Patents Examined by Pete Lee
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Patent number: 9403494Abstract: To provide a tolerance absorbing structure for a wire harness which can prevent in advance the assembling failure at the time of mounting wires on a vehicle and also can improve the assembling workability. The tolerance absorbing structure includes a shield shell 29 which is formed in a cylindrical shape so as to have a fitting space therein and has a supporting piece 41 to be fastened by a vehicle stud bolt 39 and protruding in the direction perpendicular to the axis line of the fitting space, and an inner holder 31 which is fitted into the fitting space of the shield shell 29 along the axis line direction thereby to be held in a manner of being restricted from being separated from the shield shell 29 and has a wire holding hole extending in the axis line direction for fixing wires 23, 23 inserted therein, wherein the inner holder 31 is held within the fitting space of the shield shell 29 so as to have a movable space in the axis line direction.Type: GrantFiled: May 13, 2010Date of Patent: August 2, 2016Assignee: YAZAKI CORPORATIONInventors: Masahiro Deno, Yoshitaka Tsushima
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Patent number: 9401591Abstract: A wiring structure of electric wire is provided in which the efficiency of wiring electric wires can be improved and the wiring space can be saved. The wiring structure of electric wire includes an electric wire having a U-shaped excessive part provided in its middle part along the relatively-moving direction of two structures, and a longitudinally-appended spring member provided longitudinally along the electric wire. Fixing positions P1 and P2 of opposite ends of the electric wire are set to offset positions which are deviated in position respectively in two directions perpendicular to the relatively-moving direction of the two structures, and an elastic rod member which has a circular or regular polygonal cross section, having a property of non-biased bending in direction, is used as the longitudinally-appended spring member.Type: GrantFiled: May 16, 2011Date of Patent: July 26, 2016Assignee: YAZAKI CORPORATIONInventors: Kunihiko Satou, Atsuyoshi Yamaguchi
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Patent number: 9383043Abstract: A sealing tube for a line conduit, in which the sealing tube can be held at its ends, which can be distorted in reference to each other about its longitudinal axis. Inside the sealing tube, several separate sealing elements are arranged, which extend over a small portion of the length of the sealing element.Type: GrantFiled: December 21, 2011Date of Patent: July 5, 2016Assignee: HILTI AKTIENGESELLSCHAFTInventors: Manfred Klein, Tom Hager
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Patent number: 9320151Abstract: A sleeve structure includes an electrically insulating protective sleeve having clips that retain and capture component pins and regulate a mounting distance of the electrical component from a wiring structure. A method of component wiring assembly is also included.Type: GrantFiled: October 17, 2012Date of Patent: April 19, 2016Assignee: General Electric CompanyInventor: Khanh Q. Nguyen
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Patent number: 9313880Abstract: A determination mark formation portion is provided in each suspension board. In the determination mark formation portion, a recess having a given depth is provided in a base insulating layer. An outer peripheral portion is formed on the base insulating layer to surround the recess. A plating layer is formed on the outer peripheral portion. A circular hole is formed on a support substrate. The hole of the support substrate and the recess of the base insulating layer overlap each other.Type: GrantFiled: August 26, 2011Date of Patent: April 12, 2016Assignee: NITTO DENKO CORPORATIONInventors: Terukazu Ihara, Naohiro Terada
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Patent number: 9276346Abstract: A power inlet box suitable for outdoor or external use is configured in such a manner so as to prevent moisture from entering the power inlet enclosure. A hinged lid assembly is installable directly on the top face of a flanged power inlet enclosure to provide a face seal therewith. The hinged lid assembly has a cover and a base that form a tongue-and-groove seal, thus providing a first line of defense from moisture or other contaminants entering the inlet. As a second line of defense, a tapered stopper is provided on the inside of the cover to provide a stopper seal. A lateral seal is provided at the hinge point of the hinged lid assembly to prevent moisture from entering the hinge area where a tongue-and-groove seal is not present.Type: GrantFiled: March 15, 2013Date of Patent: March 1, 2016Assignee: Reliance Controls CorporationInventor: Neil A. Czarnecki
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Patent number: 9236334Abstract: A wiring substrate includes a wiring layer, an outermost insulating layer laminated to the wiring layer, and a pad electrically connected to the wiring layer and exposed from a surface of the outermost insulating layer. The pad consists essentially of a first metal layer and a second metal layer. The first metal layer includes a first surface, which is exposed from the surface of the outermost insulating layer, and a second surface, which is located opposite to the first surface. The second metal layer includes is formed between the second surface of the first metal layer and the wiring layer. The first metal layer is formed from a metal selected from gold or silver or from an alloy including at least one of gold and silver. The second metal layer is formed from palladium or a palladium alloy.Type: GrantFiled: March 1, 2012Date of Patent: January 12, 2016Assignee: Shinko Electric Industries Co., Ltd.Inventors: Kentaro Kaneko, Toshiaki Aoki, Hiromi Denda
