Abstract: A package is provided for connecting a plurality of molded carriers each having an integrated circuit which has been previously bonded to the electrical leads of a TAB tape. The package flexibly and sequentially connects a plurality of the carriers, so as to form a flexible and continuous chain of the carriers. The package preferably utilizes a flexible conductive tape which is continuously provided on parallel ends, or edges, of each carrier, so as to link the plurality of carriers together. The package permits continuous feeding of the carriers into subsequent test and assembly machines utilized to attach the integrated circuit to a printed circuit board.

Abstract: An electronic circuit substrate excellent in reliability, which comprises a porous ceramic sintered body with film devices such as a conductive circuit, a resistor and a capacitor directly formed on a surface thereof. A resin is filled in the pores of the porous ceramic sintered body, and the bottom surface of the film devices are fit into the pores and recesses on the surface of the porous ceramic sintered body in close contact therewith in a wedged state. A method of producing the aforesaid electronic circuit substrate comprises the steps of forming film devices directly on a surface of a porous ceramic sintered body. Then, filling the pores of the porous ceramic sintered body with a resin so as to fit the under surface of the film devices into the pores and recesses on the surface of the porous ceramic sintered body in close contact therewith in a wedge state.

Abstract: A method of mounting SMD components (6, 7, 8) and wire components (21, 22) on a printed circuit board (2), in which the wire components (21, 22) ae secured on the printed circuit board (2) by means of connection elements (13, 14). The SMD components (6, 7, 8) and the connection elements (13, 14) are secured by reflow soldering on the printed circuit board (2), while the wire components (21, 22) are connected by their connection wires (19, 20) to the connection elements (13, 14) by welding.

Abstract: A leadframe having wire bonding zones recessed from the single plane of the upper surface. Heat actuated adhesive tape sandwiched between the leadframe and a heatspreader is heated and the assembly is pressed together to bond the heatspreader to the leadframe without contacting the wire bonding zones.

Abstract: An elastomeric element, having alternating layers of resistive and insulating material, is used to form isolation resistors. A surface of the elastomeric element is contacted with a conductor carrying electrical signals. Another surface is applied to the terminals of a semiconductor component thereby coupling the signals to the semiconductor component through the resistors formed by the elastomeric element.

Abstract: A mechanism for insertion and withdrawal of a printed board unit (20) to and from a shelf (10), by which the printed board is inserted in the shelf with less force and locked therein after the completion of the operation, an the complete insertion can be confirmed by a click noise and a mark. The mechanism includes a lock arm (26), which is fixed to the printed board unit (20) at the base portion thereof and has a flexible tip, a lever (25) pivoted to the printed board unit (20) and provided with a cam surface (30) for driving the lock arm (26) for insertion and withdrawal of the printed board unit (20), and an aperture (17) formed on the shelf (10) and engageable with the lock arm (26) when the same is in a fixed position. The lever (25) occupies predetermined angular positions, both when the printed board unit (20) is completely engaged to a connector and when the printed board unit is withdrawn therefrom.

Abstract: An electrical packaging system, preferably a fluorescent lamp assembly, includes an assembly (10) having a housing (12) with a planar base (14) carrying affixed thereto a flat, flexible circuit (50) with holes (52) exposing conductors (56). Spacially disposed components (28, 40) are affixed to the housing with terminals extending to bear against a resilient conductive member (38, 44) to interconnect components to the circuit. The conductive medium may be bonded to either the terminals or to the circuit to facilitate handling.

Abstract: In a laminate wiring board having power source layers therein and provided with pins for signal input and output and pins for power supply, the power source layers are exposed at a side end of the wiring board, and pads for power supply are provided on the exposed side end.

Abstract: A stiffener in the form of a metal-cored stiffener plate is temporarily secured to the underside of a printed circuit (PC) board having a series of integrated circuit (IC) chips and other electronic components and metallization interconnect traces on the upper or top surface of the board. Securing of the stiffening plate and PC board is provided by segments of a hook/mushrooms-containing flexible tape adhered to the PC board underside by suitable adhesive. A complementary sheet of a hooks-containing flexible material is adhered to the stiffening plate such that upon pressing of the complementary material and segments together the respective hooks and loops interlock binding the PC board assembly and stiffening plate assembly together. The securement can be easily undone by grasping and levering the edge of the stiffening plate from the PC board and breaking the interlock of the hooks and loops. The hooks and loops may be reversed on the stiffener plate and on the solder-side of the PC board.

Abstract: A printed circuit board includes a substrate, a printed electric circuit pattern formed on the surface of the substrate, a plurality of land patterns formed on end portions of the printed electric circuit pattern, an isolation layer formed on the surface of the substrate and printed electric circuit pattern, an opening formed in the isolation layer about each land pattern, a plurality of electrical devices arranged on the land patterns and a plurality of markers printed on the surface of the isolation layer enclosing corresponding electrical devices.

