Patents Examined by Peter Radkowski
-
Patent number: 11385518Abstract: An electro-optic modulator comprises a resonator comprising a first waveguide having a first end and second end; a first grating at the first end; and a second grating at the second end. An input channel is in communication with the resonator, and comprises a second waveguide having a first end and second end; an input port at the first end; a third grating at the second end; and a first coupler configured to couple light between the second waveguide and the first waveguide. An output channel is in communication with the resonator, and comprises a third waveguide having a first end and second end; an all-pass filter at the first end; a readout port at the second end; and a second coupler configured to couple light between the first and third waveguides. The all-pass filter is configured to adjust a coupling strength between the second coupler and the readout port.Type: GrantFiled: February 25, 2020Date of Patent: July 12, 2022Assignee: Honeywell International Inc.Inventors: Neil A. Krueger, Matthew Wade Puckett
-
Patent number: 11385403Abstract: An optical transmission device includes a semiconductor laser chip in which a semiconductor laser array having a plurality of distributed feedback semiconductor lasers formed on a first semiconductor substrate is formed, a semiconductor waveguide chip in which a semiconductor modulator array formed on a second semiconductor substrate and having the same number of semiconductor modulators as the semiconductor lasers is formed. In the optical transmission device, a waveguide and a waveguide are butt-joined such that a distance between an end face of the waveguide on a side to the semiconductor modulator array in each of the semiconductor lasers of the semiconductor laser array and an end face of the waveguide on a side to the semiconductor laser array in each of the semiconductor modulators of the semiconductor modulator array is 10 ?m or less.Type: GrantFiled: July 12, 2018Date of Patent: July 12, 2022Assignee: Mitsubishi Electric CorporationInventor: Takeshi Yamatoya
-
Patent number: 11378864Abstract: A two-dimensional waveguide light multiplexer is described herein that can efficiently multiplex and distribute a light signal in two dimensions. An example of a two-dimensional waveguide light multiplexer can include a waveguide, a first diffraction grating, and a second diffraction grating disposed above the first diffraction grating and arranged such that the grating direction of the first diffraction grating is perpendicular to the grating direction of the second diffraction grating. Methods of fabricating a two-dimensional waveguide light multiplexer are also disclosed.Type: GrantFiled: November 16, 2017Date of Patent: July 5, 2022Assignee: Magic Leap, Inc.Inventor: Chulwoo Oh
-
Patent number: 11378736Abstract: A method of forming a metallized mirror coating on a light diffusing optical fiber (110) includes contacting an end face (118) of a second end (114) of a light diffusing optical fiber (110) with a metallized mirror precursor. The light diffusing optical fiber (110) includes a first end (112) opposite the second end (114), a core (120), a polymer cladding (122) surrounding the core (120) and coplanar with the core at the end face (118) of the second end (114), an outer surface (128), and a plurality of scattering structures (125) positioned within the core (120), the polymer cladding (122), or both, that are configured to scatter guided light toward the outer surface (128) of the light diffusing optical fiber (110). The method also includes heating the metallized mirror precursor such that the metallized mirror precursor bonds to the core (120) and the polymer cladding (122) at the end face (118) of the second end (114) thereby forming a metallized mirror coating on the end face (118) of the second end (114).Type: GrantFiled: October 9, 2018Date of Patent: July 5, 2022Assignee: Corning IncorporatedInventors: Anthony Sebastian Bauco, Carl Edgar Crossland
-
