Patents Examined by Peter Radkowski
  • Patent number: 11320715
    Abstract: An optical device includes an optical modulator formed on an optical IC chip. A shape of the IC chip is a rectangle or a parallelogram. The optical modulator includes an interferometer, wiring patterns, a first polymer pattern, and a second polymer pattern. The interferometer includes an optical waveguide that is formed in a direction from a first edge to a second edge of the optical IC chip. The wiring patterns are formed parallel to the optical waveguide. The first polymer pattern is formed along the first edge or the second edge. The second polymer pattern is connected to the first polymer pattern and formed on the optical waveguide without overlapping the wiring patterns.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: May 3, 2022
    Assignee: FUJITSU OPTICAL COMPONENTS LIMITED
    Inventor: Masaki Sugiyama
  • Patent number: 11319246
    Abstract: The present invention is directed to water-swellable, radiation curable compositions suitable for use in coating water-blocking fibers, such as optical fibers. The present invention is further directed to fibers, including optical fibers, which are coated with water-swellable exterior coatings that are configured to buckle and detach from the associated fiber to facilitate superior performance in longitudinal water-blocking testing. Also claimed and described are methods of applying such water-swellable coatings to optical fiber coatings. Further claimed and described are buffered bundles of fibers including at least one optical fiber that is coated with a water-swellable, radiation curable coating to ensure superior longitudinal water blocking performance.
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: May 3, 2022
    Assignee: Covestro (Netherlands) B.V.
    Inventors: Huimin Cao, Kangtai Ren, Mark Pepels, Johan Franz Gradus Antonius Jansen
  • Patent number: 11319456
    Abstract: The present disclosure provides coating compositions that can be cured at fast rates as well as coatings and cured products formed from the coating compositions. The coating compositions include an acylgermane photoinitiator that leads to fast cure speeds. The coating compositions include primary coating compositions and secondary coating compositions. The coating compositions can be cured to form primary and secondary coatings of optical fibers. The primary coatings feature low Young's modulus and high tear strength. The primary coatings provide good microbending performance and are resistant to defect formation during the fiber draw process and subsequent handling operations. The secondary coatings feature high Young's modulus and good puncture resistance.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: May 3, 2022
    Assignee: Corning Incorporated
    Inventor: Bin Yang
  • Patent number: 11320677
    Abstract: A wavelength calibration method for a microring filter includes selecting N wavelengths from M wavelengths, and performing operations on the microring filter for each of the N wavelengths, thereby obtaining N sets of calibrated voltages, and obtaining, based on N sets of calibrated voltages, M?N sets of calibrated voltages corresponding to M?N wavelengths of the M wavelengths. The operating include adjusting thermal tuning power of the plurality of microrings in response to one set of voltages, and obtaining a plurality of sets of voltages that enable monitored optical power to have an extreme value, and using the plurality of sets of voltages as a reference, adjusting the thermal tuning power of the plurality of microrings in response to another set of voltages, and determining one of the N sets of calibrated voltages from the plurality of sets of voltages.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: May 3, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Sujie Zhou, Long Luo, Ruiqiang Ji, Yanbo Li, Mai Wang
  • Patent number: 11320718
    Abstract: A cantilever beam waveguide for a silicon photonics device may be formed in a device layer (e.g., a silicon device layer) of a silicon photonics device (e.g., a chip) and may be configured to bend to align the cantilever beam waveguide or a portion thereof with one or more additional components of the silicon photonics device or another device, including output couplers, optical sources, and waveguides.
    Type: Grant
    Filed: August 20, 2020
    Date of Patent: May 3, 2022
    Assignee: Apple Inc.
