Patents Examined by Paresh Paghadal
  • Patent number: 10170403
    Abstract: An ameliorated compound carrier board structure of Flip-Chip Chip-Scale Package has the insulating layer between the carrier board and the substrate in the prior art replaced by an anisotropic conductive film or materials with similar structure. The anisotropic conductive film has conductive particles therein to replace the conductive openings on the insulating layer in the prior art. When compressing the substrate onto the carrier board, the bottom surface of the second electrode pads are compressing the corresponding conductive particles on the second electrical contact pads, causing which to burst, therefore forming high-density compressed areas that conduct the second electrode pads and the second electrical contact pads; the conductive particles outside the high-density compressed area are not burst, forming an insulating film between the substrate and the carrier board; in other words, the anisotropic conductive film provides conduction in a Z direction.
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: January 1, 2019
    Assignee: Kinsus Interconnect Technology Corp.
    Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nung Lin
  • Patent number: 10167550
    Abstract: A multi-functional composite system generally comprises a core, a plurality of structural composite fiber layers, a matrix material, a connector configured to interface with one or more electrical devices and a composite conductor assembly, the composite conductor assembly having one or more conductors disposed between two or more insulating layers.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: January 1, 2019
    Assignee: Aurora Flight Sciences Corporation
    Inventors: Ed Wen, Dan Cottrell, Adam Ehrmantraut, Mark Blehar, David Kordonowy
  • Patent number: 10129997
    Abstract: A guide assembly an enclosure-based device such as a computer provided in a rack-mountable chassis. The guide assembly is configured to facilitate blind connector mating such as electrical interconnection between a receiving connector on a previously-mounted board and an edge connector on a circuit board supported in a housing of a module that is slid or inserted into the interior space of the enclosure or chassis. The guide assembly (and devices that include a guide assembly) address the two design challenges discussed above of increasing numbers of circuits in devices that need to be connected and of decreasing pitch between the connectors. The guide assembly is configured, with its mechanical features, to decouple the degrees of freedom (DOFs) between the module being inserted into the chassis and the receiving/mating connector on the previously-mounted board. The guide assembly constrains five out of the six DOFs, which effectively ensures proper connector mating.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: November 13, 2018
    Assignee: ORACLE INTERNATIONAL CORPORATION
    Inventors: Andres Gabriel Hofmann, Rebecca Di Ricco Kurzava, Gabrielle Kariann Stetor
  • Patent number: 10098240
    Abstract: An electronic control module includes a printed circuit board and an electrical component. The circuit board has a contact area arranged on a component side. The electrical component has an electrical connection element with a connection section running parallel to the component side and is electrically connected to the contact area. An adapter is arranged on the circuit board independently of the electrical component and has a holding body fastened to the circuit board outside the contact area and a metal web. The web is arranged on the holding body and has a contact section running parallel to the component side. The contact section and the connection section lie atop another and are welded to one another in a covering area. The web or the connection element makes electrical contact with the contact area by an electrically conductive material applied to the contact area.
    Type: Grant
    Filed: November 10, 2014
    Date of Patent: October 9, 2018
    Assignee: Robert Bosch GmbH
    Inventor: Uwe Liskow
  • Patent number: 10080298
    Abstract: Provided is a circuit board interconnection structure including: a first circuit board including a first substrate and a first electrode formed on a surface of the first substrate; a second circuit board including a second substrate and a second electrode formed on a surface of the second substrate; one or more joining portions formed of a metal-containing conductive material for joining the first and second electrodes, interposed between the first and second electrodes; and a reinforcing resin portion for reinforcing the one or more joining portions. The first electrode is a transparent electrode including a metal oxide film. A first abutting portion of the joining portion abutting the first electrode, is formed by adhesional wetting of the first electrode with the conductive material.
    Type: Grant
    Filed: April 21, 2014
    Date of Patent: September 18, 2018
    Assignee: PANASONIC CORPORATION
    Inventors: Hideki Eifuku, Koji Motomura
  • Patent number: 10068685
    Abstract: A cable may include a plurality of twisted pairs of individually insulated conductors, a separator positioned between the twisted pairs, and a jacket formed around the twisted pairs and the separator. The separator may include a longitudinally extending spine positioned between the plurality of twisted pairs, and at least one prong respectively extending from the spine at each of a plurality of longitudinally spaced locations. Additionally, for each pair of adjacent longitudinally spaced locations, the at least one prong extending at a first of the pair of locations may extend in a first set of one or more directions and the at least one prong extending at a second of the pair of locations may extend in a second set of one or more directions that is different than the first set of one or more directions.
