Abstract: Device for separating a substrate from a carrier substrate which is connected to the substrate by an interconnect layer. The device includes a carrier substrate holder with a holding surface for holding the carrier substrate, and a substrate holder which is located opposite the carrier substrate holder with a substrate holding surface which can be located parallel to the holding surface for accommodating the substrate. There are separating means for parallel displacement of the substrate relative to the carrier substrate in the interconnected state of the substrate and carrier substrate.

Abstract: Methods and apparatus provide for imparting a controlled supply of gas to at least one Bernoulli chuck to provide a balanced draw and repellant gas flow to a material sheet; and at least one of: elevating a temperature of the supply of gas to the at least one Bernoulli chuck such that the gas flow to the material sheet is provided at the elevated temperature providing a stream of gas to an insulator substrate to promote separation of an exfoliation layer from a donor semiconductor wafer, and providing a stream of gas to a junction of the insulator substrate and any support structure to promote separation of the insulator substrate and the supporting structure.

Abstract: Device and method for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer. The device includes a receiving means for accommodating the carrier-wafer combination consisting of the carrier and the wafer, a connection release means for breaking the connection provided by the interconnect layer between the carrier and the wafer, and stripping means for stripping the wafer from the carrier, or for stripping the carrier from the wafer. The connection release means operates in a temperature range from 0° to 350° C., especially from 10° to 200° C., preferably from 20° to 80° C., and more preferably at ambient temperature. The method includes the steps of accommodating the carrier-wafer combination on a receiving means, breaking the connection provided by the interconnect layer by a connection release means, and stripping the wafer from the carrier, or stripping the carrier from the wafer by stripping means.

Abstract: One embodiment includes a process including coating a first microporous layer onto a first decal and curing the first microporous layer and the first decal.

Abstract: Apparatus are provided for attaching to a composite tape lamination machine in order to remove composite scrap tape material from a backing paper. When a moveable member is in one position composite non-scrap tape material on a backing paper is directed along a path to avoid a removing member and keep composite non-scrap tape material on a backing paper. When the moveable member is in another position composite scrap tape material on a backing paper is directed along a different path to contact the removing member and remove composite scrap tape material from a backing paper. Composite scrap tape material may be disposed in a scrap disposal member. Backing paper having attached composite non-scrap tape material and not having attached composite scrap tape material may be spooled using a spool roller.

Abstract: A method for reworking a bonded display (e.g., a bonded LCD) having a substrate (e.g., plate or film) adhesively bonded to a face (e.g., front face) of the display. The method provides for efficient and clean removal of the substrate from the bonded display when necessary (e.g., when defect(s) are present) to afford a de-bonded display that is undamaged such that the resulting de-bonded display (e.g., de-bonded LCD) can subsequently be re-bonded as a component in a device being manufactured.

Abstract: A method matching and splicing ends of carrier tape. A Uniquely patterned tab can be provided at an end/edge of carrier tape A and a uniquely patterned notch can be provided at an end/edge of carrier tape B. The uniquely patterned notch is complimentary to the uniquely patterned tab. The edge of carrier tape A is indexed (matched) to the edge of carrier tape B. The end/edge of carrier tape A and end/edge of carrier tape B can be secured together with adhesive tape that can be placed on at least one surface of carrier tape A and B. The uniquely patterned notch is complimentary to the uniquely patterned tab identify matching electronic components carried by carrier tape A and B. Indicia printed at the ends of carrier tape can also be used to identify component values in addition to use of unique tabs and notches formed at edge of tapes.

Abstract: Apparatuses useful in printing, fixing devices and methods of stripping media from surfaces in apparatuses useful in printing are provided. An exemplary embodiment of an apparatus useful in printing includes a first member including a first surface; at least one heating element for heating the first surface of the first member; a second member including a second surface forming a nip with the first surface, the nip including an inlet end at which a substrate enters the nip and an outlet end at which the substrate exits from the nip; and an air knife disposed downstream from the outlet end of the nip and extending along an axial direction of the first member, the air knife including a first end, a second end opposite to the first end and a plurality of axially-spaced nozzles disposed between the first end and second end; and at least one gas inlet through which gas is supplied to the air knife.

Abstract: A connection between composites with non-compatible properties and a method of preparing of such connections are provided. The composites comprise first and second type fibers, respectively, as well as resin. The connection comprises a transition zone between the composites having a layered structure. The transition zone may optionally comprise a transition member and the transition member may optionally be integrated with one or more of the composites. Examples of non-compatible properties where the present connection will be appreciated are great differences in stiffness, e.g. Young's modulus, or in coefficient of thermal expansion.

Abstract: There is provided a method for separating an optical film bonded to an adherend with a pressure-sensitive adhesive layer interposed therebetween from the adherend. The pressure-sensitive adhesive layer is formed using an optical pressure-sensitive adhesive. The optical pressure-sensitive adhesive of the invention comprises a base polymer having a functional group (F); and a coupling agent that has a benzyl ester group and is represented by Formula (1): wherein A1 and A2 are different functional groups, one of A1 and A2 shows reactivity or interaction with the functional group (F) of the base polymer, R1 is an optionally substituted alkylene group of 1 to 12 carbon atoms and/or an optionally substituted phenylene group, and R2 and R3 are each a hydrogen atom or an alkyl group of 1 to 12 carbon atoms and may be the same or different.