    Inventors: Mohamed Mahmoud, Alfredo Bismuto, Mark Alan Arbore
  • Patent number: 11320599
    Abstract: A multimedia connector cable having a cable encasing a plurality of optical fibers. The cable having a proximal end and a distal end. The proximal end having an electrical connector in optical communication with the plurality of optical fibers. The distal end having an optical connector in optical communication with the plurality of optical fibers.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: May 3, 2022
    Inventors: Luca Zanetti, Silvia Fioravanti
  • Patent number: 11309677
    Abstract: A multi-clad optical fiber is provided. The fiber includes, concentrically and radially outwards from the center of the optical fiber, a core doped with at least one rare-earth dopant material, a pedestal cladding structure, an inner cladding and an outer cladding. The pedestal cladding structure includes a pedestal layer having a refractive index smaller than a refractive index of the core, and a raised index layer having a refractive index larger than the refractive index of the pedestal layer. The raised index layer has a thickness and a refractive index which preserve the confinement of the core mode in the core and minimize the overlap of one or more pedestal modes with the core.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: April 19, 2022
    Assignee: INSTITUT NATIONAL D'OPTIQUE
    Inventors: Antoine Proulx, Vincent Roy, Mathieu Boivin, Yves Taillon
  • Patent number: 11307483
    Abstract: An optical switch includes a bus waveguide and an optical antenna supported by a substrate, a first and second coupling waveguide, a first and second actuation electrode, and a first and second reaction electrode. The first coupling waveguide is disposed parallel with the substrate and aligned with the bus waveguide. The first reaction electrode is coupled with, and adjacent to, the first coupling waveguide. The second coupling waveguide is optically connected with the first coupling waveguide and suspended over and configured to optically couple with the optical antenna. The second reaction electrode is coupled with, and adjacent to, the second coupling waveguide. The first and second actuation electrodes are supported by the substrate and configured to control the position of the first and second coupling waveguide, respectively, relative to the bus waveguide and optical antenna, via the first and second reaction electrodes.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: April 19, 2022
    Inventors: Zilun Gong, Ning Wang, Alexander Huebel, Tobias Graf
  • Patent number: 11307351
    Abstract: Provided are an optical waveform shaping apparatus and an optical waveform shaping method. According to an embodiment, the optical waveform shaping apparatus includes a multiplexer/demultiplexer (D/MUX) unit demultiplexing an optical signal in which optical signals of a plurality of wavelengths are multiplexed, a micro lens system refracting the demultiplexed optical signal into a collimated beam of light, and a wavelength level controller unit shaping a waveform of the optical signal. The wavelength level controller unit includes a 2D LCoS for adjusting and reflecting an amplitude or a phase value of the demultiplexed optical signal to have a distribution that is desired for each cell, and a controller for controlling the distribution.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: April 19, 2022
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Sang-Pil Han, Minhyup Song, Sungil Kim
  • Patent number: 11300852
    Abstract: An optical switch includes a bus waveguide supported by a substrate, a coupling waveguide suspended over the bus waveguide, a reaction electrode coupled with, and adjacent to, the coupling waveguide, an actuation electrode supported by the substrate and configured to control a position of the coupling waveguide relative to the bus waveguide via the reaction electrode, and an optical antenna coupled with the coupling waveguide and disposed at a fixed distance from the bus waveguide. When a voltage difference between the reaction electrode and the actuation electrode is less than a lower threshold, the coupling waveguide is positioned a first distance from the bus waveguide, when the voltage difference between the reaction electrode and the actuation electrode is greater than an upper threshold, the coupling waveguide is positioned a second distance from the bus waveguide, and the second distance is less than the first distance.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: April 12, 2022
    Inventors: Ning Wang, Alexander Huebel, Christoph Schelling, Jan Niklas Caspers, Hartmut Kueppers, Stefan Pinter
  • Patent number: 11294208
    Abstract: An optical transmission device includes a substrate, a waveguide, a signal wire, a ground wire, and a first stub wire. The waveguide is provided on the substrate and transmits an optical signal. The signal wire and the ground wire are disposed on the substrate along the waveguide and include, at end portions, bonding portions electrically connected to an external substrate by wires. The first stub wires are connected to the end portions of the ground wires. The distance between the signal wire and the first stub wire is shorter than the distance between the signal wire and the ground wire.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: April 5, 2022
    Assignee: FUJITSU OPTICAL COMPONENTS LIMITED
    Inventor: Masaki Sugiyama
  • Patent number: 11294207
    Abstract: Provided is an optical modulator including a plurality of unit cells, an active layer including a plurality of refractive index changing areas that are separated from each other, each of the plurality of refractive index changing areas having a refractive index that changes based on an electrical signal applied thereto, a plurality of antenna patterns provided over the active layer, and a mirror layer provided under the active layer opposite to the plurality of antenna patterns.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: April 5, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sunil Kim, Junghyun Park, Duhyun Lee, Byunggil Jeong
  • Patent number: 11283234
    Abstract: An optical module includes: an optical component; a light receiving element receiving a laser beam through the optical component; a package housing the optical component and the light receiving unit; and a shielding portion that prevents stray light, which is generated by at least one of the laser beam and the laser beam emitted through the optical component is reflected or scattered in the package or at the optical component, from being incident on the light receiving element.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: March 22, 2022
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kazuki Yamaoka, Maiko Ariga, Yusuke Inaba
  • Patent number: 11269143
    Abstract: A parallel position manipulator includes a top plate, a baseplate and a plurality of prismatic joint actuators. Each actuator includes an actuator joint having five Degrees of Freedom (DOF) at either the base plate or the top plate. When one or more of the actuators extends or contracts, the pivot points, or five DOF actuator joint, of the remaining actuators are allowed to shift in any axis other than that actuator's primary axis of motion.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: March 8, 2022
    Assignee: 3SAE TECHNOLOGIES, INC.
