods for controlling the word line voltage applied to word line transistors in Spin Transfer Torque Magnetoresistive Random Access Memory (STT-MRAM) are disclosed. One embodiment is directed to a STT-MRAM including a bit cell having a magnetic tunnel junction (MTJ) and a word line transistor. The bit cell is coupled to a bit line and a source line. A word line driver is coupled to a gate of the word line transistor. A write-back circuit configured to detect a read value of the bit cell and is configured to write back the read value to the bit cell after a read operation.

Abstract: A memory has a method of operating that includes performing operations of a first type and a second type. A first voltage is coupled to a power supply node of a first memory cell of a memory array during a first operation of the first type. The first voltage is decoupled from the power supply node in response to terminating the first operation of the first type so as to allow the power supply node to drift. If the power supply node drifts to a second voltage, a power supply source is coupled to the power supply node. This is useful in reducing power in the circuit that produces the first voltage.

Abstract: Some embodiments include a number of nodes configured to receive a number of signals. The signals may represent information stored in a number of memory cells of a device such as a memory device. The device may include a number of transfer paths having storage elements coupled between the nodes and an output node. The transfer paths may be configured to transfer a selected signal of the signals from one of the nodes to the output node via one of the transfer paths. The transfer paths may be configured to hold a value of the selected signal in only one of the storage elements. Each of the transfer paths may include only one of the storage elements. Other embodiments including additional apparatus, systems, and methods are disclosed.

Abstract: Embodiments include but are not limited to apparatuses and systems including a main memory array, at least one erase status memory cell associated with the main memory array and configured to store a value indicative of an erase completion status of the main memory array, and a control module operatively coupled to the at least one erase status memory cell, the control module configured to perform operations on the main memory array based at least in part on the value stored in the at least one erase status memory cell. Other embodiments may be described and claimed.

Abstract: A semiconductor device includes a SRAM having a pair of MCSFETs connected as access transistors (pass gates). A design structure embodied or stored in a machine readable medium includes a SRAM having two MCSFETs connected as access transistors.

Abstract: Circuits and methods are described for decoding exemplary memory arrays of programmable and, in some embodiments, re-writable passive element memory cells, which are particularly useful for extremely dense three-dimensional memory arrays having more than one memory plane. In addition, circuits and methods are described for selecting one or more array blocks of such a memory array, for selecting one or more word lines and bit lines within selected array blocks, for conveying data information to and from selected memory cells within selected array blocks, and for conveying unselected bias conditions to unselected array blocks.

Abstract: Apparatus and systems are provided for thermal regulation of a memory integrated circuit (“IC”). The apparatus and systems may include a thermal sensor on a memory IC, and a heating element coupled to the thermal sensor. The heating element is adapted to heat the memory IC in response to a signal from the thermal sensor. Other aspects are also provided.

Abstract: A memory device includes a clock buffer circuit. The clock buffer circuit includes a cross-coupled logic circuit. The cross-coupled logic circuit has at least two logic gates in which an output of at least one of the logic gates is coupled to an input of at least one of the logic gates. The cross-coupled logic circuit is coupled to an input for accepting a clock signal. The memory device also includes a clock driver operable to generate a clock signal from the output of the cross-coupled logic circuit. A feedback loop from the clock signal to the cross-coupled logic circuit controls the cross-coupled logic circuit. A buffer circuit including a tri-state inverter is coupled to the clock signal to maintain the clock signal while avoiding contention with the clock generator. The memory device is enabled by a chip select signal.

Abstract: A semiconductor integrated circuit includes a data bus inversion (DBI) flag generating unit to generate DBI flag signals using a plurality of output data sets, a data inverting unit to invert the plurality of output data sets according to the DBI flag signals and transmit the plurality of output data sets through global transmission lines, and a plurality of data output units to output the plurality of output data sets, which are transmitted through the global transmission lines by pads.

Abstract: Various circuits include MOS transistors that have a bulk voltage terminal for receiving a bulk voltage that is different from a supply voltage and ground. The bulk voltage may be selectively set so that some MOS transistors have a bulk voltage set to the supply voltage or ground and other MOS transistors have a bulk voltage that is different. The bulk voltage may be set to forward or reverse bias pn junctions in the MOS transistor. The various circuits include comparators, operational amplifiers, sensing circuits, decoding circuits and the other circuits. The circuits may be included in a memory system.

