Patents Examined by Philip L Cotey
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Patent number: 11300456Abstract: A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.Type: GrantFiled: November 15, 2019Date of Patent: April 12, 2022Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Akihiro Osaka, Hideto Yamaguchi, Tetsuya Kosugi, Tokunobu Akao, Atsushi Umekawa, Motoya Takewaki
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Patent number: 11287332Abstract: An adiabatic concrete calorimeter includes a thermal chamber and a heat well subassembly for being positioned in the thermal chamber. The heat well subassembly includes a test cylinder container and a test cylinder mold adapted to be positioned in the test cylinder container for defining the shape of a concrete test specimen formed in the test cylinder mold. Temperature sensors determine the temperature of the concrete test specimen, and transmit temperature data from the temperature sensors to a controller. Electrically-energized heaters are positioned on a surface of the test cylinder container for applying heat to the test cylinder container. A controller determines heat loss of the concrete test specimen and outputs data to the heaters whereby the heaters supply heat to the concrete test specimen sufficient to compensate for heat losses to an ambient environment and maintain the heat of hydration of the concrete test specimen.Type: GrantFiled: January 28, 2020Date of Patent: March 29, 2022Inventor: W. Calvin McCall
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Patent number: 11287327Abstract: The present invention discloses a cable temperature sensing device, which consists of a plurality of temperature sensing modules disposed on an identical cable. By such arrangement, the temperature sensing modules are configured to measure a plurality of temperature values from different positions on the cable, and then convert the plurality of temperature values to a cable temperature data through a temperature reading module.Type: GrantFiled: May 16, 2019Date of Patent: March 29, 2022Assignee: CHUNG-YUAN CHRISTIAN UNIVERSITYInventor: Syang-Ywan Jeng
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Patent number: 11280687Abstract: In some examples, a temperature distribution sensor may include a laser source to emit a laser beam that is tunable to a first wavelength and a second wavelength for injection into a device under test (DUT). A first wavelength optical receiver may convert a return signal corresponding to the first wavelength with respect to Rayleigh backscatter or Raman backscatter Anti-Stokes. A second wavelength optical receiver may convert the return signal corresponding to the second wavelength with respect to Rayleigh backscatter or Raman backscatter Stokes. Bending loss associated with the DUT may be determined by utilizing the Rayleigh backscatter signal corresponding to the first wavelength and the Rayleigh backscatter signal corresponding to the second wavelength. Further, temperature distribution associated with the DUT may be determined by utilizing the Raman backscatter Anti-Stokes signal corresponding to the first wavelength and the Raman backscatter Stokes signal corresponding to the second wavelength.Type: GrantFiled: August 31, 2018Date of Patent: March 22, 2022Assignee: VIAVI SOLUTIONS INC.Inventor: Andre Champavere
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Patent number: 11274975Abstract: A measuring apparatus and a physical characteristic measuring device are provided. The measuring apparatus includes at least one first physical characteristic measuring device and a data processing device. The first physical characteristic measuring device includes a sensor, a signal processing circuit, and a transmission path. The sensor generates a measurement signal according to the physical characteristics of a location where the first physical characteristic measuring device is located. The signal processing circuit converts the measurement signal into a first processed signal. The transmission path is able to be electrically connected to a second physical characteristic measuring device. The transmission path passes a second processed signal of the second physical characteristic measuring device to the data processing device in response to the first physical characteristic measuring device and the second physical characteristic measuring device being electrically connected to each other.Type: GrantFiled: July 3, 2019Date of Patent: March 15, 2022Assignee: Wistron CorporationInventor: Ting-Yu Lin
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Patent number: 11271586Abstract: A system includes: a first temperature sensor configured to measure a first temperature of exhaust at a first location of an exhaust system of a vehicle; a second temperature sensor configured to measure a second temperature of exhaust at a second location of the exhaust system of the vehicle; a first analog to digital (A/D) converter configured to receive a first analog signal from the first temperature sensor, to sample the first analog signal to produce first samples, and to generate first digital values corresponding to the first temperature based on the first samples, respectively; and a second A/D converter a configured to receive a second analog signal from the second temperature sensor, to sample the second analog signal to produce second samples, and to generate second digital values corresponding to the second temperature based on the second samples, respectively.Type: GrantFiled: January 20, 2020Date of Patent: March 8, 2022Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLCInventors: Stefano Nieddu, Simone Alpe
