Abstract: An electrical arrangement (10), including: a first conductor (12) having a first generally planar contact area (34); a second conductor (12) having a second generally planar contact area (40); an intermediate conductor (44) having a first faying area (84) overlying the first contact area and a second faying area (86) overlying the second contact area; a compression arrangement configured to compress the first faying area and the first contact area toward each other and to compress the second faying area and the second contact area toward each other; and a dimpling structure (46) effective to create plural contact points (74) between the first faying area and the first contact area and between the second faying area and the second contact area when the first and the second faying areas and the first and second contact areas are compressed toward each other by the compression arrangement.

Abstract: A circuit interconnect generally comprises an electrical connection pad, a shape memory material, and a flowable conductor. The electrical connection pad has an upper surface, a portion of which is covered by the shape memory material. The flowable conductor extends through the shape memory material and is electrically coupled to the electrical connection pad. The shape memory material has a first configuration at a first temperature and a second configuration at a second temperature. In the instance of the second temperature being greater than the first, the shape memory material has a first configuration that is substantially planar and a second configuration that is cupped.

Abstract: A wiring substrate includes a core layer, a first wiring layer, a first insulating layer, a first via wiring, a second wiring layer, a second insulating layer, a second via wiring, a third wiring layer, a third insulating layer, a third via wiring, and a through-wiring. The through-wiring includes upper and lower end surfaces. The upper end surface has an area that is smaller than an area of the lower end surface. The upper surface of the first insulating layer is more flat than the lower surface of the third insulating layer. The second wiring layer has a wiring density that is higher than a wiring density of the first wiring layer.

Abstract: A mounting assembly is for a power pedestal including a number of electrical components. The mounting assembly includes a plurality of mounting members including a first mounting member and a second mounting member each structured to engage an elongated support member and be coupled to the elongated support member. The elongated support member has an end portion. The plurality of mounting members are cooperatively structured to enclose the end portion.

Abstract: An electric wire includes a conductor having a cross-sectional area of not less than 225 mm2 and not more than 275 mm2, an insulation provided so as to cover the outer periphery of the conductor, and a wire sheath provided so as to cover the outer periphery of the insulation. The amount of deflection is not less than 130 mm when, at 23° C., one end of the electric wire is fixed to a fixture table so that another end horizontally protrudes 400 mm from the fixture table and a weight of 2 kg is attached to the other end, and cracks and breaks do not occur when wound with a bending diameter of three times the diameter at ?40° C.

Abstract: An electric wire includes a conductor having a cross-sectional area of not less than 290 mm2 and not more than 360 mm2, an insulation provided so as to cover the outer periphery of the conductor, and a wire sheath provided so as to cover the outer periphery of the insulation. The amount of deflection is not less than 120 mm when, at 23° C., one end of the electric wire is fixed to a fixture table so that another end horizontally protrudes 400 mm from the fixture table and a weight of 2 kg is attached to the other end, and cracks and breaks do not occur when wound with a bending diameter of three times the diameter at ?40° C.

Abstract: A multi-receptacle housing assembly that includes a clamping assembly and a cover. The clamping assembly defines a first clamping section, a second clamping section and a cover support section. The first clamping section is located along a first side of the clamping assembly and is configured to clamp to a projection of an electronic device housing. The second clamping section is located along a second side of the clamping assembly opposite the first side and is configured to receive and support a plurality of electric receptacles. The cover removably is connected to the cover support section of the clamping assembly at least partially covering the first clamping section and the cover support section. The cover defines an opening dimensioned to expose at least a portion of the second clamping section and the plurality of electric receptacles.

Abstract: There is provided a multilayer ceramic electronic component including, a ceramic body including a plurality of dielectric layers stacked in a thickness direction, satisfying T/W>1.0 when a width and a thickness thereof are defined as W and T, respectively, and having a groove portion inwardly recessed in a length direction in at least one main surface thereof, a plurality of first and second internal electrodes disposed in the ceramic body to face each other, having the dielectric layers interposed therebetween, and alternately exposed through both end surfaces of the ceramic body, and first and second external electrodes formed to extend from the both end surfaces of the ceramic body to the at least one main surface having the groove portion formed therein.

Abstract: Provided is a touch panel. The touch panel includes a substrate and an electrode member disposed on the substrate. The electrode member includes a base material for electrode having first and second surfaces opposite to each other, a first electrode disposed on the first surface, and a second electrode disposed on the second surface.

Abstract: A gas turbine engine 10 is provided with electrical harness rafts 200 comprising electrical conductors embedded in a rigid composite material. The rafts 200 are used to transport electrical signals (which may be, for example power and/or control signals) around a gas turbine engine. Rafts 200 may be connected together and to other components using flexible cables, that may help to accommodate relative movement of the rafts 200, for example through vibration. The rafts 200 are lighter, more compact, and more convenient to handle than conventional electrical harnesses. The rafts 200 may provide a convenient and secure mounting surface for other components/systems of a gas turbine engine, such as EECs and/or fluid pipes.

Abstract: A system and a method are presented. The system includes an electrically conducting material and an electrical insulation system. The electrical insulation system includes a layered insulation tape that has a first layer and a second layer. The first layer includes a mica paper and a binder resin in a range from about 5 wt % to about 12 wt % of the insulation tape. The second layer includes a composite of layered nanoparticles dispersed in a polyetheretherketone (PEEK) matrix. The second layer laminates the first layer. The method includes attaching the first layer and the second layer with or without the addition of further resin; using the layered insulation tape as a turn insulation and ground wall insulation for an electrically conducting material; and impregnating the system with a nanofiller-incorporated resin by a vacuum pressure impregnation method, to form an insulation system within the system.