Patent number: 11377550Abstract: A photosensitive epoxy resin composition for formation of an optical waveguide is provided, which contains an epoxy resin component and a photo-cationic polymerization initiator, wherein the epoxy resin component includes: (a) a solid bisphenol-A epoxy resin having a softening point of not higher than 105° C.; (b) a solid polyfunctional aliphatic epoxy resin having a softening point of not higher than 105° C.; and (c) a liquid long-chain bifunctional semi-aliphatic epoxy resin, wherein the epoxy resin (a) is present in a proportion of 60 to 70 wt. % based on the weight of the epoxy resin component, wherein the epoxy resin (b) is present in a proportion of 20 to 35 wt. % based on the weight of the epoxy resin component, wherein the epoxy resin (c) is present in a proportion of 5 to 10 wt. % based on the weight of the epoxy resin component.Type: GrantFiled: January 20, 2017Date of Patent: July 5, 2022Assignee: NITTO DENKO CORPORATIONInventors: Tomoyuki Hirayama, Naoyuki Tanaka
-
Patent number: 11372155Abstract: An optical fiber comprises a glass fiber; a primary resin layer coating an outer periphery of the glass fiber; and a secondary resin layer coating an outer periphery of the primary resin layer, and a pH of the primary resin layer is greater than a pH of the secondary resin layer.Type: GrantFiled: April 17, 2018Date of Patent: June 28, 2022Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Kumiko Tachibana, Noriaki Iwaguchi, Takashi Fujii
-
Patent number: 11360278Abstract: A photonic integrated circuit may be coupled to an optical fiber and packaged. The optical fiber may be supported by a fiber holder during a solder reflow process performed to mount the packaged photonic integrated circuit to a circuit board or other substrate. The optical fiber may be decoupled from the fiber holder, and the fiber holder removed, after completion of the solder reflow process.Type: GrantFiled: October 29, 2015Date of Patent: June 14, 2022Assignee: Acacia Communications, Inc.Inventor: Christopher Doerr
-
Patent number: 11360265Abstract: A fiber optic cable assembly includes first and second cable sections each having a jacket, at least one optical fiber, and multiple strength members. An intermediate cable section includes at least one splice joint as well as bundled sections of strength members of the cable sections formed into bundled sections that overlap and are adhered together. As adhered, the bundled strength members are shorter than the at least one spliced optical fiber in the intermediate section to ensure that the strength members bear tensile loads. A fabrication method includes binding unjacketed segments of strength members of two cable sections into bundled sections of strength members, fusion splicing ends of optical fibers, polymerically overcoating at least one splice joint, and adhering the bundled sections of strength members in an overlapping arrangement. An apparatus for thermoplastically coating cable assembly portions includes a trough for molten thermoplastic material, and a lateral insertion slot defined therein.Type: GrantFiled: July 28, 2020Date of Patent: June 14, 2022Assignee: Corning Research & Development CorporationInventor: Qi Wu
-
Patent number: 11353669Abstract: An optical communication cable includes a cable jacket formed from a first material, a plurality of core elements located within the cable jacket, and an armor layer surrounding the plurality of core elements within the cable jacket, wherein the armor layer is a multi-piece layer having a first armor segment extending a portion of the distance around the plurality of core elements and a second armor segment extending a portion of the distance around the plurality of core elements, wherein a first lateral edge of the first armor segment is adjacent a first lateral edge of the second armor segment and a second lateral edge of the first armor segment is adjacent a second lateral edge of the second armor segment such that the combination of the first armor segment and the second armor segment completely surround the plurality of core elements.Type: GrantFiled: February 23, 2018Date of Patent: June 7, 2022Assignee: CORNING OPTICAL COMMUNICATIONS LLCInventors: Bradley Jerome Blazer, Michael John Gimblet, Julian Latelle Greenwood, III, Jason Clay Lail, Warren Welborn McAlpine, Eric John Mozdy
-
Patent number: 11353726Abstract: An optoelectronic module comprising at least one semiconductor laser and a photonic chip is described herein. The semiconductor laser emits a primary electromagnetic radiation which is coupled into the photonic chip. The photonic chip comprises at least one first waveguide and at least one optical Bragg reflector having a reflectivity which is modulated by an electrical modulation signal. A secondary electromagnetic radiation is coupled out of the photonic chip by means of at least one second waveguide, wherein the secondary electromagnetic radiation has a dominant wavelength which is modulated in dependence of the electrical modulation signal. Further, a method for operating an optoelectronic module and a Head-Mounted Display comprising an optoelectronic module are provided.Type: GrantFiled: September 22, 2020Date of Patent: June 7, 2022Assignee: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Martin Rudolf Behringer, Hubert Halbritter, Ann Russell