Abstract: Example embodiments relate to a semiconductor memory device that includes an address coding method for a multi-word line test, for example, an address coding method to test a semiconductor memory device having a cell block row selection circuit. The semiconductor memory device may include a plurality of memory cell blocks, where each memory cell block may include memory cells coupled to a bit line. The method may include coding row addresses of the memory cell block by dividing one or more row addresses corresponding to cell blocks of the memory cell block to create sub-cell blocks and adding the sub-cell blocs into the main cell blocks to create a logical memory block, which enables word lines of the main cell blocks and sub-cell blocks at the same time.

Abstract: A memory cell comprising a ferroelectric capacitor, a variable impedance element and a conductive load is disclosed. The ferroelectric capacitor, characterized by first and second polarization states, is connected between a control terminal and a first switch terminal. The variable impedance element has an impedance between the first and second switch terminals that is determined by a signal on a control terminal. The conductive load is connected between a first power terminal and the first switch terminal. The second switch terminal is connected to a second power terminal. When a potential difference is applied between the first and second power terminals, a potential on the first switch terminal varies in a manner determined by the state of polarization of the ferroelectric capacitor.

Abstract: A MRAM structure is described that has a dedicated data storage layer formed between first and second electrodes and a dedicated data sensing layer between second and third electrodes to enable separate read and write functions. A diode between the storage layer and first electrode allows a heating current to flow between first and second electrodes to switch the data storage layer while a field is applied. A second diode between the sensing layer and third electrode enables a sensing current to flow only between second and third electrodes during a read process. Data storage and sensing layers and the three electrodes may be arranged in a vertical stack or the sensing layer, second diode, and third electrode may be shifted between adjacent stacks each containing first and second electrodes, a storage layer, and first diode. Second electrode and the sensing layer may be continuous elements through multiple MRAMs.

Abstract: A non-volatile storage system includes a substrate, control circuitry on the substrate, a three dimensional memory array (above the substrate) that includes a plurality of memory cells with reversible resistance-switching elements, and circuits to SET and RESET the resistance-switching elements. The circuits that RESET the resistance-switching elements provide a pulse to the memory cells that is large enough in magnitude to SET and RESET the memory cells, and long enough to potentially RESET the memory cell but not long enough to SET the memory cells.

Abstract: A semiconductor storage device includes a first memory cell for storing two kinds of states, a second memory cell for storing two kinds of states, and a sense amplifier for detecting a potential difference between voltages equivalent to readout currents of the first and second memory cells, respectively. Either one of information data “0” or data “1”, which is stored in combination of the first and second memory cells, is read out by detecting the potential difference equivalent to the readout current difference between the first and second memory cells.

Abstract: A semiconductor storage apparatus comprising: a plurality of cells that store data; a threshold determination section that determines, based on management information that is used to manage data, a binary or multiple-valued form by which values are written to a plurality of the individual cells and determines a threshold based on the determined form of values that are to be written to a plurality of the individual cells; and a write section that writes the data to a plurality of the cells on the basis of the threshold determined by the threshold determination section.

Abstract: Subject matter disclosed herein relates to multilevel flash memory, and more particularly to a method of changing a logic level of a single-bit-per-cell flash memory device multiple times before an erase operation.

Abstract: A bit line equalizing control circuit of a semiconductor memory apparatus includes a control signal generating unit that receives a bank active signal to generate a control signal such that a bit line equalizing signal is delayed and enabled, a bit line equalizing selecting unit that generates a bit line equalizing detection signal in response to a plurality of mat select signals and the control signal, and a driver that receives the bit line equalizing detection signal to generate the bit line equalizing signal.

Abstract: In one aspect, a non-volatile memory is provided which includes a plurality of m-bit non-volatile memory cells and a plurality of n-bit non-volatile memory cells, where 1?m<n, and a voltage generator which generates a first read voltage applied to non-selected m-bit non-volatile memory cells and a second read voltage applied to non-selected n-bit non-volatile memory cells, wherein the first read voltage is less than the second read voltage.