Abstract: A method for manufacturing an optical article including the following steps: a. providing a first substrate with a main surface, b. depositing a second substrate on the main surface with an adhesive layer so that the space between the first substrate and second substrate is filled by the adhesive layer, c. curing the adhesive layer to induce a polymerization of the adhesive layer, wherein a tension step takes place after steps a. and b., and before step c., the tension step including applying symmetrically a tension, preferentially with a central symmetry, preferentially a radial isotropic tension or an ortho-distributed symmetrical tension, on the edges of the second substrate sensibly in a tension plan parallel to a plan representative of the main surface.

Abstract: Provided is a substrate holding apparatus capable of appropriately holding a substrate. The substrate holding apparatus is suggested to hold a substrate including a portion to be plated that is exposed to a plating solution and an edge portion that is an area outside the portion to be plated. The substrate holding apparatus comprises a grasp module to come in contact with the edge portion of the substrate and thereby grasp the substrate, a suction module to attract the portion to be plated of the substrate by suction to hold the portion to be plated, and a protrusion provided at a position corresponding to the portion to be plated in the substrate, and protruding toward the substrate to be held by the substrate holding apparatus more than the suction module.

Abstract: A wafer chuck includes a body portion; a vacuum barrier portion including a wall structure arranged at the same distance from a center point of the body portion; f protrusions arranged inside and outside the vacuum barrier portion, protruding from a top surface of the body portion and spaced apart from each other; and a vacuum portion including vacuum holes spaced apart from each other penetrating the body portion inside the vacuum barrier portion.

Abstract: Provided is a method of forming a three-dimensional object, which may include the steps of: (a) providing a carrier and an optically transparent member having a build surface, the carrier and the build surface defining a build region therebetween; (b) filling the build region with a polymerizable liquid that comprises a reactive blocked monomer and/or prepolymer comprising a self-polymerizing monomer and/or prepolymer blocked with a light-polymerizable blocking group; (c) irradiating the build region with light through said optically transparent member to form a solid polymer scaffold from the reactive blocked monomer and/or prepolymer and also advancing the carrier away from the build surface to form a three-dimensional intermediate; and then (d) heating and/or microwave irradiating, the three-dimensional intermediate sufficiently to degrade the scaffold and regenerate the monomer and/or prepolymer in de-blocked form, which monomer and/or prepolymer in turn self-polymerize, to form said three-dimensional obj

Abstract: An object includes at least two faces which are suitable for dry adhesion and differ in their adhesion parameters. By suitable structuring, it is possible, where appropriate in combination with a suitable contact pressure, to selectively control the detachment of surfaces contacted on these faces.

Abstract: A method for manufacturing a thermoplastic composite product includes: providing a first and second thermoplastic composite component made from a consolidated stack of thermoplastic composite plies, said first and second component having a first and second ply drop off, respectively. The first and second components are positioned such that the first ply drop off and the second ply drop off are aligned, and the first and second components are fixedly connected by means of heating. The stacks of plies for the first and second components are constructed by stacking the plies in a stacking direction wherein the plies are arranged such that plies at a different position along the stacking direction are laterally offset relative to each other for the purpose of forming the first ply drop off and the second ply drop off, respectively, before consolidating.

Abstract: A technique for handling an integrated circuit tape assembly having a plurality of integrated circuits supported by underlying dicing tape involves placing the integrated circuit tape assembly on a film frame carrier (FFC) frame, stretching the dicing tape while on the FFC frame, and securing the stretched dicing tape by engaging a spring ring with the dicing tape and FFC frame. Adjacent integrated circuits are thereby inhibited from colliding during shipment or storage for subsequent processing.

Abstract: Methods are provided for fabricating electrochromic devices that mitigate formation of short circuits under a top bus bar without predetermining where top bus bars will be applied on the device. Devices fabricated using such methods may be deactivated under the top bus bar, or may include active material under the top bus bar. Methods of fabricating devices with active material under a top bus bar include depositing a modified top bus bar, fabricating self-healing layers in the electrochromic device, and modifying a top transparent conductive layer of the device prior to applying bus bars.

Abstract: A method for manufacturing a display device includes providing a first display device assembly comprising a display module, a first window disposed on the display module, a first window adhesive layer disposed between the display module and the first window, and a first protective layer disposed on the first window. The first protective layer is removed. The first window is removed by providing an acid solution on the first display device assembly. A second window is provided that is disposed on the display module after the first window is removed. A second protective layer is provided that is disposed on the second window after the first protective layer is removed.

Abstract: A wafer is positioned in an opening of a first frame. The wafer is pressure-bonded at one surface thereof to a first tape together with the first frame, onto a second tape pressure-bonded to a second frame. The wafer is processed by pressure-bonding the second tape, which is pressure-bonded to the second frame having an outer diameter smaller than an inner diameter of the opening of the first frame, to another surface of the wafer, cutting the first tape along an outer periphery of the second frame, imparting an external stimulus to the first tape to lower a pressure-bonding force with which the first tape is pressure-bonded to the one surface of the wafer, and peeling off the first tape from the one surface of the wafer pressure-bonded to the second tape.