Abstract: A cable may include a plurality of twisted pairs of individually insulated conductors and a separator positioned between the twisted pairs. The separator may include a longitudinally extending spine positioned between the plurality of twisted pairs, and a plurality of bristles may radially extend from the spine. A first portion of the bristles may extend between one or more sets of adjacent twisted pairs, and a second portion of the bristles may be compressed towards the spine by one or more of the plurality of twisted pairs. Additionally, a jacket may be formed around the twisted pairs and the separator.

Abstract: A multi-layer wiring board is configured having stacked therein, in a stacking direction, via an adhesive layer, a plurality of printed wiring bases in each of which a wiring pattern and a via are formed on/in a resin base. A multi-layer wiring board includes a movable portion configured from an elastic member and a void portion, the movable portion being formed in the printed wiring bases and adhesive layer in a periphery of a matrix-shaped plurality of multi-layer wiring portions disposed at a certain interval as viewed in a planar manner, and the movable portion joining the plurality of multi-layer wiring portions such that each of the multi-layer wiring portions is displaceable in the stacking direction and a direction of surfaces of the printed wiring bases.

Abstract: A wiring substrate includes a first wiring structure and a second wiring structure. The first wiring structure includes a first insulating layer, which covers a first wiring layer, and a via wiring. A first through hole of the first insulating layer is filled with the via wiring. The second wiring structure includes a second wiring layer and a second insulating layer. The second wiring layer is formed on an upper surface of the first insulating layer and an upper end surface of the via wiring. The second wiring layer partially includes a roughened surface. The second insulating layer is stacked on the upper surface of the first insulating layer and covers the second wiring layer. The second wiring structure has a higher wiring density than the first wiring structure. The roughened surface of the second wiring layer has a smaller surface roughness than the first wiring layer.

Abstract: The present invention relates to a substrate comprising a build-up and a solder resist layer disposed on the build-up. The solder resist layer has an upper surface facing away from the build-up. The solder resist layer has a plurality of grooves on its upper surface. The grooves of the solder resist layer can better eliminate or relieve the stress accumulated on large solder resist area induced by heat and/or material coefficient of thermal expansion mismatch of the substrate and thus can prevent and diminish warpage of the substrate or package.

Abstract: A wiring substrate includes a first wiring structure and a second wiring structure stacked thereon. The first wiring structure includes a first insulation layer and a via wiring extending through the first insulation layer. The second wiring structure includes a first wiring layer formed on the first insulation layer and the via wiring, and a first plane layer stacked on the first insulation layer and at least partially grid-shaped in a plan view to define second through holes. A second insulation layer is stacked on the first insulation layer to fill the second through holes and cover the first plane layer and the first wiring layer. The second wiring structure has a higher wiring density than the first wiring structure. The second through holes each include a lower open end and an upper open end having a smaller open width than the lower open end.

Abstract: A system and method of isolating a layer-to-layer transition between conductors in a multilayer printed circuit board includes formation of a first ground via at least partially surrounding a first signal conductor in at least one layer of the printed circuit board and formation of a second ground via at least partially surrounding a second signal conductor in another layer of the printed circuit board. The first and second ground vias are plated with a conductive material.

Abstract: Communication cable including insulated conductors and a composite tape having an insulative layer and a conductive layer. The composite tape includes first and second lateral sections that are folded over each other to form a shielding tape. The shielding tape includes opposite inner and outer sides that are formed from the first and second lateral sections, respectively, and a folded edge that joins the inner and outer sides. The conductive layer defines the inner side, the outer side, and the folded edge. The shielding tape is wrapped helically about the insulated conductors a plurality of times along a length of the communication cable to form a plurality of wraps. The inner side of a subsequent wrap of the shielding tape overlaps a portion of the outer side of a prior wrap of the shielding tape.

Abstract: A component built-in board comprises a multi-layer structure comprising a plurality of unit boards stacked therein a plurality of electronic components built in thereto in a stacking direction. The plurality of unit boards include: a first board having a first insulating layer and comprising an opening in which the electronic component is housed; and an intermediate board adjacent to the first board and comprising a first adhesive layer provided on at least a side of the first board of a second insulating layer. The intermediate board includes a first wiring layer formed at a position overlapping in the stacking direction a gap between an inner periphery of the opening and an outer periphery of the electronic component of the first board on a surface on the first board side of the second insulating layer.

Abstract: A wiring board includes first insulating layers; first wiring layers; first via wirings; second insulating layers; second wiring layers; second via wirings; and a solder resist layer, wherein the first insulating layers are composed of non-photosensitive resin, wherein the second insulating layers, and the solder resist layer are composed of photosensitive resin, respectively, wherein the first surface of the uppermost first insulating layer and the first end surface of the first via wiring embedded in the uppermost first insulating layer are polished surfaces, wherein the first end surface of the first via wiring embedded in the uppermost first insulating layer is flush with the first surface of the uppermost first insulating layer, and wherein the wiring density of the second wiring layers is higher than the wiring density of the first wiring layers.