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Patent number: 9226423Abstract: For an object of providing an electric connection box which can maintain waterproof when a car is washed by high-pressure water, the electric connection box includes a box main body having a groove recessed from an outer wall and extending straight; and a side cover slid along a lengthwise direction of the groove so as to be mounted at the box main body, and covering the groove when the side cover is mounted at the box main body. The side cover includes third and fourth plate members to be arranged within a same geometrical plane of the outer wall. The third and fourth plate members are provided with flaps projecting from the third and fourth plate members along a widthwise direction of the groove.Type: GrantFiled: July 15, 2011Date of Patent: December 29, 2015Assignee: Yazaki CorporationInventors: Koki Sato, Takeshi Onoda
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Patent number: 9214261Abstract: A cable for a high-voltage electronic device having a small diameter and an excellent voltage resistance characteristic. The cable includes an inner semiconducting layer, a high-voltage insulator, an outer semiconducting layer, a shielding layer, and a sheath on an outer periphery of a cable core portion, wherein the high-voltage insulator is formed of an insulating composition containing 0.5 to 5 parts by mass of an inorganic filler with respect to 100 parts by mass of an olefin-based polymer, and the inorganic filler has an average dispersed-particle diameter of 1 ?m or less.Type: GrantFiled: February 5, 2010Date of Patent: December 15, 2015Assignee: SWCC SHOWA CABLE SYSTEMS CO., LTD.Inventors: Mariko Saito, Masahiro Minowa, Junichi Nishioka, Nahoko Tanaka
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Patent number: 9190820Abstract: The invention relates to a cable gland plate for passing cables in a sealed fashion through a casing, such as the wall of a low voltage switchgear. The cable gland plate includes a substantially rectangular rigid frame (6) and, a set of gland elements (7,8,9) and a pressure unit (16). According to the invention, one pair of opposed edges (12) of the rigid frame includes slide bars (10); one pair of opposed edges of each gland element (7,8,9) includes slide posts (14) arranged to be fitted to the opposed slide bars; and the pressure unit (16) includes an actuator (35) carrying out two sequential pressure actions in such a way that the first pressure action presses the gland elements to each other in the lengthwise direction of the slide bars, and the second pressure action pushes the pressure unit against the frame and the adjacent gland elements.Type: GrantFiled: June 21, 2011Date of Patent: November 17, 2015Assignee: TRELLEBORG INDUSTRIAL PRODUCTS FINLAND OYInventors: Aapo Nurmi, Mika Hautamäki
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Patent number: 9184517Abstract: An electrical connector electrically connects two or more conductors in end to end orientation such that a bared end of each conductor is positioned within a hollow crimp barrel and crimped therein. The crimp barrel is held within a heat shrinkable sleeve that is crystal clear. Openings on either side of a stop within the crimp barrel allow for visual access into the central channel within the crimp barrel to assure proper placement and subsequent crimping of the conductors.Type: GrantFiled: December 13, 2010Date of Patent: November 10, 2015Inventor: John E. Endacott
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Patent number: 9171818Abstract: The invention discloses a package structure with an overlaying metallic material overlaying a solder material. A substrate comprises a first solder pad and a second solder pad thereon. A conductive element on the substrate comprises a first electrode and a second electrode thereon. A solder material electrically connects the first solder pad and the second solder pad to the first electrode and the second electrode respectively. An overlaying metallic material overlays the exposed areas of the solder metallic material, the first solder pad, the second solder pad, the first electrode and the second electrode, wherein the exposed areas comprise metallic material having a lower melting point than the second metallic material.Type: GrantFiled: December 13, 2011Date of Patent: October 27, 2015Assignee: CYNTEC Co., Ltd.Inventors: Da-Jung Chen, Wen-Hsiung Liao, Chun-Fu Hu
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Patent number: 9124079Abstract: The present invention is to provide an electric junction box which can minimize a case by reducing the capacity of a cover without damage of electric wires. A wiring harness L2 guided from a power integration 3 arranged at a position nearest a guide portion is guided to a guide portion through a gap between a partition wall 42A and a lower cover 5. Further, a wiring harness L1 guided from another cassette block 2 is guided to the guide portion through gaps between the partition walls 42A-42C and peripheral walls 41A, 41E, 41F.Type: GrantFiled: August 22, 2011Date of Patent: September 1, 2015Assignee: Yazaki CorporationInventors: Kunihiko Takeuchi, Hiroaki Yamada
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Patent number: 9049808Abstract: [Subject Matter] To provide a printed wiring board in which no warping occurs even if interlayer insulation layers without core material are laminated on a core substrate. [Solution(s)] To lower the thermal expansion coefficient (CTE) to 20˜40 ppm, inorganic particles are added to core substrate 30 formed by impregnating glass-cloth core material with glass-epoxy resin. Furthermore, thickness (a) of core substrate 30 is set at 0.2 mm, thickness (b) of upper-surface-side first interlayer insulation layer (50A) at 0.1 mm, and thickness (c) of lower-surface-side second interlayer insulation layer (50B) at 0.1 mm. In setting so, using thin core substrate 30 and interlayer insulation layers (50A, 50B) without core material, it is thought that warping does not occur in the printed wiring board.Type: GrantFiled: August 19, 2011Date of Patent: June 2, 2015Assignee: IBIDEN CO., LTD.Inventors: Masaru Takada, Fusaji Nagaya
