Abstract: A cable-end water sealing device includes a water-blocking compound, a receptacle and a sleeve. The receptacle defines an interior cavity for receiving an end portion of a non-water-blocked electrical, optical, or electrical/optical (i.e., hybrid) cable. The receptacle includes a stop member for limiting the insertion depth of the cable, an adjoining interior cavity for receiving and transitioning the cable subcomponents and one or more optional overall EMI shield(s) to the outside of the receptacle, and an injection port for injecting the water-blocking compound into both interior cavities of the receptacle to prevent water from migrating from the end of the cable. One or more of the cable subcomponents may include one or more individual EMI shields. Individual insulating sleeves can be provided to electrically isolate the cable subcomponent EMI shield(s) from the receptacle and overall EMI shield(s).

Abstract: A lead feedthrough of an electrical functional unit, in particular a capacitor or medical electronic implant, which comprises a hollow conductive flange and a contact piece disposed in the cavity thereof and which is electrically insulated and sealed with respect to the flange, wherein the flange can be connected to a lead of a first type, and the contact piece can be connected to a lead of a second type in the functional unit, wherein, in a circumferential section of the flange, a tangentially extending gap is provided, which is delimited on one side by a flange body and on the other side by a tab integrally formed on the body, or by a separate pressure piece, for the tangential insertion and affixation of the lead of the first type.

Abstract: A container may be provided. The container may comprise a first surface and a second surface associated with the first surface. The first surface and the second surface may define a volume. The volume may house a length of multiple single conductors.

Abstract: A bus bar system includes a non-conductive substrate having a major surface. At least one conductive bus bar is formed over at least a portion of the major surface. A conductive coating is formed over at least a portion of the bus bar and the major surface. An electrically conductive adhesive, such as an isotropically conductive tape or film, is applied over at least a portion of the film/bus bar junction. The system can optionally include a conductive metallic foil adhered to the isotropically conductive adhesive.

Abstract: Techniques described herein generally relate to ground planes. In some examples, an electrical cable is described that can include multiple signal lines. The multiple signal lines can be arranged to extend along a length of the electrical cable. A ground plane can be spaced apart from the multiple signal lines. The ground plane can include a mesh structure and an electrically conductive layer that is arranged to coat the mesh structure. The mesh structure can include multiple resin fibers.

Abstract: A guide lug 3, lateral side temporarily fixing claws 4a, and slit side temporarily fixing claws 4b are hooked on a flat-cable insertion opening opened in a sheet metal casing to thereby temporarily fix a lid 1 with the lid half-opened. When the lid 1 in a half-opened state is adapted as a guide, a flat cable is inserted into a slit 5 from the inside of the casing and pulled out to the outside of the casing. The pulled out flat cable is pinched between a flange 8 of the lid 1 and the peripheral face of the flat-cable insertion opening to be screwed.

Abstract: A ground rod cap is provided. The cap includes a body that fits around a ground rod, ground rod clamp and ground wire at their point of connection. The body retains a filler material within an internal cavity. In some embodiments, a portion of the body acts as a barrier to retain the filler material. In some such embodiments, the filler material is positioned within the body prior to installation of the cap on the ground rod connection components. In some embodiments, the filler material is located in an airtight cavity until installation. In some such embodiments, a shrink-wrap material is placed around the body to make the cavity airtight. In other embodiments, the filler material is retained within at least a portion of the cap by an internal barrier that breaks as the cap is installed to allow the filler material to flow around the components.

Abstract: A resin multilayer substrate includes a component-containing layer and a thin resin layer stacked on a surface of the component-containing layer. The resin multilayer substrate further includes a surface electrode located on a surface opposite to the surface of the thin resin layer stacked on the component-containing layer, a first via conductor provided in the component-containing layer, which includes an end reaching one surface of the component-containing layer, and a second via conductor provided in the thin resin layer, which includes a first end electrically connected to the surface electrode and a second end electrically connected to the via conductor. A portion of the thin resin layer in contact with the second via conductor defines a projection projecting into the first via conductor.

Abstract: Device for establishing an efficient grounding of an installation of different types includes one or more cables, wherein the ground rail or ground conductor, ground rails or ground conductors or ground point or ground points of the installation being grounded by the one or more cables including a combination of electrically conductive wires or conductors in at least one inner core and at least one outer layer which surrounds the inner core wholly or partly, and the cable or the cables are laid in one and the same or each in a separate bore in ground and/or rock of a considerable depth, preferably more than 200 m, e.g. 240 m or more.

