Patents Examined by Patrick R. Jewik
  • Patent number: 5344707
    Abstract: Fiberballs for filling uses in pillows, cushions and for like support purposes, from blends of slickened fiberfill of regular denier, to provide support and resilience, mixed with minor amounts of lower denier slickened fibers to provide optimum aesthetics.
    Type: Grant
    Filed: January 28, 1993
    Date of Patent: September 6, 1994
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Adrian C. Snyder
  • Patent number: 5338721
    Abstract: A superconducting composite comprising a compound oxide type superconductor and an outer metal pipe on which said superconductor is supported, characterized in that (i) said outer metal pipe is made of at least one of metals selected from a group comprising gold, silver and platinum metals and their alloys or (ii) an intermediate layer made of these precious metals is interposed between the compound oxide and the metal pipe.The composite may be in a form of a solid pipe or a hollow pipe having a superconducting thin layer deposited on an inner surface of the metal pipe.
    Type: Grant
    Filed: May 18, 1992
    Date of Patent: August 16, 1994
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Susumu Yamamoto, Teruyuki Murai, Nozomu Kawabe, Tomoyuki Awazu, Shuji Yazu, Tetsuji Jodai
  • Patent number: 5320908
    Abstract: Metallic silver is deposited upon the surface of a nonconducting substrate using a multi-step wet deposition process. The surface is cleaned, and then activated in an aqueous solution containing stannous tin. The silver is deposited as a colloidal material from an aqueous solution of a silver-containing salt, a reduction agent that reduces the salt to form the metallic silver, and a deposition control agent that prevents the silver from nucleating throughout the solution. After the substrate is coated, the coating is stabilized in an aqueous solution of a salt of a metal from the platinum group of gold, dissolved in dilute hydrochloric acid. The process is particularly effective for depositing uniform films of 2 to 2000 Angstroms thickness, which strongly adhere to the substrate.
    Type: Grant
    Filed: February 12, 1993
    Date of Patent: June 14, 1994
    Assignee: Ad Tech Holdings Limited
    Inventors: Billy V. Sodervall, Thomas Lundeberg
  • Patent number: 5300348
    Abstract: An improvement is proposed in a frame-supported pellicle consisting of a frame member and a thin transparent polymer membrane adhesively bonded to the frame member used for dustproof covering of a photomask in a photolithograpic patterning work of electronic devices. The improvement comprises using a specific fluorocarbon group-containing organosiloxane-based polymeric composition as an adhesive for adhesively bonding the frame member and the polymer membrane. This adhesive is effective even when the polymeric membrane is formed from a fluorocarbon polymer which is hardly susceptible to adhesive bonding with conventional adhesives. In addition, the adhesive bonding by use of this specific adhesive is highly durable even under irradiation with ultraviolet light.
    Type: Grant
    Filed: October 8, 1992
    Date of Patent: April 5, 1994
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshihiro Kubota, Meguru Kashida, Yoshihiko Nagata, Hitoshi Noguchi, Yuichi Hamada, Shinichi Sato, Hiroshi Inomata
  • Patent number: 5288553
    Abstract: Polyester fine filaments having excellent mechanical quality and uniformity, and preferably with a balance of good dyeability and shrinkage, are prepared by a simplified direct spin-orientation process by selection of polymer viscosity and spinning conditions.
    Type: Grant
    Filed: January 19, 1993
    Date of Patent: February 22, 1994
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Robert J. Collins, Hans R. E. Frankfort, Stephen B. Johnson, Benjamin H. Knox, Elmer E. Most, Jr.
  • Patent number: 5283108
    Abstract: A process for producing defect free multilayer printed circuit boards using low pressure lamination with a cyanate ester laminate. Alternate layers of cyanate ester core and prepreg materials are stacked and at least partially cured under pressure and elevated temperatures to produce a multilayer laminated printed circuit board. The use of a low pressure cure avoids the storage of stress within the laminate. Such stress would otherwise produce microcracking and/or delamination of the circuit board when the stress is released during the subsequent thermal cycling or exposure to caustics attendant with working and reworking of the printed circuit board.
    Type: Grant
    Filed: November 12, 1992
    Date of Patent: February 1, 1994
    Assignee: Hewlett-Packard Company
    Inventor: Glenn T. Haddick
  • Patent number: 5283095
    Abstract: A metal film high in reflectivity and excellent in adhesion to a synthetic resin substrate even in the case where the metal film is sufficiently thin, is formed on a surface of the substrate by sputtering a metal target through an inert gas ion beam drawn out of an ion source in a vacuum vessel. An aluminum film coated matter formed by coating a surface of a synthetic resin substrate with an aluminum film, is characterized in that the aluminum film contains aluminum crystals at a portion in the film at a depth of not more than 600 .ANG. from a film surface thereof which contacts with the substrate. The aluminum crystals has a relation in which a crystal axis <111> perpendicular to a (111) plane is perpendicular or substantially perpendicular to the film surface. Also, the aluminum crystals exhibits a diffraction X-ray spectrum of a (111) plane when measured by X-ray diffraction according to a diffractometer method under the following conditions: target: Cu, X-ray type: K.alpha.
    Type: Grant
    Filed: April 10, 1992
    Date of Patent: February 1, 1994
    Assignees: Nissin Electric Co., Ltd., Kuraray Co., Ltd.