-
Patent number: 11347001Abstract: A structure adapted to optical coupled to an optical fiber includes a photoelectric integrated circuit die, an electric integrated circuit die, a waveguide die and an insulating encapsulant. The electric integrated circuit die is over and electrically connected to the photoelectric integrated circuit die. The waveguide die is over and optically coupled to the photoelectric integrated circuit die, wherein the waveguide die includes a plurality of semiconductor pillar portions extending from the optical fiber to the photoelectric integrated circuit die. The insulating encapsulant laterally encapsulates the electric integrated circuit die and the waveguide die.Type: GrantFiled: April 1, 2020Date of Patent: May 31, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hsien-Wei Chen, Ming-Fa Chen
-
Patent number: 11347008Abstract: A loop back connector and methods for testing lines in a fiber optic network are disclosed. The loop back connector includes a ferrule having an interface side constructed for optical connection to a multifiber optical cable. The loop back connector also includes first and second optical loop back paths, each having first and second terminal ends positioned at the interface side. The terminal ends of each loop back path are adapted to be aligned to fibers in the multifiber optical cable. The method includes injecting a signal on a first optical path at a first location, looping back the signal at a second location onto a second optical path, and receiving the signal on the second optical path at the first location.Type: GrantFiled: February 13, 2020Date of Patent: May 31, 2022Assignee: CommScope Technologies LLCInventors: Yu Lu, Randy Reagan, Michael Noonan, Jeffrey Gniadek
-
Patent number: 11347126Abstract: An optical module that provides a semiconductor modulator, an input lens system and first and second output lens systems, and two monitor photodiodes is disclosed. The semiconductor modulator provides an input port, first and second output ports, and two monitor ports in one side thereof. The input port and the first and second output ports face the input lens system and the first and second lens systems, respectively. The two monitor ports face the two monitor photodiodes, respectively. The first and second output ports are symmetrically disposed with respect to the input port in the one side. The two monitor ports are disposed in respective outer sides of the first and second output ports and symmetrically with respect to the input port.Type: GrantFiled: December 26, 2018Date of Patent: May 31, 2022Assignee: Sumitomo Electric Industries, Ltd.Inventors: Tomoya Saeki, Yasushi Fujimura, Toru Watanabe
-
Patent number: 11340512Abstract: An electro-optical modulator assembly including a transistor including a gate, a drain, and a source disposed on a substrate, a photonic modulator including a first waveguide structure positioned between a first electrode and a second electrode, the photonic modulator being integrated with the transistor on the substrate, and a metal connection coupled between the drain of the transistor and one of the first and second electrodes of the photonic modulator.Type: GrantFiled: April 27, 2020Date of Patent: May 24, 2022Assignee: Raytheon BBN Technologies Corp.Inventors: Moe Soltani, Jeffrey Laroche, Thomas Kazior
-
Patent number: 11333835Abstract: A ferrule mold having a reverse-image of a through-hole array for optical fibers is formed. A non-polymeric ferrule material is deposited in the reverse-image mold, followed by removing the mold to create a multi-fiber connector ferrule having at least two fiber through-holes. An optical fiber is inserted in each through-hole until each fiber endface is positioned approximately even with a connection surface of the ferrule. A fiber recess for each of the optical fibers is formed such that each fiber is recessed from the multi-fiber ferrule connection surface by a distance of at least 0.1 micron. The recess may be formed by differential polishing of the non-polymeric ferrule and endfaces of the optical fibers. Alternatively, a layer of spacer material may be deposited over the multi-fiber ferrule connection surface. An antireflection coating is deposited over the ends of the recessed fibers.Type: GrantFiled: December 17, 2019Date of Patent: May 17, 2022Assignee: Arrayed Fiberoptics CorporationInventor: Benjamin B. Jian