Abstract: A self-locking system for use with circuit board holding frames comprises two side panels each having a specially configured slot for guiding a retainer bar, which extends between the two slots, between a locked and a loading position. Each slot has a shape similar to that of an upside down "L" and is positioned on each side panel at the top corner adjacent to the holding frame opening. In the locked position, the retainer bar, which is held in the guide slots by shoulder screws at each end, extends across the frame opening thereby blocking any outward board movement. In the loading position, the retainer bar rests out of the opening thus providing clearance for board removal or installation. A lip, which prevents the retainer bar from inadvertently toppling down into the locked position, is dimensioned so that the retainer bar may fall down into the locked position upon sufficient mechanical vibration if the system is mistakenly left unlocked.

Abstract: A leaded electrical component 101 for surface mount applications having a receptacle 107 attached to the component 101 which renders the resultant assembly 127 capable of mounting to the top surface of the substrate 129. The top of the receptacle 111 provides an opaque, smooth surface enabling the assembly to be picked up and placed using automatic equipment with a vision system. The bottom of the receptacle 113 rests on the top surface of the substrate 129 to provide stability for the surface mount assembly 127. The receptacle 107 captures the component 101 in a secure position. The captured component 101 provides a specific orientation until the leads 109 are coupled to the substrate.

Abstract: In a "Futurebus+" backplane, at each end of the backplane the signal lines are each electrically connected to a power bus on a face of the board or to a power plane encapsulated in the board via a discrete resistor mounted on the face of the board and separately formed with respect to the other resistors and the ground lines are each electrically connected to the power bus or power plane via a discrete capacitor mounted on the face of the board and separately formed with respect to the other capacitors. Preferably, at each end of the backplane the discrete resistors and capacitors are mounted on both faces of the board, the number on one face being approximately the same as the number on the other face. In the event that a resistor or capacitor should be faulty, only the signal or ground line to which the faulty resistor or capacitor is connected will be out of service until the faulty resistor or capacitor is replaced.

Abstract: The present invention provides flexible, tear-resistant printed circuits comprising first and second electrical conductors and a flexible, insulating core separating and supporting said first and second conductors. The core preferably comprises aromatic polyamide fiber in a resin binder matrix. Rigid/flex circuits including the flexible, tear-resistant printed circuits are disclosed.

Abstract: Compositions useful for printing controllable adhesion conductive patterns on a printed circuit board include finely divided copper powder, a screening agent and a binder. The binder is designed to provide controllable adhesion of the copper layer formed after sintering to the substrate so that the layer can lift off the substrate in response to thermal stress. Additionally, the binder serves to promote good cohesion between the copper particles to provide good mechanical strength to the copper layer so that it can tolerate lift off without fracture.

Abstract: A cylindrical high speed parallel backplane for electrically inter-connecg a plurality of printed circuit boards in a data processing system. A plurality of cylindrical plate conductor structures are arranged parallel to one another. A plurality of circuit board connectors are disposed radially about the perimeter of the plate conductor structures to electrically connect the printed circuit board to the plate conductors structures. This cylindrical design of the backplane provides a short signal path length between the printed circuit boards connected to the backplane thereby providing for broad bandwidth capability.

Abstract: A circuit board includes an insulative ceramic substrate, electrode portions and wiring portions formed on the ceramic substrate by selectively removing portions of a conductor layer plated on said ceramic substrate, a resistor layer formed on the ceramic substrate and connected to the electrode portions, and a pair of connecting thick film conductors for electrically connecting the thick film resistor and the conductor layer on both ends of the thick film resistor. The resistor layer includes a thick film resistor which is formed on the ceramic substrate. The conductor layer and the thick film resistor each have an end portion which is formed directly on the same connecting thick film conductor.

Abstract: A fixture (20) for fixing the position of a circuit component (22) relative to a circuit board (28). The fixture includes a spacer (40) that has contact surfaces (50) that bear upon a surface (26) of the board (28). The spacer (40) also includes support surfaces (56) upon which a dual in-line packaged component (22) rests. The distance between the contact surfaces (50) and support surfaces (56) are established to precisely locate a surface (60) of the component relative to the surface (26) of the board (28). Also included are clip mechanisms (42, 44) for securing the spacer (40) to the board (28) and for securing the component (22) to the spacer (40).

Abstract: An IC card ejecting device for selectively ejecting one of two IC cards which are inserted in respective connectors and disposed in parallel to each other side by side. The device comprises a dial which is disposed between the IC cards and movable in a first direction for ejecting one of the IC cards and a second direction opposite to the first direction for ejecting the other of the IC cards. A first pulling out plate has a hook which engages with one of the IC cards. A second pulling out plate has a hook which engages with the other IC card. A first link is arranged between the dial and the first plate in such a way that the first link engages with the first plate and urges it in a direction of pulling out the one of IC cards from the connector when the dial is rotated in the first direction.

Abstract: A three part card guide for attachment to a host circuit card has opposing guide rails to receive transverse edges of an auxiliary circuit card. The guide rails attach to either end of a connector support which holds a first electrical connector and an auxiliary circuit card may be slid between the guide rails so that a second electrical connector along its rearward edge engages the first electrical connector. The guide rails and connector support assembly have hooks, to attach them to the host circuit card, which may be engaged with longitudinal motion of the assembly. The electrical connector, when attached to the host card through the connector support, prevents such longitudinal motion, locking the assembly in place.