Abstract: There is described a process for the production of a multilayer body (4) having an electrically conductive layer (421) arranged on a carrier layer (41), in which there is provided a transfer film (5) having a transfer layer (52) of an electrically conductive polymer. The electrically conductive layer is transferred from the transfer film (5) on to the multilayer body (4). There are also provided a transfer film and a multilayer body produced in accordance with the process.

Abstract: A splicing device (13) and a method for the transport and feeding of plastic film (8) to a processing station. In this processing station the articles are wrapped in the plastic film (8) and the film (8) can subsequently be shrunk. This device includes a supply of film rolls with at least three separate film rolls (1 to 6) that are subsequently fed to a conveyor. The device furthermore includes a fixation device (20, 24, 26) arranged between the conveyor and the film rolls (1 to 6). The fixation device (20, 24, 26) fixes and joins the beginnings of film of new full film rolls (2 to 6) to the sheet of film currently fed into the processing device.

Abstract: A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.

Abstract: The present invention relates to a peeling device which peels off a reinforcing sheet stuck on a substrate, including: a supporting unit which supports one main surface of a laminate having the substrate and the reinforcing sheet; a plate-shaped flexible member to be attached to the other main surface of the laminate; a plurality of pads fixed to a surface of the flexible member lying opposite to the laminate side; a plurality of rods each of which is coupled to any one of the plurality of pads; a plurality of driving devices by which the plurality of rods are made to move, respectively, in their individual axial directions; and a control device by which a position of each of the plurality of rods is controlled on an individual basis, in which each of the plurality of pads is coupled to any one of the plurality of the rods via any one of a plurality of joints so that each pad is allowed to be pivotable centering on a vicinity of an intersection point of a centerline of the rod coupled thereto with a surface o

Abstract: An automobile or vehicle having a high efficiency solar control system is provided. The automobile may have a painted surface and a film mounted to its exterior side. The film may reflect solar radiation in the near and mid infrared ranges yet allow high transmission of light in the visible range such that the painted panel may be seen. The film may have a layer of silver which reflects the solar radiation in the near and mid infrared ranges. Since the silver is susceptible to oxidation and turns the silver into a black body which absorbs the near and mid infrared radiation, the film may be designed to slow the rate of oxidation of the silver layer to an acceptable level. The silver layer may be sandwiched between the glass which does not allow oxygen to diffuse there through and reach the layer of silver and a stack of sacrificial layers having a certain thickness which slows down the rate of oxygen diffusion to an acceptable level.

Abstract: The invention relates to a device for protecting a display facility, comprising a protective element for covering an image surface of the display facility. As the protective element is designed to be transparent and the retaining means are provided for the exchangeable arrangement of the protective element in front of the image surface, a protective device is provided, which allows the image surface to be examined and is easy to operate.

Abstract: An apparatus for placement of seam tape to a roof or roof membrane. The apparatus comprises first and second sides spaced a distance apart, wherein each side includes a material axle opening and a pressure applicator orifice. The apparatus also comprises a removable pressure applicator having a first end and second end positioned in the pressure applicator orifices of the first and second sides. A support element may be operatively attached to the first and second sides, span the distance between the first and second sides, and positioned opposite the pressure applicator to support the apparatus. Additionally, a material axle may be positioned such that its ends are removably positioned in the material axle openings of the first and second sides. A closed front side may connect the first and second side, while an open stern may allow direct access to the pressure applicator, the support element, and the material axle.

Abstract: The present invention provides a debonding apparatus, a system comprising such apparatus, and methods for using such apparatus or system for the removal of flexible substrates (14) post-processing without damage to fabricated devices.

Abstract: A process for forming a zeolite beta dielectric layer onto a substrate such as a silicon wafer has been developed. The zeolite beta is characterized in that it has an aluminum concentration from about 0.1 to about 2.0 wt. %, and has crystallites from about 5 to about 40 nanometers. The process involves first dealuminating a starting zeolite beta, then preparing a slurry of the dealuminated zeolite beta followed by coating a substrate, e.g. silicon wafer with the slurry, heating to form a zeolite beta film and treating the zeolite beta with a silylating agent.

Abstract: A method for stripping a wafer from a supporting plate to which the wafer is adhered via an adhesive agent, wherein the supporting plate has a through hole penetrating the supporting plate in a thickness direction thereof, the method including dissolving the adhesive agent with a stripping solution by contacting the stripping solution with the adhesive agent via the through hole. The adhesive agent has a hydrocarbon resin as a viscous component, and the stripping solution is a hydrocarbon-based solvent having a viscosity of 1.3 mPa·s or less and a dissolving rate of 30 nm/sec or greater to dissolve the adhesive agent.