-
Patent number: 11333909Abstract: An optical waveguide element is provided to effectively reduce an optical absorption loss of waveguide light which may occur at an intersecting part between an optical waveguide and an electrode without causing deterioration in optical characteristics and degradation of long-term reliability of the optical waveguide element. The optical waveguide element includes an optical waveguide formed in a substrate, and an electrode controlling optical waves propagated in the optical waveguide and having an intersecting part intersecting the optical waveguide thereabove. A portion of a resin layer is provided between the optical waveguide and the electrode in a portion of the substrate including the intersecting part. A corner of the resin layer on a side of the electrode is constituted to be a curve in a cross section in an extending direction of the electrode.Type: GrantFiled: November 26, 2020Date of Patent: May 17, 2022Assignee: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Kousuke Okahashi, Toru Sugamata
-
Patent number: 11327384Abstract: An optical resonant modulator based on coupling modulation, comprising a resonant structure with an embedded Mach-Zehnder interferometer that is differentially driven to induced amplitude modulation at the output port. The principle of coupling modulation enables high data/baud rates to be achieved in a photonic integrated circuit, e.g. silicon, footprint that is considerably smaller than that of a conventional traveling-wave Mach-Zehnder modulator, in particular by utilizing space saving features, such as ring resonator phase shifters and bend waveguide arms.Type: GrantFiled: August 10, 2020Date of Patent: May 10, 2022Assignee: Nokia Solutions and Networks OyInventors: Ajay Mistry, Meisam Bahadori, Matthew Streshinsky, Yangjin Ma
-
Patent number: 11327347Abstract: Provided is an optical waveguide element capable of connection such as wire bonding, suppressing usage of gold, and suppressing deterioration of a conductor loss. An optical waveguide element includes a substrate 1 having an electro-optic effect, an optical waveguide 2 formed on the substrate, and a control electrode (30, 31) provided on the substrate and controlling a light wave propagating through the optical waveguide. The control electrode is made of a material other than gold, and the gold is disposed on at least a wire bonding portion 4 of the control electrode.Type: GrantFiled: January 24, 2019Date of Patent: May 10, 2022Assignee: SUMITOMO OSAKA CEMENT CO., LTD.Inventors: Yu Nakata, Tetsuya Fujino, Satoshi Oikawa
-
Patent number: 11327249Abstract: A fiber optic ferrule and a guide pin clamp allows for changing guide pins in the field. The guide pin clamp has a forward clamp portion, a rearward clamp portion configured to engage the biasing spring and a guide pin retaining plate. The forward clamp portion and the rearward clamp portion move relative to one another to also move guide pin retaining plate from a first position to a second position to allow for the removal or insertion of guide pins.Type: GrantFiled: July 13, 2020Date of Patent: May 10, 2022Assignee: US Conec, Ltd.Inventors: Darrell R. Childers, Craig M. Conrad, Jason Higley, Jillcha F. Wakjira, Myron W. Yount
-
Patent number: 11327203Abstract: An optical fiber cable that includes reduced or minimal use of colorant may include a single optical fiber component and a jacket formed around the optical fiber component. The optical fiber component may include at least one optical fiber and a buffer layer formed around the at least one optical fiber. The buffer laying may include one or more first polymeric materials that are not blended or compounded with any colorant, and no colorant may be formed on an outer surface of the buffer layer. Additionally, the jacket may include or more second polymeric materials that are not blended or compounded with any colorant.Type: GrantFiled: April 22, 2020Date of Patent: May 10, 2022Assignee: Superior Essex International LPInventors: Thomas Christopher Cook, Amir Sekhavat