Patents Examined by Paresh Paghadal
  • Patent number: 11495949
    Abstract: A cable clamping apparatus (2) is disclosed. The apparatus comprises a housing (4) defining a first aperture (6) for a cable, an actuator member (24), and clamping members (22). Movement of the clamping members relative to the actuator member in an axial direction of a cable extending through the apparatus causes sliding movement of the clamping members relative to the actuator member between a first condition, in which the cable can move in the axial direction relative to the clamping members, and a one second condition, in which the cable is clamped between the clamping members. A plurality of the clamping members overlap in the axial direction.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: November 8, 2022
    Assignee: CMP PRODUCTS LIMITED
    Inventors: Mark Weatherburn, Lee Frizzell
  • Patent number: 11490512
    Abstract: A printed circuit board and an antenna module including the same are provided. The printed circuit board includes a core layer; a first build-up structure disposed on an upper side of the core layer, including first insulating layers and first bonding layers, alternately stacked, and further including first wiring layers disposed on upper surfaces of the first insulating layers, respectively, and embedded in the first bonding layers, respectively; and a second build-up structure disposed on a lower side of the core layer, including second insulating layers and second bonding layers, alternately stacked, and further including second wiring layers disposed on lower surfaces of the second insulating layers, respectively, and embedded in the second bonding layers, respectively. The printed circuit board has a through-portion penetrating through the core layer and the second build-up structure, and has a region in which the through-portion is disposed as a flexible region.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: November 1, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Hong Min, Ju Ho Kim
  • Patent number: 11487129
    Abstract: An optical integration device includes a first circuit layer comprising a first surface adjacent a first diffractive layer, the first diffractive layer arranged on a side of the first circuit layer along a first direction, and a first connecting pad electrically connected with the first circuit layer through a first conductive member. The optical integration device includes a side surface extending along the first direction. The side surface defines a first concavity extending through the first diffractive layer along the first direction. The first connecting pad includes a first mounting member connected with the side surface, and a first convex member extending from the first mounting member and received in the first concavity. The first conductive member includes a first conductive part arranged between the side surface and the first mounting member, and a second conductive part arranged between the first surface and the first convex member.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: November 1, 2022
    Assignee: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
    Inventors: Jia-Liang Wu, Yi-Yin Chen
  • Patent number: 11469035
    Abstract: The present disclosure provides a heat dissipation structure for a magnetic component and a magnetic component having the same. The magnetic component includes a plurality of heat dissipation pins, which are disposed on the winding of the magnetic component, wherein the magnetic component has one or more windings. The heat dissipation structure includes a circuit board on which a plurality of heat dissipation channels are disposed, and the heat dissipation pins of the windings are in contact with the heat dissipation channels; a plurality of heat conduction portions are disposed correspondingly under the heat dissipation channels of the circuit board; a heat conduction layer is arranged under the heat conduction portions and contacts with the heat conduction portions; and a heat dissipation layer is arranged under the heat conduction layer and contacts with the heat conduction layer.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: October 11, 2022
    Assignee: Delta Electronics (Shanghai) CO., LTD
    Inventors: Chao Yan, Zejun Wang, Yiwen Lu, Zhihua Li
  • Patent number: 11462894
    Abstract: A wire harness, including: a plurality of tubes that each include a tubular shape-retaining conductor having a conductive property and a shape-retaining property, the plurality of tubes being routed in parallel, wherein: a conductive tube, that includes an insulating cover that covers the shape-retaining conductor, is included among the plurality of tubes, and thicknesses of the shape-retaining conductors that are included in at least two tubes among the plurality of tubes are different to each other.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: October 4, 2022
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Takuji Iwama, Yuji Tanaka
  • Patent number: 11462893
    Abstract: A cable-routing device, the members of which have central joint bodies for articulation to one another, which comprise a joint head and a joint socket. The joint head has an axial region in which the cross-section thereof has a peripheral geometry with at least two corner points and lateral lines which connect the latter to one another, the lateral lines which meet at a corner point forming an internal angle of less than 180°, and the joint socket has a receiving region which geometrically corresponds to the axial region of the joint head and into which the joint head can lock.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: October 4, 2022
    Assignee: IGUS GMBH
    Inventors: Thilo-Alexander Jaeker, Andreas Hermey
  • Patent number: 11454661
    Abstract: In an electric field probe for use in calibration of electromagnetic susceptibility testing equipment, processing circuitry for converting electric fields to digitally modulated light transmitted by a fiber optic cable, and circuitry for converting light supplied through a fiber optic cable to current for operating the processing circuitry, are on printed circuit boards that have border portions with conductive edge plating clamped between opposed edges of shells that form a circuit board enclosure. Antenna elements comprising conductive traces on the circuit boards protrude outward from the enclosure through gaps in the plating.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: September 27, 2022
    Assignee: Amplifier Research Corp.
