Patents Examined by Patrick R. Jewik
  • Patent number: 5688601
    Abstract: An electrical component comprising an electrical component having an exterior protective layer on at least a portion of a surface. The layer is a cured copolymer of a reaction between at least one oligomer having a terminal ethylenically unsaturated group and at least one monomer having a terminal ethylenically unsaturated group. Alternatively, the layer is a cured copolymer of a reaction between at least two oligomers having a terminal ethylenically unsaturated group. The copolymerization reaction is preferably in the presence of a free radical initiator curing agent and a transition metal catalyst.
    Type: Grant
    Filed: March 25, 1994
    Date of Patent: November 18, 1997
    Assignee: Caschem, Inc.
    Inventors: Douglas A. Usifer, Melvin Brauer, James C. Chang, Yuan Chieh Chu
  • Patent number: 5672414
    Abstract: A metallic printed board is formed by laminating an insulation layer on the surface of a metallic sheet as a base, and then electronic parts are mounted on the conductor pattern formed on the surface of the insulation layer. A double-sided printed board mounted thereon electronic parts is placed in parallel. Both the printed boards are supported and fixed monolithically by filling the space between the printed boards with an insulation resin and curing the resin. Furthermore, an insulation resin is laminated on the surface of the printed board in such a manner that the resin may cover the mounted electronic parts, and cured. The heat generated from the electronic parts can be efficiently transmitted to the insulation resins by using a resin having a high thermal conductivity for both of the insulation resins, and the heat is then emitted from the surfaces of the metallic sheet or the insulation resin.
    Type: Grant
    Filed: June 21, 1994
    Date of Patent: September 30, 1997
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Kenji Okamoto, Yukio Nakajima, Kazuhiko Imamura, Takao Ichihara
  • Patent number: 5611884
    Abstract: A method and composition for joining flip chips back-side-up with respect to substrates by applying an adhesive between the active side of the flip chip and the substrate. The adhesive is a conductive silicone pressure sensitive adhesive containing (i) a silicone resin, (ii) a siloxane gum, (iii) a conductive particulate material, and optionally, (iv) a peroxide catalyst. Suitable conductive particulate materials are silver-clad glass fibers; spherical gold particles; spherical hollow glass microspheres coated with silver, gold, nickel, or copper; or spherical particles of metal alloys of Sn/Cu, Pb/Sn, or Au/Sn. The adhesive can be applied as a ball or bump itself, in conjunction with a solder ball or bump, or in the form of tape sandwiched between the flip chip and substrate.
    Type: Grant
    Filed: December 11, 1995
    Date of Patent: March 18, 1997
    Assignee: Dow Corning Corporation
    Inventors: Clayton R. Bearinger, Robert C. Camilletti, Jack S. Kilby, Loren A. Haluska, Keith W. Michael
  • Patent number: 5571602
    Abstract: A superconducting magnet shield includes a plurality of overlapping NbTi sheets welded together with a plurality of welds extending along elongated parallel slots in the overlap region with the slots extending in the direction of superconducting current flow.
    Type: Grant
    Filed: December 29, 1994
    Date of Patent: November 5, 1996
    Assignee: General Electric Company
    Inventors: Phillip W. Eckels, Delton A. Grey, Jr., Christopher G. King, Anthony Mantone, O'Neil T. McClam, Granville G. Ward, Jr.
  • Patent number: 5556716
    Abstract: New x-ray photoconductive compositions are disclosed which are certain composites containing (1) inorganic clusters of VB-VIB semiconductors, VB-VIIB semiconductors, IIB-VIB semiconductos, IIB-VB semiconductors, IIIB-VB semiconductors, IIIB-VIB semiconductors, IB-VIB semiconductors and/or IVB-VIIB semiconductors and (2) polymers which are essentially non-carrier-transporting in the absence of x-rays. Also disclosed is an x-ray radiograpy apparatus which employs an image receptor which is a composite of certain inorganic clusters and polymers. A method is disclosed for enhancing the x-ray absorbing efficiency of a polymer which is essentially non-carrier transporting in the absence of x-rays and the x-ray photoconductivity of said polymer by doping the polymer with an effective amount of clusters having a size within the range of from about 0.001 .mu.m to 10 .mu.m.
    Type: Grant
    Filed: August 25, 1994
    Date of Patent: September 17, 1996
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Norman Herron, Ying Wang
  • Patent number: 5545612
    Abstract: A superconductor element includes a first layer of an oxide superconductor, a second layer of an insulator, semiconductor, or metal, and an interlayer interposed between the first and second layers and formed of AgO.sub.x (where in 0<.times.< 1/2) .
    Type: Grant
    Filed: May 1, 1995
    Date of Patent: August 13, 1996
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Koichi Mizushima, Jiro Yoshida, Koh-ichi Kubo
  • Patent number: 5541012
    Abstract: A new infrared-to-visible up-conversion material is provided which can be applied to an infrared light identification element having a useful conversion efficiency and sensitivity for infrared light in the wavelength of 1.5 .mu.m band, 0.98 .mu.m band and 0.8 .mu.m band without the necessity of previous excitation of the material. This infrared-to-visible up-conversion material consists of an inorganic material comprising at least two elements of erbium (Er) and a halogen or compounds thereof.