    Inventors: Robert Wiley, Brett Clark
  • Patent number: 11269200
    Abstract: A hybrid electronic optical chip has a first photonic element with which a first diode is associated, a second photonic element with which a second diode is associated and a common electrical driver connected to the first and second diodes by a common electrical connection with opposite polarity. The electrical driver generates a common electrical drive signal divided in time into first and second drive signal components for independently driving the first and second photonic elements through the common electrical connection.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: March 8, 2022
    Assignee: HUAWEI TECHNOLOGIES CANADA CO., LTD.
    Inventors: Dominic John Goodwill, Lukas Chrostowski, Hamid Mehrvar
  • Patent number: 11269146
    Abstract: An apparatus comprises a first fastener part having a first set of mating features and a second fastener part having a second set of mating features. Coupling the first set of mating features with the second set of mating features, such that the first set of mating features contacts and at least partially overlaps the second set of mating features, forms a fastener having a channel with a hexagonal cross-section. The channel is configured to receive a plurality of fibers. Coupling the first fastener part to the second fastener part clamps the plurality of fibers in a hexagonal packing configuration.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: March 8, 2022
    Assignee: INTUITIVE SURGICAL OPERATIONS, INC.
    Inventors: Jonathan Halderman, Rumen Deyanov
  • Patent number: 11256056
    Abstract: A method for manufacturing an optical fiber ribbon includes: forming a colored layer on to each of a plurality of optical fibers and forming an optical fiber ribbon by curing a connecting material applied to a surface of the colored layer of each of the optical fibers to form connection parts that connect adjacent ones of the optical fibers. Forming the colored layer further includes: applying a coloring agent to the optical fibers and curing the coloring agent such that uncured resin remains on the surface of the colored layer. Forming the optical fiber ribbon further includes: applying the connecting material to the surface with the uncured resin and curing the connecting material and the uncured resin on the surface of the colored layer.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: February 22, 2022
    Assignee: Fujikura Ltd.
    Inventors: Mizuki Isaji, Soichiro Kaneko, Ken Osato
  • Patent number: 11256039
    Abstract: A method of cleaving an optical fiber comprises inserting the optical fiber through a bore of a holding member, securing the optical fiber to the holding member with a bonding agent, operating at least one laser to emit at least one laser beam, and directing the at least one laser beam from the at least one laser to the end face of the holding member. At least a portion of the at least one laser beam reflects off the end face of the holding member and is thereafter incident on an end portion of the optical fiber. The at least one laser beam cleaves the end portion of the optical fiber less than 20 ?m from the end face of the holding member. Related systems are also disclosed.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: February 22, 2022
    Assignee: Corning Optical Communications LLC
    Inventors: Joel Patrick Carberry, Minghan Chen, Ming-Jun Li, Anping Liu, Barada Kanta Nayak
  • Patent number: 11251171
    Abstract: Embodiments may relate to a substrate for use in a system in package (SIP). The substrate may include a first couple to couple with a first component via a permanent couple such that the first component is communicatively coupled with a bridge. The substrate may further include a second couple to removably couple with an interposer such that the interposer is communicatively coupled with the bridge via a communicative couple. Other embodiments may be described or claimed.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: February 15, 2022
    Assignee: Intel Corporation
    Inventors: Michael Rifani, Robert J. Munoz, Thomas P. Thomas, John Mark Matson, Kursad Kiziloglu
  • Patent number: 11249268
    Abstract: Disclosed herein is an enclosure including a housing for dissipating heat from first and second heat generating components located on first and second circuit boards, respectively. In the enclosure, a first heat sink plate and a second heat sink plate are spring biased apart from one another. A maximum spring biasing distance between the first heat sink plate and the second heat sink plate is greater than a distance between the interior side of the front wall and the interior side of the back wall of the housing.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: February 15, 2022
    Assignee: CommScope Technologies LLC
    Inventors: Christopher Charles Taylor, David Patrick Murray, David Thomas