    Inventor: Sean R. O'Connor
  • Patent number: 11450454
    Abstract: A cable that extends along a longitudinal axis between a first end and a second end. The cable includes a jacket defined about the longitudinal axis. The jacket includes a plurality of fluting elements between the cable first end and the cable second end. The fluting elements are configured to reduce the torsional forces of cross-wind.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: September 20, 2022
    Assignee: Southwire Company, LLC
    Inventors: Stephen Spruell, Jones M. Kithuka
  • Patent number: 11452205
    Abstract: Provided is an ultrasonic probe having ultrasonic elements and a printed-circuit board that establishes connection between the ultrasonic elements and external wiring, achieving strong connection between the ultrasonic elements and the printed-circuit board mechanically and electrically, and thereby improving performance in examination and diagnosis using the ultrasonic probe. The printed-circuit board with pads each having a via-hole to be bonded to electrode pads of a chip equipped with the ultrasonic elements, is provided with a reinforcement, in an area of the base material where the pad having the via-hole is not formed. The reinforcement is formed simultaneously with forming the pads and wiring on the printed-circuit board, having the same thickness as the pads. With the reinforcement, pressure is evenly applied to the printed-circuit board when the electrode pad is press-fitted into the pad having the via-hole, thereby preventing warping and deforming of the board.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: September 20, 2022
    Assignee: Fujifilm Healthcare Corporation
    Inventors: Yasuhiro Yoshimura, Akifumi Sako, Makoto Fukada, Masahiro Sato
  • Patent number: 11450453
    Abstract: A wire harness including: an electrical wire; and an exterior pipe through which the electrical wire is inserted, wherein the exterior pipe is provided with a plurality of discharge holes configured to outwardly discharge foreign matter that has entered between the exterior pipe and the electrical wire. An exterior pipe through which an electrical wire is to be inserted, the exterior pipe including: a body with a plurality of discharge holes configured to outwardly discharge foreign matter that has entered between the body and the electrical wire, wherein the plurality of discharge holes are provided in an aligned arrangement.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: September 20, 2022
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yuichi Kimoto, Takeshi Shimizu
  • Patent number: 11437799
    Abstract: The invention relates to a cable bushing to be screwed together with a wall comprising a passage for at least one prefabricated cable, comprising two partial elements, which are screwed together with one another in the installed state, a threaded section, which is formed by the two partial elements in each case in a part of its circumference, and comprises a thread, for feeding through the passage, a receptacle section adjoining thereon in the axial direction of an axis of rotation of the threaded section, which has a larger external diameter than the threaded section at least in sections, and which comprises at least one receptacle opening for accommodating at least one strain relief bushing.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: September 6, 2022
    Assignee: ICOTEK PROJECT GMBH & CO. KG
    Inventors: Bruno Ehmann, Valentin Ehmann
  • Patent number: 11439000
    Abstract: A structural element fixing structure is provided. A flange of a first fixing element is connected with a side surface of a first shaft of the first fixing element. A first structure is fixed on the first fixing element. A second fixing element clamps the flange. An accommodating portion of the second fixing element is connected with a groove portion of the second fixing element. The accommodating portion has an accommodating space configured to accommodate the flange. A second shaft of the second fixing element is connected with the accommodating portion and is on a side of the accommodating portion facing away from the groove portion. A second structure is fixed on the second shaft of the second fixing element. The second fixing element separates the second structure and the first fixing element.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: September 6, 2022
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventor: Yung-Teng Fu
  • Patent number: 11433831
    Abstract: A wire harness including: a wire member; a protector that houses the wire member; a first corrugated tube that extends externally from an end of the protector and covers an outer circumference of the wire member; a second corrugated tube that is provided at a location that is on an opposite side to the protector with respect to the first corrugated tube and spaced apart from the first corrugated tube, and covers the outer circumference of the wire member; a first fixing member that fixes the wire member to the first corrugated tube and the second corrugated tube; and an exterior cover that covers the outer circumference of the wire member.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: September 6, 2022
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Yuji Nishi, Yuki Morimoto
  • Patent number: 11424607
    Abstract: An explosion-proof assembly (20) is provided for guiding at least one conductor device (21) through a wall without ignition transmission. The assembly (20) has at least one bushing part (24) arranged in the wall having one or more bushing openings, each of which is delimited in the circumferential direction by a bushing surface. A connecting body (23) is associated with each conductor device (21) coaxially surrounds a mounting portion of the conductor device (21) in a flamegap-free connection. The connecting body (23) has a first outer delimiting surface and the bushing opening defines a second delimiting surface. A flameproof Ex gap (34) is formed between the two delimiting surfaces by at least partial insertion of the connecting body (23) into the bushing opening. Bushing openings without a connecting body (23) are closed in a flameproof manner by a closure member (70). A securing device (52) secures the connecting body (23) in the bushing opening (48).
