Patents Examined by Philip C. Tucker
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Patent number: 11548273Abstract: After molding a substrate located between first and second molds of a molding system, a used release film that is in contact with the substrate during molding is removed from the molding system with a gripper assembly, which is reciprocally movable between a retracted position outside the molding system and an extended position in a space between the first and second molds when the first and second molds are opened. A carriage mechanism on which the gripper assembly is mounted moves the gripper assembly towards the first or second mold until the gripper assembly contacts the used release film, before an actuator actuates the gripper assembly to clamp onto a part of the used release film. The carriage mechanism also conveys the gripper assembly away from the first mold or second mold to remove the used release film from the molding system.Type: GrantFiled: January 31, 2020Date of Patent: January 10, 2023Assignee: ASMPT SINGAPORE PTE. LTD.Inventors: Ji Yuan Hao, Patrocinio Jr Go Torres, Teng Hock Kuah, Kai Wu, Moung Kai Kong
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Patent number: 11548069Abstract: A 3D printer successively fuses sheet material in a stack to form a three-dimensional object. The sheet material may provide a mesh separating islands of material that will be fused to produce the desired three-dimensional object. The mesh provides support for the island material during the fusing process and may be removed afterwards.Type: GrantFiled: May 20, 2019Date of Patent: January 10, 2023Assignee: Wisconsin Alumni Research FoundationInventors: Thomas Rockwell Mackie, Brandon Joseph Walker, Nathan Donald Schumacher
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Patent number: 11541632Abstract: Disclosed is a protective film, which includes: a protective film sheet; a protective layer; and a release layer, a lead tab is connected to an end part of the release layer, and a positioning mechanism is arranged on the protective layer to align the protective film sheet with a screen of an electronic device.Type: GrantFiled: December 28, 2018Date of Patent: January 3, 2023Assignee: JIANGMEN IGUARDER ELECTRONIC CO., LTD.Inventor: Haiying Chen
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Patent number: 11541611Abstract: Systems for positioning and bonding a nutplate to a substrate having an aperture include a nutplate engagement fixture and a temperature sensor retention fixture. The nutplate engagement fixture includes a rigid tube and an elastomeric tube engaged with the rigid tube, the elastomeric tube having an elongated tube sized to provide a friction fit with the aperture and retain the elastomeric tube within the aperture. The rigid tube is operable to engage the nutplate at one end and the elastomeric tube is configured to anchor the nutplate engagement fixture at the aperture and secure the nutplate in contact with the substrate. The temperature sensor retention fixture includes a fixture body sized and configured to engage with the nutplate and at least one passageway within the fixture body sized and configured to allow a temperature sensor to be inserted or embedded therein with an end proximal a surface of the nutplate.Type: GrantFiled: December 22, 2020Date of Patent: January 3, 2023Assignee: Kineticure, LLCInventors: Jason P. Rice, Mark C. Cridge, Christopher D. Hemmelgarn, Patrick J. Hood, Tat Hung Tong
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Patent number: 11542415Abstract: A high-frequency dielectric heating adhesive sheet requires no releasable sheet, exhibiting excellent handleability and workability to an adherend even when a size of the high-frequency dielectric heating adhesive sheet is large, and an adhesion method of the high-frequency dielectric heating adhesive sheet. The high-frequency dielectric heating adhesive sheet includes a sheet-shaped base material and a high-frequency dielectric adhesive layer containing a thermoplastic resin as a component A and a dielectric filler as a component B.Type: GrantFiled: March 30, 2018Date of Patent: January 3, 2023Assignee: LINTEC CORPORATIONInventor: Masakazu Ishikawa
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Patent number: 11542413Abstract: Embodiments provide methods of disassembling apparel products. The methods include exposing an adhesive of the apparel product to a composition. The adhesive is disposed at least partially disposed between a major component and a minor component of the apparel product. The adhesive includes a material having an imine bond or an iminium bond. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component via the adhesive. The methods include separating the major component from the minor component adjoined by the adhesive.Type: GrantFiled: June 30, 2022Date of Patent: January 3, 2023Assignee: CreateMe Technologies LLCInventors: Caglar Remzi Becer, Daniel John Mackinnon, Yongqiang Li
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Patent number: 11542412Abstract: Embodiments provide methods of disassembling an apparel product. The methods include exposing an adhesive of the apparel product to electromagnetic energy. The adhesive is disposed at least partially between a major component and a minor component of the apparel product. The adhesive includes a polymer having a cyclodextrin moiety bonded to an azobenzene moiety. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component with the adhesive. The methods include separating the major component from the minor component adjoined by the adhesive.Type: GrantFiled: June 30, 2022Date of Patent: January 3, 2023Assignee: CreateMe Technologies LLCInventors: Caglar Remzi Becer, Daniel John Mackinnon, Yongqiang Li