    Type: Grant
    Filed: February 17, 2017
    Date of Patent: September 4, 2018
    Assignee: Superior Essex International LP
    Inventor: Thomas Christopher Cook
  • Patent number: 10050356
    Abstract: An electrical arrangement (10), including: a first conductor (12) having a first generally planar contact area (34); a second conductor (12) having a second generally planar contact area (40); an intermediate conductor (44) having a first faying area (84) overlying the first contact area and a second faying area (86) overlying the second contact area; a compression arrangement configured to compress the first faying area and the first contact area toward each other and to compress the second faying area and the second contact area toward each other; and a dimpling structure (46) effective to create plural contact points (74) between the first faying area and the first contact area and between the second faying area and the second contact area when the first and the second faying areas and the first and second contact areas are compressed toward each other by the compression arrangement.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: August 14, 2018
    Assignee: SIEMENS ENERGY, INC.
    Inventor: Joshua S. McConkey
  • Patent number: 10038267
    Abstract: A circuit interconnect generally comprises an electrical connection pad, a shape memory material, and a flowable conductor. The electrical connection pad has an upper surface, a portion of which is covered by the shape memory material. The flowable conductor extends through the shape memory material and is electrically coupled to the electrical connection pad. The shape memory material has a first configuration at a first temperature and a second configuration at a second temperature. In the instance of the second temperature being greater than the first, the shape memory material has a first configuration that is substantially planar and a second configuration that is cupped.
    Type: Grant
    Filed: June 12, 2014
    Date of Patent: July 31, 2018
    Assignee: Palo Alto Research Center Incorporated
    Inventor: Scott J. Limb
  • Patent number: 10028393
    Abstract: A wiring substrate includes a core layer, a first wiring layer, a first insulating layer, a first via wiring, a second wiring layer, a second insulating layer, a second via wiring, a third wiring layer, a third insulating layer, a third via wiring, and a through-wiring. The through-wiring includes upper and lower end surfaces. The upper end surface has an area that is smaller than an area of the lower end surface. The upper surface of the first insulating layer is more flat than the lower surface of the third insulating layer. The second wiring layer has a wiring density that is higher than a wiring density of the first wiring layer.
    Type: Grant
    Filed: July 2, 2015
    Date of Patent: July 17, 2018
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Noriyoshi Shimizu, Yusuke Gozu, Akio Rokugawa
  • Patent number: 9991027
    Abstract: An electric wire includes a conductor having a cross-sectional area of not less than 225 mm2 and not more than 275 mm2, an insulation provided so as to cover the outer periphery of the conductor, and a wire sheath provided so as to cover the outer periphery of the insulation. The amount of deflection is not less than 130 mm when, at 23° C., one end of the electric wire is fixed to a fixture table so that another end horizontally protrudes 400 mm from the fixture table and a weight of 2 kg is attached to the other end, and cracks and breaks do not occur when wound with a bending diameter of three times the diameter at ?40° C.
    Type: Grant
    Filed: November 9, 2015
    Date of Patent: June 5, 2018
    Assignee: Hitachi Metals, Ltd.
    Inventors: Tamotsu Kibe, Hisao Furuichi, Hiroshi Okikawa, Ryutaro Kikuchi
  • Patent number: 9991689
    Abstract: A mounting assembly is for a power pedestal including a number of electrical components. The mounting assembly includes a plurality of mounting members including a first mounting member and a second mounting member each structured to engage an elongated support member and be coupled to the elongated support member. The elongated support member has an end portion. The plurality of mounting members are cooperatively structured to enclose the end portion.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: June 5, 2018
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Chris Emmons Drueke, Jeffery Scott Kuykendall, Paul David Seff
  • Patent number: 9986656
    Abstract: A multi-receptacle housing assembly that includes a clamping assembly and a cover. The clamping assembly defines a first clamping section, a second clamping section and a cover support section. The first clamping section is located along a first side of the clamping assembly and is configured to clamp to a projection of an electronic device housing. The second clamping section is located along a second side of the clamping assembly opposite the first side and is configured to receive and support a plurality of electric receptacles. The cover removably is connected to the cover support section of the clamping assembly at least partially covering the first clamping section and the cover support section. The cover defines an opening dimensioned to expose at least a portion of the second clamping section and the plurality of electric receptacles.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: May 29, 2018
    Assignee: Nissan North America, Inc.
    Inventor: Lynn E Jarvenpaa
  • Patent number: 9984792
    Abstract: An electric wire includes a conductor having a cross-sectional area of not less than 290 mm2 and not more than 360 mm2, an insulation provided so as to cover the outer periphery of the conductor, and a wire sheath provided so as to cover the outer periphery of the insulation. The amount of deflection is not less than 120 mm when, at 23° C., one end of the electric wire is fixed to a fixture table so that another end horizontally protrudes 400 mm from the fixture table and a weight of 2 kg is attached to the other end, and cracks and breaks do not occur when wound with a bending diameter of three times the diameter at ?40° C.
    Type: Grant
    Filed: November 9, 2015
    Date of Patent: May 29, 2018
    Assignee: Hitachi Metals, Ltd.
