Abstract: A method to control the post sinter distortion of hot pressing sintered multilayer ceramic laminate by placing a non-densifying structure in the green ceramic laminate prior to sintering. One or more non-densifying structures are placed on one or more ceramic greensheets which are then stacked and laminated to form a green ceramic laminate. The laminate is then sintered and the non-densifying structure will control the dimensions of the hot pressed multilayer ceramic substrate. The method can be used to control post sinter dimensions in MLC substrates manufactured as either single or multi-up substrates by placing the non-densifying structure in the kerf area between the individual product ups prior to sintering.

Abstract: Method for gluing decorative stones (1) with a tapered off backside, in particular of faceted glass, onto leather (2), wherein in the fastening region of each stone (1) a recess (5) is punched out of the leather (2), which recess is smaller than the greatest diameter of the stone (1). The end of the recess (5) facing the stone (1) is expanded by stamping corresponding to the contour of the stone (1). The stone (1) is subsequently glued in the expansion (6) to the base layer (4) of the leather (2).

Abstract: A production method of a dielectric ceramic composition at least including a main component including a dielectric oxide having perovskite-type crystal structure expressed by a formula ABO3 (note that in the formula, “A” indicates one or more elements selected from Ba, Ca, Sr and Mg, and that “B” indicates one or more elements selected from Ti, Zr and Hf) comprises steps of preparing a main component material including said dielectric oxide expressed by ABO3; preparing a subcomponent material including a composite oxide expressed by M4R6O(SiO4)6 (note that “M” indicates at least one selected from Ca and Sr, and that “R” indicates at least one selected from Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu); mixing said main component material and subcomponent material to obtain a dielectric ceramic composition material; and firing said dielectric ceramic composition material.

Abstract: A method of bonding an insulation layer (26) to a CMC layer (22) by applying a compliant joining layer (24) between them in a series of steps (52-70) effective to bond the layers (22, 24, 26) with reduced differential shrinkage stresses during firing and reduced residual stresses. The CMC layer (22) and the compliant layer (24) may each be fired to an intermediate stage prior to applying the next layer (24 and 26 respectively), such that the compliant layer (24) has a remaining amount of curing shrinkage between that of the CMC layer (22) and the insulating layer (26) during a final firing stage. The insulation layer (26) may be a friable graded insulation (26F) cast as a composite of hollow ceramic spheres (26S) in a ceramic matrix (26M). The compliant layer (24) may form a checkerboard of cracks (72) oriented generally perpendicular to the layer surface that function to relax stress.

Abstract: An assembly for forming a hollow, ceramic arc discharge vessel for high-intensity discharge (HID) lamps is described wherein a means for self-alignment of two molded sections is provided. In particular, the sealing surface of one section of the arc discharge vessel is provided with a convex surface and the sealing surface of the other section is provided with a concave surface. The radius of the convex sealing surface is smaller than the radius of the concave sealing surface so that the sections may self-align during joining, preferably without gas entrapment in the seal.

Abstract: A method of applying a ceramic coating to a substrate comprises laminating one or more layers of a green ceramic tape to a rigid substrate using a tackifying resin to adhere the tape to the substrate. Upon firing, the tackifying resin ensures near zero shrinkage of the tape in the XY plane without usage of elevated pressures or temperatures during lamination of green tape to the substrate. The thermal degradation completion temperature of the tackifying resin is lower than that of the resin binder used in the green tape.