Abstract: A manufacturing method with which a high thermal conductivity silicon nitride substrate having excellent sintering performance can be manufactured without the occurrence of a molding crack or degreasing crack, as well as to provide a silicon nitride substrate, and a silicon nitride circuit board and a semiconductor module using the silicon nitride substrate. In the manufacturing method, in which a slurry is produced by mixing a silicon nitride powder, a sintering additive powder, and a binder in an organic solvent which is a dispersion medium, and the slurry is formed into a sheet, followed by degreasing and sintering, the oxygen content of the silicon nitride powder is 2.0 mass % or less and the specific surface area of the same is 3 to 11 m2/g, the additive ratio of the sintering additive powder is 4 to 15 mol %, and the water content ratio of the organic solvent is 0.03 to 3 mass %.

Abstract: A bonding lead comprising a core; and a sheath bonded to the core. The core comprises a substrate of fibers coated with nano-objects with at least one dimension between 1 nm and 200 nm. The nano-objects form a continuous electrically conductive network from one end of the bonding lead to the other with some of the nano-objects coating the fibers and others forming bridges between adjacent fibers. The nano-objects may be carbon nanotubes and the core may be woven or knitted. A conductive connector is provided at each end of the bonding lead, for instance a tab formed from an electrically conductive polymer. The lead can be used to dissipate static charge and/or lightning current between components, typically within an aircraft fuel tank.

Abstract: A fitting system for sealing an opening in a top cap of a network cabinet includes a grommet and at least one of a fitting assembly and a cover. The grommet is secured to the opening in the top cap of the network cabinet. The fitting assembly and the cover are secured to the grommet and may include at least one finger lift. A sleeve or a tube may be secured to the fitting assembly.

Abstract: An integrated conduit and molding mounting system for use at the intersection of a wall and ceiling is disclosed. The system comprises a conduit receiver and a conduit cover bonded to a molding piece. After installation of the conduit receiver at the wall and ceiling joint, the conduit cover and molding is snapped into place over the conduit receiver. The system also comprises a corner piece to eliminate mitering the joints at a corner and a seam cover to be mounted at the intersection of two straight runs.

Abstract: The Mobile Phone/PDA Security Masking Box is a sound insulated box for use as a temporary storage location for cellular and other mobile devices in locations at which confidential and sensitive conversations and discussions are being conducted. A pink/white noise generating device within the box generates a masking noise such that the cellular or other mobile devices inside the box are unable to pick up or record conversations outside the box.

Abstract: A printed circuit board, comprises an insulative substrate, a grounding layer located on a surface of the insulative substrate and defining a through slot, a plurality of conductive pins located on an outer surface of the printed circuit board; and a fence layer located between the conductive path and the grounding layer. Each conductive pin defines at least a soldering portion. The soldering portion is alignment to the through slot along a vertical direction.

Abstract: A junction box assembly includes a housing member and an electrical component. The housing member has a housing surface and a component receptacle having a pair of opposing sidewalls coupled to the housing surface. Each sidewall has a locking opening disposed therein and each locking opening defines a locking surface. A post is arranged within the component receptacle and extends from the housing surface for a predetermined distance to a post surface. The electrical component is received in the component receptacle and has a component surface adjacent the post surface and a barb received in each locking opening. The post applies a force to the electrical component for retaining the barb against the locking surface.

Abstract: A cover plate assembly and an electrical box are provided for mounting one or more electrical wiring devices. The cover plate assembly can be modified to provide a single gang, double gang or triple gang assembly for mounting the wiring devices. The cover plate assembly includes a collar forming a mud ring having at least one removable portion which can be removed to form an open side of the collar. An adapter is attached to the cover plate assembly at the open side of the collar to enlarge the dimensions of the collar to receiving a plurality of electrical wiring devices.

Abstract: An overfill warning wiring system has a plurality of fluid tight connectors integrally molded to a first fluid tight cabling, the connectors in turn connected to fluid tight connectors protruding from fluid tight sensor modules in manhole covers of a tank truck, the first fluid tight cabling connected to a main fluid tight cabling which is in turn connected in a fluid tight manner to a fluid tight monitor.

Abstract: A cross arm is provided, for use in a support structure for conductors within an electrical grid. The cross arm is made of weather resistant glass fiber reinforced two component polyurethane based polymers and has a “C” cross sectional shape typically arranged in a double configuration. Pairs of the cross arms are attached to utility poles in a parallel position on opposite sides of the utility pole to meet predefined design conditions. Alternatively, a single cross arm may be attached to a utility pole.

Abstract: A pad includes a first mating section and a second mating section. The first mating section includes a first horizontal plane and a first inclined plane. The second mating section includes a second horizontal plane and a second inclined plane. The first mating section is a copper foil capable of being connected to a wire. The second mating section is made of insulating material. The first inclined plane and the second inclined plane are bonded together.