    Inventors: Tamotsu Kibe, Hisao Furuichi, Hiroshi Okikawa, Ryutaro Kikuchi
  • Patent number: 9978514
    Abstract: There is provided a multilayer ceramic electronic component including, a ceramic body including a plurality of dielectric layers stacked in a thickness direction, satisfying T/W>1.0 when a width and a thickness thereof are defined as W and T, respectively, and having a groove portion inwardly recessed in a length direction in at least one main surface thereof, a plurality of first and second internal electrodes disposed in the ceramic body to face each other, having the dielectric layers interposed therebetween, and alternately exposed through both end surfaces of the ceramic body, and first and second external electrodes formed to extend from the both end surfaces of the ceramic body to the at least one main surface having the groove portion formed therein.
    Type: Grant
    Filed: November 14, 2013
    Date of Patent: May 22, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung Woo Han, Dae Bok Oh, Jae Yeol Choi, Sang Huk Kim
  • Patent number: 9955576
    Abstract: Provided is a touch panel. The touch panel includes a substrate and an electrode member disposed on the substrate. The electrode member includes a base material for electrode having first and second surfaces opposite to each other, a first electrode disposed on the first surface, and a second electrode disposed on the second surface.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: April 24, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Dong Youl Lee, Young Jin Noh, Young Sun You, Sun Young Lee, Yong Jin Lee, Kyoung Hoon Chai
  • Patent number: 9934885
    Abstract: A gas turbine engine 10 is provided with electrical harness rafts 200 comprising electrical conductors embedded in a rigid composite material. The rafts 200 are used to transport electrical signals (which may be, for example power and/or control signals) around a gas turbine engine. Rafts 200 may be connected together and to other components using flexible cables, that may help to accommodate relative movement of the rafts 200, for example through vibration. The rafts 200 are lighter, more compact, and more convenient to handle than conventional electrical harnesses. The rafts 200 may provide a convenient and secure mounting surface for other components/systems of a gas turbine engine, such as EECs and/or fluid pipes.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: April 3, 2018
    Assignee: ROLLS-ROYCE plc
    Inventors: Paul Broughton, Robin Charles Kennea
  • Patent number: 9928935
    Abstract: A system and a method are presented. The system includes an electrically conducting material and an electrical insulation system. The electrical insulation system includes a layered insulation tape that has a first layer and a second layer. The first layer includes a mica paper and a binder resin in a range from about 5 wt % to about 12 wt % of the insulation tape. The second layer includes a composite of layered nanoparticles dispersed in a polyetheretherketone (PEEK) matrix. The second layer laminates the first layer. The method includes attaching the first layer and the second layer with or without the addition of further resin; using the layered insulation tape as a turn insulation and ground wall insulation for an electrically conducting material; and impregnating the system with a nanofiller-incorporated resin by a vacuum pressure impregnation method, to form an insulation system within the system.
    Type: Grant
    Filed: May 31, 2013
    Date of Patent: March 27, 2018
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Weijun Yin, Lili Zhang, Lionel Durantay, Jean François Grignard
  • Patent number: 9922753
    Abstract: A cable may include a plurality of twisted pairs of individually insulated conductors and a separator positioned between the twisted pairs. The separator may include a longitudinally extending spine positioned between the plurality of twisted pairs, and a plurality of bristles may radially extend from the spine. A first portion of the bristles may extend between one or more sets of adjacent twisted pairs, and a second portion of the bristles may be compressed towards the spine by one or more of the plurality of twisted pairs. Additionally, a jacket may be formed around the twisted pairs and the separator.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: March 20, 2018
    Assignee: Superior Essex International LP
    Inventor: Thomas Christopher Cook
  • Patent number: 9907189
    Abstract: A multi-layer wiring board is configured having stacked therein, in a stacking direction, via an adhesive layer, a plurality of printed wiring bases in each of which a wiring pattern and a via are formed on/in a resin base. A multi-layer wiring board includes a movable portion configured from an elastic member and a void portion, the movable portion being formed in the printed wiring bases and adhesive layer in a periphery of a matrix-shaped plurality of multi-layer wiring portions disposed at a certain interval as viewed in a planar manner, and the movable portion joining the plurality of multi-layer wiring portions such that each of the multi-layer wiring portions is displaceable in the stacking direction and a direction of surfaces of the printed wiring bases.
    Type: Grant
    Filed: April 21, 2014
    Date of Patent: February 27, 2018
    Assignee: FUJIKURA LTD.
    Inventor: Nobuki Ueta
  • Patent number: 9875957
    Abstract: A wiring substrate includes a first wiring structure and a second wiring structure. The first wiring structure includes a first insulating layer, which covers a first wiring layer, and a via wiring. A first through hole of the first insulating layer is filled with the via wiring. The second wiring structure includes a second wiring layer and a second insulating layer. The second wiring layer is formed on an upper surface of the first insulating layer and an upper end surface of the via wiring. The second wiring layer partially includes a roughened surface. The second insulating layer is stacked on the upper surface of the first insulating layer and covers the second wiring layer. The second wiring structure has a higher wiring density than the first wiring structure. The roughened surface of the second wiring layer has a smaller surface roughness than the first wiring layer.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: January 23, 2018
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Noriyoshi Shimizu, Yusuke Gozu, Jun Furuichi, Akio Rokugawa, Takashi Ito