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Patent number: 9000299Abstract: A cable clamp for securing an electrical cable to a support structure has two substantially similar half-shells, each half-shell including a concave inner surface terminating in a pair of abutting surfaces. The half-shells further include a pair of winged flanges offset a distance from the abutting surfaces. The lower half-shell can first be secured to a support structure using a pair of elongate members passing through the winged flanges of the lower half-shell and a plurality of fastening members. A cable can then be placed within a cable receiving region of the lower half-shell and the top half-shell can be secured to the lower half-shell, applying a clamping force to the cable without interference from the fastening members used to secure the lower half-shell to the support structure.Type: GrantFiled: July 18, 2011Date of Patent: April 7, 2015Assignee: Prysmian Power Cables and Systems USA, LLCInventor: Jason Ruth
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Patent number: 9000304Abstract: A sealing member for an electronic component package includes, on another principal surface of a base material constituting the sealing member for the electronic component package, an external terminal electrode, a wiring pattern, and a resin material. The external terminal electrode is to be electrically coupled to an outside of the electronic component package. The wiring pattern is configured to couple an electronic component element on one principal surface of the base material to the external terminal electrode. The resin material is layered over the other principal surface and the wiring pattern. The external terminal electrode is layered over the wiring pattern and the resin material.Type: GrantFiled: September 20, 2011Date of Patent: April 7, 2015Assignee: Daishinku CorporationInventor: Naoki Kohda
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Patent number: 8995139Abstract: Provided is a circuit device in which encapsulating resin to encapsulate a circuit board is optimized in shape, and a method of manufacturing the circuit device. A hybrid integrated circuit device, which is a circuit device according to the present invention includes a circuit board, a circuit element mounted on a top surface of the circuit board, and encapsulating resin encapsulating the circuit element, and coating the top surface, side surfaces, and a bottom surface of the circuit board. In addition, the encapsulating resin is partly recessed and thereby provided with recessed areas at two sides of the circuit board. The providing of the recessed areas reduces the amount of resin to be used, and prevents the hybrid integrated circuit device from being deformed by the cure shrinkage of the encapsulating resin.Type: GrantFiled: December 20, 2011Date of Patent: March 31, 2015Assignee: Semiconductor Components Industries, L.L.C.Inventor: Hideyuki Sakamoto
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Patent number: 8993894Abstract: A printed wiring board includes a core substrate having first and second surfaces, a first conductor formed on the first surface of the substrate, a second conductor formed on the second surface of the substrate, a first through-hole conductor formed through the substrate and connecting the first and second conductors, and a second through-hole conductor formed through the substrate and connecting the first and second conductors. The second through-hole conductor has a diameter which is greater than a diameter of the first through-hole conductor, the first through-hole conductor has a roughened inner wall forming an interior space, the second through-hole conductor has a roughened inner wall forming an interior space, and the roughened inner wall of the first through-hole conductor has an arithmetic average roughness which is set lower than an arithmetic average roughness of the roughened inner wall of the second through-hole conductor.Type: GrantFiled: March 20, 2012Date of Patent: March 31, 2015Assignee: Ibiden Co., Ltd.Inventors: Hideyuki Kawai, Yoshinori Takenaka
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Patent number: 8995147Abstract: A connection assembly includes a connection member and a switch. The connection member includes a serial attached small computer system interface (SAS) connector electronically connected to the switch. When the switch is electronically connect to the motherboard, the switch transmits signals from the motherboard to a hard disk drive backplane via the SAS connector. When the switch is electronically connect to the hard disk drive backplane, the switch transmits signals from the hard disk drive backplane to the motherboard via the SAS connector.Type: GrantFiled: June 13, 2012Date of Patent: March 31, 2015Assignee: Zhongshan Innocloud Intellectual Property Services Co., Ltd.Inventors: Lei Liu, Guo-Yi Chen
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Patent number: 8952251Abstract: A transmission tower structure for suspending from an arched crossarm a three phased circuit arranged in a compact delta configuration that improves the surge impedance loading (SIL) of a transmission line, reduces its series impedance, lowers both resistive and corona losses, and moderates electromagnetic fields and audible noise effects at the ground level—all achieved in a cost effective manner. The structure further has a low overall height and aesthetic appearance enhancing the public acceptance of the embodiments.Type: GrantFiled: April 25, 2013Date of Patent: February 10, 2015Assignee: AEP Transmission Holding Company, LLCInventors: Meihuan Zhu Fulk, Richard Gutman