Abstract: A method of making an electrically-conductive film is provided. The method includes providing a release layer, optionally having a topologically structured surface, and depositing at least one electrically-conductive layer on the release layer whereby the at least one electrically-conductive layer has an outer surface that substantially replicates the topologically structured surface. The electrically-conductive layer can be peeled away from the release layer to obtain the electrically-conductive film. Such electrically-conductive films can be useful in lightning strike applications.

Abstract: A sealing method includes dispensing an adhesive on an edge surface of a first part, performing a first activation for hardening the adhesive to a predetermined hardness, performing a second activation for triggering appearance of adhesion strength of the adhesive, assembling the first part and a second part, and pressing the first part and the second part against each other.

Abstract: A processing apparatus includes a wafer cassette table, a wafer carrying-out mechanism, a wafer table, a frame housing unit, a frame carrying-out mechanism, a frame table, a tape sticking unit, a tape-attached frame conveying mechanism, a tape pressure bonding unit, a frame unit carrying-out mechanism, a reinforcing part removing unit, a ring-free unit carrying-out mechanism, and a frame cassette table. The wafer carrying-out mechanism includes a Bernoulli chuck mechanism that jets gas to the back surface of the wafer and generates a negative pressure. The gas jetted by the Bernoulli chuck mechanism is inert gas. The wafer carrying-out mechanism jets the inert gas from the Bernoulli chuck mechanism to suppress oxidation of the back surface of the wafer when the wafer is carried out.

Abstract: Elasticized absorbent articles containing weakened elasticized portions and methods of manufacture are disclosed. A method comprises applying a first amount of adhesive to a first portion of at least one of the first web of material and the elastic strand, applying a second amount of adhesive to a second portion of at least one of the first web of material and the elastic strand, covering the elastic strand with either the first surface of the first web of material or a first surface of a second web of material to form an elasticized web. The elasticized web comprises a heavy bonding region and a light bonding region, wherein the heavy bonding region comprises a greater area density of adhesive than the light bond region. Finally, the method may further comprise partially weakening the waist panel elastic strand at least at one location within the second region.

Abstract: A mechanical part configured to be placed under torque. The mechanical part includes an inner tube having, a corrugated web, and an outer shell. The inner tube has an outer tube circumference, a tube axial direction, and a tube length. The corrugated web has a plurality of peaks and a plurality of troughs, a height measured as a difference between one of the peaks and one of the troughs, and a web length perpendicular to the height and in the tube axial direction. The outer shell has an inner shell circumference, an outer shell circumference, and a shell length. The plurality of troughs is affixed to the outer circumference of the inner tube. The plurality of peaks is affixed to the inner shell circumference of the outer shell. The web length is aligned with the tube length and the shell length.

Abstract: A system and method for separating a layer from a layer assembly when the layer assembly includes a backing layer and a material layer. The system includes an automated machine having a controller and an end effector. A separating tool is attached to the end effector of the automated machine. The separating tool includes a displacing member, with an outer face, configured to establish a void between the backing layer and the material layer by displacing a portion of the backing layer. The separating layer also includes a securing member configured to establish a mechanical connection with a displaced portion of the backing layer.

Abstract: An improved adhesive composition having increased insulative properties is provided. The adhesive composition having improved insulative properties includes a starch component; an alkaline component; sodium tetraborate; water; and a plurality of expandable microspheres. Products having improved insulation capabilities and methods of making the products having improved insulation capabilities are also provided. The present adhesive and products including the adhesive is environmentally friendly.

Abstract: In an example of a method for three-dimensional (3D) printing, a build material composition is applied to form a build material layer. The build material composition includes a polymeric or polymeric composite build material, and a precipitating agent. Based on a 3D object model, a fusing agent is selectively applied on at least a portion of the build material composition. The fusing agent includes a radiation absorber, which the precipitating agent precipitates. The build material composition is exposed to radiation to fuse the at least the portion to form a layer of a 3D part.

Abstract: A molding device for producing a shell element reinforced with supporting elements and composed of fiber composite material, including a mold part with a mold surface including a cavity for receiving a supporting element of the shell element, and a mold core to be arranged in the cavity and to support the supporting element on the shell element when the supporting element of the shell element is arranged in the cavity. The molding device enables prevention of the mold cores from falling out in an uncontrolled manner when the shell element is removed from the mold as the mold core includes a holding device to engage with the supporting element of the shell element to be produced located in the cavity and to hold the mold core on the supporting element when the shell element to be produced is released from the mold part.

Abstract: A method of constructing an inflatable fluidic actuator that includes generating a tube configuration with one or more shapes of fluid-impermeable membrane material, the tube configuration having a first tube end and a second tube end and an internal tube face and an external tube face. The method also includes coupling a first and second interface to the tube configuration at the first and second tube ends by respectively coupling each interface to the tube configuration at a respective tube end by generating at least one of: a first circumferential bond between the fluid-impermeable membrane material and one or more sidewalls of the interface; and an external face bond between fluid-impermeable membrane material at the tube end onto an external face of the interface.