    Inventors: Shigeo Matsumaru, Toru Watanabe, Akira Kubotsu, Shuichi Nogawa, Kiyoshi Ogata, Daisuke Inoue
  • Patent number: 5273959
    Abstract: An alloy having a low reactivity towards certain high temperature superconducting materials at temperatures up to about 10.degree. C. lower than the melting point of the alloy. The alloy is a ternary silver-based alloy consisting, by weight, of 0.5-9% palladium, 20-40% gold, balance silver. Using the alloy and a superconducting material of the type R-Ba-Cu-O, where R is yttrium or a rare earth element, composite conductors can be formed at temperatures equal or higher than the temperature of peritectic decomposition of the superconductor. The alloy may also be used as a buffer layer or cladding material on substrates having unacceptably high reactivity towards the superconducting material.
    Type: Grant
    Filed: November 4, 1992
    Date of Patent: December 28, 1993
    Assignee: National Research Council of Canada
    Inventors: Paul Lambert, Claude Gelinas, Blaise Champagne, Julian Cave
  • Patent number: 5273812
    Abstract: A method for producing a thick film type of non-fogging sheets having a thickness of 30 .mu.m or more comprises the steps of: preparing a solvent-free composition comprising (a) a polymer, (b) a hydrophilic monomer and (c) a surface active agent and having a viscosity of 50,000 cP or less, applying this composition as a coating on the surface of a backing film without recourse to any solvent, and crosslinking the thus coated composition by exposure thereof to ionizing radiation, thereby forming a hydrophilic film having a thickness of 30 .mu.m or more.
    Type: Grant
    Filed: December 24, 1991
    Date of Patent: December 28, 1993
    Assignee: Dai Nippon Insatsu Kabushiki Kaisha
    Inventors: Kiyoshi Oguchi, Kenji Ueda, Osamu Takekoh, Tomio Doi, Masahiro Yamamoto
  • Patent number: 5262394
    Abstract: A ceramic superconductor comprising a metal oxide substrate, a ceramic high temperature superconductive material, and a intermediate layer of a material having a cubic crystal structure, said layer situated between the substrate and the superconductive material is provided, and a structure for supporting a ceramic superconducting material is provided, said structure comprising a metal oxide substrate, and a layer situated over the surface of the substrate to substantially inhibit interdiffusion between the substrate and a ceramic superconducting material deposited upon said structure.
    Type: Grant
    Filed: December 27, 1991
    Date of Patent: November 16, 1993
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventors: Xin D. Wu, Ross E. Muenchausen
  • Patent number: 5252551
    Abstract: An article of manufacture including a substrate, a patterned interlayer of a material selected from the group consisting of magnesium oxide, barium-titanium oxide or barium-zirconium oxide, the patterned interlayer material overcoated with a secondary interlayer material of yttria-stabilized zirconia or magnesium-aluminum oxide, upon the surface of the substrate whereby an intermediate article with an exposed surface of both the overcoated patterned interlayer and the substrate is formed, a coating of a buffer layer selected from the group consisting of cerium oxide, yttrium oxide, curium oxide, dysprosium oxide, erbium oxide, europium oxide, iron oxide, gadolinium oxide, holmium oxide, indium oxide, lanthanum oxide, manganese oxide, lutetium oxide, neodymium oxide, praseodymium oxide, plutonium oxide, samarium oxide, terbium oxide, thallium oxide, thulium oxide, yttrium oxide and ytterbium oxide over the entire exposed surface of the intermediate article, and, a ceramic superco nFIELD OF THE INVENTIONThe pre
    Type: Grant
    Filed: December 27, 1991
    Date of Patent: October 12, 1993
    Assignee: The United States of America as represented by the Department of Energy
    Inventors: Xin D. Wu, Ross E. Muenchausen
  • Patent number: 5252543
    Abstract: Improvement in a superconducting thin film of compound oxide represented by the formula: LnBa.sub.2 Cu.sub.3 O.sub.7- .delta. (Ln is lanthanide) or (La.sub.1-x .alpha..sub.x).sub.2 CuO.sub.4 (.alpha. is Ba or Sr) deposited on a substrate or core made of MgO, SrTiO.sub.3 or ZrO.sub.2 by physical vapor deposition technique, the surface roughness R.sub.max (datum length=1,000 .mu.m) of the superconducting thin film being less than 0.2 .mu.m.
    Type: Grant
    Filed: January 31, 1991
    Date of Patent: October 12, 1993
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Saburo Tanaka, Hideo Itozaki, Kenjiro Higaki, Shuji Yazu, Tetsuji Jodai
  • Patent number: 5244691
    Abstract: A process for depositing a thin layer of a ceramic composition on a substrate, which comprises:a) dissolving basic constituents of the ceramic composition, which are added in simple or mixed form to a solvent;b) adding to the solution, acetylacetone and hexamethylene tetramine in proportions suitable to the deposit method used;c) maturing or polymerizing the substance obtained in step b);d) depositing a layer of the substance on a substrate;e) drying the deposited layer, andf) sintering the layer deposited at low temperature.
    Type: Grant
    Filed: November 20, 1990
    Date of Patent: September 14, 1993
    Assignee: Thomson-CSF
    Inventors: Isabelle (wife Campion) Valente, Sylvain Faure, Philippe Gaucher, Jacques Livage