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Patent number: 11535010Abstract: A method for fabricating wetsuit garment including wetsuits, boots and gloves for water sports uses, comprising preparation of at least a substantially elastic joining member made of hot melt adhesive, and joining at least two interconnected panels of rubber foam or sponge by the substantially elastic joining member to cover and seal the seam between the two interconnected panels for firmly bonding the two interconnected panels for making a strong, elastic and flexible wetsuit garment.Type: GrantFiled: December 13, 2018Date of Patent: December 27, 2022Assignee: SHEICO GROUP (SHEI CHUNG HSIN INDUSTRIAL) CO., LTD.Inventor: Min-Chen Shiue
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Patent number: 11538710Abstract: There is provided a carrier plate removing method for removing a carrier plate from a workpiece disposed on a top surface of a carrier plate via a provisional bonding layer. The carrier plate removing method includes a stepped portion forming step of forming a stepped portion in which the workpiece projects sideward as compared with the carrier plate by processing the carrier plate so as to remove a peripheral portion of the carrier plate along a peripheral edge of the carrier plate from an undersurface side opposite from the top surface of the carrier plate, a carrier plate holding step of holding the carrier plate by a carrier plate holding unit, and a removing step of removing the carrier plate from the workpiece by applying a force from the carrier plate side to the stepped portion, and moving the workpiece in a direction of separating from the carrier plate.Type: GrantFiled: July 9, 2021Date of Patent: December 27, 2022Assignee: DISCO CORPORATIONInventors: Takatoshi Sakurai, Yoshihiro Omuro, Katsuhiko Suzuki
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Patent number: 11535022Abstract: A method for recycling of packaging material is disclosed. The packaging material comprises a multilayer material (10) comprising a metal layer (30) and at least one polymer layer (20, 40). The method comprises placing the packaging material in a vat (310) comprising a separation fluid (330) to produce a mixture of metal shreds from the metal layer (30), plastic shreds from the polymer layer (20, 40) and residual components. The separation fluid comprises a mixture comprising a mixture of water, a short-chained carboxylic acid, phosphoric acid and an alkali metal hydroxide solution.Type: GrantFiled: December 15, 2017Date of Patent: December 27, 2022Assignee: SAPERATEC GMBHInventors: Florian Lovis, Marcus Schulze
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Patent number: 11538712Abstract: A suction holder for sucking and holding a holding target member includes a sucker, a tube bellows connected to a lower end of the sucker, and a tube arranged inside the tube bellows and having an upper end positioned lower than an upper end of the sucker. A lower opening of the tube is communicated with a suction source and the holding target member is contacted with the upper end of the sucker to form a closed room, and the inside of the closed room is placed into a negative pressure state to hold the holding target member.Type: GrantFiled: September 10, 2020Date of Patent: December 27, 2022Assignee: DISCO CORPORATIONInventors: Masahiro Wada, Naohisa Watanabe
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Selective laser sintering using functional inclusions dispersed in the matrix material being created
Patent number: 11534832Abstract: A selective laser sintering system includes a leveling roller having a first orientation. The leveling roller is configured to roll over a first feed bin. The build chamber is configured to receive, from the first feed bin and by the leveling roller, a transfer of a portion of matrix material. The selective laser sintering system is configured to transfer the portion to the build chamber in a number of orientations.Type: GrantFiled: September 9, 2020Date of Patent: December 27, 2022Assignee: The Regents of the University of CaliforniaInventors: Lawrence Kulinsky, Edward Tackett, Benjamin Dolan -
Patent number: 11529684Abstract: A metal laminating/shaping device includes a base, a head unit including a base material injection device, and drive devices that change a positional relationship between the base and the head unit in a spatial coordinate system. The base material injection device includes a base material heating unit that heats a base material that is a metal piece having a fixed shape such that a temperature of an interior of the base material is raised to a temperature below a melting point and a temperature of a surface of the base material is raised to the melting point, and a base material injection unit that injects the heated base material toward the base. The metal laminating/shaping device can form a metal shaped article having a complicated structure at a low cost.Type: GrantFiled: March 29, 2016Date of Patent: December 20, 2022Assignee: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATIONInventor: Norihiro Suzuki
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Patent number: 11524446Abstract: A method for monitoring a curing process of a cured-in-place pipe is disclosed. The method includes affixing a plurality of sensors to a resin layer of a liner, and determining a curing profile corresponding to at least the resin layer, the curing profile including a threshold curing value. The method further includes sensing, using the plurality of sensors, real-time data indicative of at least one curing parameter. Additionally, the method includes comparing the real-time data from each sensor to the threshold curing value, and outputting an alert upon the real-time data meeting or exceeding the threshold curing value.Type: GrantFiled: May 6, 2020Date of Patent: December 13, 2022Assignee: Innovations Amplified, LLCInventor: Erik C. Morris
