Abstract: A system and method for processing a tubular member for producing a medical device, wherein the tubular member is oriented in a longitudinally vertical position during processing.

Abstract: An apparatus characterized by a feature that in a stage on which a substrate or a jig holding a substrate is mounted, an opening closed when the substrate or the jig is mounted is provided and the substrate or the jig is heated by blowing hot air against the lower portion of the substrate or the jig and by a feature that a solder bump is formed on a pad electrode by heating or reflowing a solder composition which is a mixture containing solder particles, a flux component, and a liquid material which is liquid at normal temperature or changing to liquid when heated, and the composition is heated from the substrate side.

Abstract: A flask unit for producing a cope and a drag that are stacked, comprising at least two uprightly disposed connecting rods (4), a cope flask slidably fitted on the connecting rods and formed with a molding sand blowing-in port in one of its sides, and a drag flask slidably fitted on the connecting rods so that it is located under the cope flask to mate it, the drag flask being formed with a molding sand blowing-in port in one of the sides thereof.

Abstract: A flask unit for producing a cope and a drag that are stacked, comprising at least two uprightly disposed connecting rods (4), a cope flask slidably fitted on the connecting rods and formed with a molding sand blowing-in port in one of its sides, and a drag flask slidably fitted on the connecting rods so that it is located under the cope flask to mate it, the drag flask being formed with a molding sand blowing-in port in one of the sides thereof.

Abstract: A weld joins a thin overlay of low carbon steel to a base that contains high carbon steel, at least at its surface along which the weld is formed. The weld may be effected by fusion (melting) or by solid-state diffusion. With either it creates a heat affected zone (HAZ) in the base around the weld. The HAZ contains enough austenite, and perhaps bainite as well, to render the HAZ relatively ductile and also crack resistant. Adjacent to the weld the HAZ has a hardness that does not exceed 58 HRC. The weld may be produced with a high energy beam or with resistance welding equipment.

Abstract: By an electronic component mounting method for electrically connecting bumps to board electrodes, in a contact process for placing a thermosetting resin in a liquid glob state on the board surface and bringing the lower surface of the electronic component into contact with the thermosetting resin, the bumps are pressurized against the electrodes in positional alignment in a liquid glob distribution state where one portion of the liquid glob is arranged inside an electronic component mounting region and a remaining portion greater in liquid measure than the one portion is arranged outside the electronic component mounting region. The thermosetting resin enters into a gap between the electronic component and the board by capillarity in a thermocompression bonding process. This prevents voids occurring in the sealing resin, reinforces bonded portions of bumps and electrodes with thermally cured thermosetting resin, thereby preventing bonded portion breakage due to thermal stress generated during cooling.

Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention also includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and may be partially integrated or fully integrated into a processing chamber which also includes diffusion bonded layers.

Abstract: The object of the present invention is to provide a casting method capable of simultaneously attaining the shortening of cycle time and the improvement in casting quality. The pressure allowing the molten metal level to go up to the positions of from P0 to P4 is applied to the molten metal within a molten metal reservoir 1. Then, the pressure of P4 is maintained for a predetermined time. During this time, the molten metal which comes into contact with an upper die 4 is cooled earlier than the molten metal being in contact with another die. Through this cooling the molten metal shrinks. However, since the pressure of P4 is maintained, the molten metal is supplied from the lower side to a shrunk portion, so as not to cause shrinkage cavity or underfill.