    Type: Grant
    Filed: October 26, 1994
    Date of Patent: July 30, 1996
    Assignees: Nippon Telegraph and Telephone Corporation, Sumita Optical Glass, Inc.
    Inventors: Junichi Ohwaki, Yuhu Wang, Atsushi Shibukawa, Naruhito Sawanobori, Shinobu Nagahama
  • Patent number: 5538795
    Abstract: A multilayer structure has a selectable, (i) propagating reaction front velocity V, (ii) reaction initiation temperature attained by application of external energy and (iii) amount of energy delivered by a reaction of alternating unreacted layers of the multilayer structure. Because V is selectable and controllable, a variety of different applications for the multilayer structures are possible, including but not limited to their use as ignitors, in joining applications, in fabrication of new materials, as smart materials and in medical applications and devices. The multilayer structure has a period D, and an energy release rate constant K. Two or more alternating unreacted layers are made of different materials and separated by reacted zones. The period D is equal to a sum of the widths of each single alternating reaction layer of a particular material, and also includes a sum of reacted zone widths, t.sub.i, in the period D.
    Type: Grant
    Filed: July 15, 1994
    Date of Patent: July 23, 1996
    Assignee: The Regents of the University of California
    Inventors: Troy W. Barbee, Jr., Timothy Weihs
  • Patent number: 5534359
    Abstract: A calibration standard comprises a supporting structure (1) of single crystal material with at least one pair of different kinds of structures consisting of a raised line (2) and a trench (3). These structures have the identical width in the range of about 500 nm. The single crystal material preferably is silicon with (110)-orientation.
    Type: Grant
    Filed: June 7, 1994
    Date of Patent: July 9, 1996
    Assignee: International Business Machines Corporation
    Inventors: Johann W. Bartha, Thomas Bayer, Johann Greschner, Martin Nonnenmacher, deceased, Helga Weiss
  • Patent number: 5534331
    Abstract: A method in which a multi-layered ceramic circuit board made of a hybrid laminate consisting of green sheets containing hollow silica and green sheets containing no hollow silica is manufactured without failures occurring during the firing of the laminate. By incorporating quartz glass into a first ceramic material containing hollow silica to replace part of the hollow silica with quartz glass, the compositions of the first ceramic material and a second ceramic material containing no hollow silica are controlled so that the difference between the percentages of shrinkage on firing of the green sheets formed of the first and second ceramic materials is within 1%.
    Type: Grant
    Filed: March 24, 1994
    Date of Patent: July 9, 1996
    Assignee: Fujitsu Limited
    Inventors: Shigenori Aoki, Hiroshi Kamezaki, Masaharu Hida, Kishio Yokouchi
  • Patent number: 5529980
    Abstract: The present invention concerns a multilayered structure comprising copper-oxide perovskite material having strained crystallographic lattices and altered superconductive properties. The multilayer structure of the invention comprises at least one first layer of a first copper-oxide material and at least one second layer of a second, different copper-oxide perovskite material. The first and second layers are adjacent to one another in an epitaxial lattice-distortion relationship. The first and second copper-oxide perovskite materials in unstressed bulk states define respectively first and second comparison nondistorted crystallographic lattice structures. The first and second comparison nondistorted crystallographic lattice structures have unit cell dimensions which differ in at least one dimension. The first copper-oxide perovskite material in the first layer has a first crystallographic lattice structure which is distorted relative to the first comparison nondistorted crystallographic lattice structure.
    Type: Grant
    Filed: June 23, 1994
    Date of Patent: June 25, 1996
    Assignee: International Business Machines Corporation
    Inventor: Arunava Gupta
  • Patent number: 5527586
    Abstract: A method and apparatus for making a template used in manufacturing printed circuit boards is disclosed. The template is made from boron nitride, silicon nitride or similar material which has a melting temperature higher than the melting temperature of the metal forming the conductors in the printed circuit board, is readily machinable or moldable with the desired circuit pattern, and does not adhere to the metal conductors after the metal particles have been melted onto the substrate.
    Type: Grant
    Filed: December 19, 1994
    Date of Patent: June 18, 1996
    Assignee: Printron, Inc.
    Inventors: Eleanor Schuler, Burt DeVolk, Kim Krubsack
  • Patent number: 5527629
    Abstract: The invention concerns a process for depositing a thin layer of silicon oxide bonded to a substrate of a polymeric material comprising, concomitantly or consecutively (1) subjecting a surface of the substrate to an electrical discharge with dielectric barrier and (2) exposing said surface of the substrate to an atmosphere containing a silane, thus forming a deposit of silicon oxide bonded to said surface of the substrate Application to the production of sheets or films useful for example as food wrapping.