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Patent number: 11518087Abstract: The present disclosure provides a method of making an article, including: providing a composition comprising two or more types of polymerizable monomers and two or more types of polymerization initiators; exposing the build region to one or more polymerization stimuli; polymerizing the two or more polymerizable monomers at the build region to provide a polymer layer; and advancing the polymer layer away from the build region to provide a three-dimensional article containing two or more integrally mixed polymers.Type: GrantFiled: September 11, 2017Date of Patent: December 6, 2022Assignee: UNIVERSITY OF WASHINGTONInventors: Andrew Boydston, Johanna Schwartz, Carl Thrasher, Troy Becker, Mark Ganter, Duane Storti
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Patent number: 11518121Abstract: A composite laminate stiffener is formed to contour with reduced ply wrinkling using constrained creep forming. The tooling apparatus is provided with flexible cauls which constrain the stiffener during the contour forming process. The creep forming is carried out at a slow enough rate so that friction or shear resistance between the resin and fibers of the plies remains low enough that slippage can occur and significant compression stresses are not generated rate, allowing relaxation of residual stresses in the stiffener.Type: GrantFiled: October 14, 2019Date of Patent: December 6, 2022Assignee: The Boeing CompanyInventors: Gagandeep Saini, Lisa Christina Carlson, Kurtis Shuldberg Willden, Brian James Smith, Jonathan Santiago
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Patent number: 11518157Abstract: A method of preparing a multi-layer assembly, or of protecting a surface of a multi-layer substrate from damage and/or contamination and/or debris, said method comprising the steps of: (i) providing a composite film comprising a polymeric base layer having a first and second surface and disposed on the first surface thereof a polymeric protective layer having a first surface and a second surface such that the first surface of the said base layer is in contact with the first surface of the polymeric protective layer, wherein said polymeric protective layer comprises an ethylene-based copolymer, and preferably wherein the polymeric base layer comprises a polyester derived from one or more diol(s) and one or more dicarboxylic acid(s); (ii) removing said polymeric protective layer from the first surface of said base layer; (iii) disposing on the exposed first surface of said base layer one or more functional layers to provide a multi-layer substrate, wherein the, or at least the uppermost, functional layer compriType: GrantFiled: June 26, 2018Date of Patent: December 6, 2022Assignees: DuPont Teijin Films U.S. Limited Partnership, Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung E.V.Inventors: John Fahlteich, Nicole Prager, Matthias Fahland, Olaf Zywitzki, Valentijn Von Morgen, Robert Eveson
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Patent number: 11521890Abstract: An apparatus for manufacturing a semiconductor device includes a base portion, a bonding stage arranged on the base portion and having a placement surface for placing a substrate; and one or more connecting members which connect the base portion and the bonding stage, wherein at least one of the one or more connecting members is a connecting plate that deflects following the expansion and contraction of the bonding stage in the plane direction caused by a temperature change.Type: GrantFiled: March 7, 2018Date of Patent: December 6, 2022Assignee: SHINKAWA LTD.Inventor: Shoji Wada
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Patent number: 11518105Abstract: Examples of a method of operating an additive manufacturing system, a three-dimensional (3D) printing system and a non-transitory machine-readable medium are described. In an example, a build material is supplied to a print region of an additive manufacturing system. A temperature distribution, corresponding to a pattern, of at least a surface of the build material is generated. An image of the pattern is captured using a thermal sensor. Image data representative of the image of the pattern is compared with data representative of an expected position of the pattern. On the basis of the comparing, difference data indicative of a difference between a position of the thermal sensor during capture of the image and an expected position of the thermal sensor associated with the expected position of the pattern is generated. Operation of the additive manufacturing system is controlled at least in dependence on the difference data.Type: GrantFiled: March 29, 2017Date of Patent: December 6, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Sergio Puigardeu Aramendia, Adrien Chiron, Daniel Pablo Rosenblatt
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Patent number: 11511497Abstract: The invention relates to a welding unit (1) for the welding of film tubes for a waterless toilet, the welding unit (1) comprising welding jaws (2, 3), the welding jaws (2, 3) comprising welding means covers (4, 5), characterized in that the welding means covers (4, 5) are detachably arranged on the welding jaws (2, 3), in particular are detachably connected to the welding jaws (2, 3).Type: GrantFiled: April 9, 2020Date of Patent: November 29, 2022Assignee: CLOSAC AGInventors: Christian Frei, Remo Jud, Marcel Kilga