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: August 23, 2022
    Assignee: R. STAHL Schaltgeräte GmbH
    Inventors: Maxim Kutsch, Fabian Roll
  • Patent number: 11417953
    Abstract: A compact electronic device for wireless communication is disclosed. The compact electronic device includes a main printed circuit board, one or more antennas, at least one conductor, and a shell. The one or more antennas are configured for wireless communication. The at least one conductor being configured to provide at least one of control signals and power to a fan. The shell mounts the fan relative to the main printed circuit board. The shell includes walls forming a cavity. The walls encapsulate the conductor in the cavity.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: August 16, 2022
    Assignee: Plume Design, Inc.
    Inventors: Miroslav Samardzija, Chien Chang Chen, Ming-Tsung Su, Brian Nam, Liem Hieu Dinh Vo, William McFarland
  • Patent number: 11412608
    Abstract: A flexible printed circuit board comprises a conducting layer that includes a first signal line, a first ground plane and a second ground plane. A first shielding via extends from a third ground plane to a fourth ground plane and extends through the first ground plane to electrically connect the first ground plane, the third ground plane and the fourth ground plane. A second shielding via extends from the third ground plane to the fourth ground plane. The first ground plane, the second ground plane, the third ground plane, the fourth ground plane, the first shielding via and the second shielding via, together, circumferentially surround the first signal line to minimize electromagnetic interference with the first signal line.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: August 9, 2022
    Assignee: Nortech Systems, Inc.
    Inventor: Scott G. Blanc
  • Patent number: 11404184
    Abstract: For example, in an earphone in which left and right earphone units are connected by a cable and a remote part or a battery part is interposed on the cable, a bush structure is provided to a part where the cable is led out of the remote part and the like and suppresses the occurrence of disconnection in the vicinity of the lead-out part. The bush structure is provided to a lead-out part 5a of a cable 4 and includes a bush body 2 provided to the lead-out part and formed with a first through hole 2a2 where the cable is inserted. The first through hole gradually increases in diameter toward a lead-out direction of the cable.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: August 2, 2022
    Assignee: AUDIO-TECHNICA CORPORATION
    Inventors: Kozo Ando, Masaya Nakako
  • Patent number: 11400875
    Abstract: A holder configured to be fitted to a tube that is made of metal and through which a wire is to be inserted, the holder including: a tubular main body that includes a first end and a second end opposite to the first end, and is configured to be inserted into the tube; and a cover formed protruding radially outward from an outer circumferential surface of the main body at the first end, wherein: the cover is formed only in a portion of the main body in a circumferential direction, and the cover includes a wall that protrudes radially outward from the outer circumferential surface of the main body, and a guard that extends from a radially outward end of the wall toward the second end of the main body.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: August 2, 2022
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Hirokazu Nakai
  • Patent number: 11395407
    Abstract: A disclosed intermediate circuit arrangement includes first and second partial circuit boards of identical design having a series circuit of at least two capacitor banks. The partial circuit boards each have a terminal strip having a positive intermediate circuit connection, a negative intermediate circuit connection, and a central connection. The circuit arrangement also includes a connecting circuit board for electrically connecting the respective connections of the terminal strips of the two partial circuit boards to one another. The connecting circuit board is a multi-layer circuit board with two outer metal layers and at least two inner metal layers arranged between the outer metal layers.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: July 19, 2022
    Assignee: SMA Solar Technology AG
    Inventors: Zoltan Klausz, Ralf Harbusch
  • Patent number: 11387019
    Abstract: The present disclosure describes grommets formed of a polymeric material and adapted for holding a plurality of discrete cables. A grommet may comprise two halves, each half comprising: a main body having a generally arced outer surface, a plurality of angled cantilevered tines integrally coupled to the main body and extending generally radially inward from the main body; and a slidable interconnection feature integral with the main body, wherein the slidable interconnection feature for each respective half is dimensioned to mate with the slidable interconnection feature of the other half, allowing the two halves to slide into an interlocking position with each other when compressed together.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: July 12, 2022
    Assignee: CommScope Technologies LLC
    Inventors: Aviral Joshi, Ronald A. Vaccaro, Christopher Stockman