    Type: Grant
    Filed: May 24, 1994
    Date of Patent: June 18, 1996
    Assignee: L'Air Liquide, Societe Anonyme pour l'Etude et l'Exploitation des Procedes Georges Claude
    Inventors: Michel-Jacques Gastiger, Franciscus Slootman, Pascal Bouard, Antoine Willemot
  • Patent number: 5510166
    Abstract: Disclosed are an inhibitor parcel comprising (a) a composition comprising an unsaturated fatty acid compound as its main ingredient and (b) a permeable diffusing-parcelling material prepared by laminating and bonding an oxygen-permeable resin layer onto one side of a base sheet made of a fibrous material and an adhesive or onto one adhesive-coating side of a base sheet made of a fibrous material, then laminating and bonding thereonto an oxygen-permeable resin layer and laminating and bonding a porous film of low softening point resin or a low softening point unwoven fabric onto the other side of the base sheet, said permeable diffusing-parcelling material (b) having an oxygen permeability of 10.sup.4 to 10.sup.6 ml/m.sup.2.Atm.Day and a (water vapor permeability/oxygen permeability) ratio of 0.02 H.sub.2 O mg.Atm/O.sub.2 ml! or above at 25.degree. C.
    Type: Grant
    Filed: January 31, 1995
    Date of Patent: April 23, 1996
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Yoshiaki Inoue, Shigeru Murabayashi, Yoshio Yoshikawa, Takeshi Nagasaka, Yoshihiko Harima, Isamu Yoshino
  • Patent number: 5506198
    Abstract: In a high-temperature superconductive conductor winding (1) comprising a tape-shaped high-temperature superconducting wire (2) which is combined with a metal 5 and wound into the form of a double pancake coil, the length of a throughout portion (5) provided between pancakes (4, 6) is at least four times the width of the tape-shaped high-temperature superconducting wire. Thus, it is possible to suppress generation of shearing stress at 10 the throughout portion (5), thereby preventing reduction of the critical current density caused by such shearing stress.
    Type: Grant
    Filed: September 6, 1994
    Date of Patent: April 9, 1996
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventor: Kenichi Sato
  • Patent number: 5486406
    Abstract: A new class of organometallic complexes for use in electroluminescent (EL) devices and a method of preparation are disclosed. The organometallic complexes are prepared by mixing organic ligands with metal salts in the presence of a base and a layer is formed in an EL device by vacuum evaporation. The organometallic material in the EL device serves as either an electron transporting layer or a light emission layer, or both.
    Type: Grant
    Filed: November 7, 1994
    Date of Patent: January 23, 1996
    Assignee: Motorola
    Inventor: Song Q. Shi
  • Patent number: 5480695
    Abstract: Substrates are disclosed having an ultra-smooth surface finish thereon rendering them useful in making high density magnetic storage components, such as a computer hard disk or thin-film head which can read and/or write data on such disks. The substrates are comprised of a non-oxide ceramic base which is coated with a smoothing layer comprised of amorphous, non-stoichiometric silicon carbide corresponding to the formula SiC.sub.x, wherein x is the molar ratio of carbon to silicon and is greater than 1. Also disclosed are processes for making the substrates and components.
    Type: Grant
    Filed: August 10, 1994
    Date of Patent: January 2, 1996
    Inventors: Michael A. Tenhover, Irving R. Ruppel
  • Patent number: 5480724
    Abstract: The invention provides a fuser roll useful for heat-fixing an electrographic toner to a substrate, wherein the roll comprises a core having thereon a base cushion layer comprising a condensation-crosslinked poly(dimethylsiloxane) elastomer, characterized in that the base cushion layer has tin oxide particles dispersed therein in a concentration of from 20 to 40 percent of the total volume of the base cushion layer.The base cushion layer of such a fuser roll has been unexpectedly found to exhibit only minimal weight loss, creep, and changes in hardness, over time, when subjected to conditions of elevated temperature and cyclic stress.
    Type: Grant
    Filed: December 14, 1993
    Date of Patent: January 2, 1996
    Assignee: Eastman Kodak Company
    Inventors: John J. Fitzgerald, Wayne T. Ferrar
  • Patent number: 5480725
    Abstract: A fuser member having a core and a layer overlying the core. The layer includes: an addition crosslinked polyorganosiloxane elastomer, and tin oxide particles dispersed therein in a concentration of from 20 to 40 percent of the total volume of the layer.
    Type: Grant
    Filed: September 14, 1994
    Date of Patent: January 2, 1996
    Assignee: Eastman Kodak Company
    Inventors: John J. Fitzgerald, Wayne T. Ferrar, Tonya D. Binga, Michael W. Fichtner
  • Patent number: 5476719
    Abstract: A multi-layer microstrip structure includes a substrate and a first superconducting layer deposited on the substrate. A first dielectric layer, made at least partially of benzocyclobutene (BCB), is deposited on the first superconducting layer. Additional superconducting dielectric and superconducting layers can be employed. Preferably the superconducting layers are made from niobium. The multilayer microstrip structure is ideally suited for use in passive circuit components of microwave circuits and in multi-chip modules.
    Type: Grant
    Filed: August 17, 1994
    Date of Patent: December 19, 1995
    Assignee: TRW Inc.
    Inventors: Robert D. Sandell, Andrew D. Smith