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Patent number: 11268865Abstract: A temperature measuring device includes first and second semiconductor elements each of which has a p-n junction, a transistor group including a plurality of transistors of which respective sources are connected to a power source and of which respective gates are connected to each other, the plurality of transistors constituting a current source, the transistor group being configured to output a first current and a second current having a different magnitude from the first current to the first and second semiconductor elements, respectively, and a selector configured to select at least one first transistor and a plurality of second transistors different from the first transistor, from among the plurality of transistors.Type: GrantFiled: November 5, 2019Date of Patent: March 8, 2022Assignee: SOCIONEXT INC.Inventors: Hiroyuki Hamano, Takashi Miyazaki
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Patent number: 11268864Abstract: A sensor unit for detecting a spatial temperature profile, having at least one substrate with a first surface and a second surface situated at least regionally opposite the first surface. The substrate is configured at least regionally to be flexible. At least one adhesion means is arranged at least regionally on the first surface and/or on the second surface for attaching the sensor unit to at least one measurement body. At least one sensor field is arranged on the second surface of the substrate. One aspect also relates to a method for producing a sensor unit.Type: GrantFiled: March 20, 2018Date of Patent: March 8, 2022Assignee: Heraeus Nexensos GmbHInventors: Karlheinz Wienand, Stefan Dietmann, Kai-Ulrich Boldt, Dieter Teusch, Martin Bleifuss, Uwe Hellmann, Matthias Muziol
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Patent number: 11262249Abstract: Provided is a thermocouple transition body apparatus comprising: a transition body, having at least one recess; a positive electrical terminal; a negative electrical terminal; and, at least one cap; wherein the transition body, positive terminal, and negative terminal are configured to attach to conductors without the use of epoxy or crimping. The thermocouple transition body apparatus is able to withstand temperatures exceeding 500 degrees Fahrenheit.Type: GrantFiled: August 21, 2019Date of Patent: March 1, 2022Assignee: CLEVELAND ELECTRIC LABORATORIESInventors: Sean Burris, Michael McNeilly
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Patent number: 11262321Abstract: A system for determining one or more properties of one or more gases. The system comprises sensors configured to measure thermal conductivity and exothermic responses of a sample at multiple temperatures. Sensor responses to exposure to a gas sample at two or more temperatures are compensated and analyzed by a subsystem. The subsystem is configured to determine a thermal conductivity of the gas sample at each of the two or more temperatures and determine at least one component of the gas sample based at least in part on the thermal conductivity value of the sample at each of the two or more temperatures. Related systems and methods of determining one or more properties of a sample are also disclosed.Type: GrantFiled: July 27, 2020Date of Patent: March 1, 2022Assignee: Nevada Nanotech Systems Inc.Inventors: Benjamin S. Rogers, Christopher J. Dudley, Jesse D. Adams, Ralph G. Whitten, Alexander C. Woods, Vaughn N. Hartung
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Patent number: 11257697Abstract: A temperature monitoring apparatus includes: a calculator configured to calculate a temperature monitoring waveform by a first-order lag function based on an elapsed time from a start of a temperature change from a first temperature to a second temperature, and a time constant calculated based on a locus of the temperature change; and a monitor configured to monitor a temperature changing from the first temperature to the second temperature based on the temperature monitoring waveform calculated by the calculator.Type: GrantFiled: April 29, 2019Date of Patent: February 22, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Tatsuya Yamaguchi, Yasuaki Kikuchi
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Patent number: 11243329Abstract: A method for gathering reference data for use in planning and interpreting infrared surveys for the purpose of detecting and locating underground features, such as tunnels, voids, or manmade devices. Measurements, images, or observations at a site having known underground features are recorded. Recorded details include a combination temperatures at or near a soil surface at multiple points across the site in addition to above surface factors such as shading, weather conditions, and objects or foliage. Analysis of the details recorded from the site having known underground features yields quantitative estimates of the effects of various above and below surface factors on temperatures at or near the soil surface.Type: GrantFiled: February 24, 2020Date of Patent: February 8, 2022Inventor: Nancy Kerr Del Grande
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Patent number: 11231332Abstract: A measuring apparatus and a physical characteristic measuring device are provided. The measuring apparatus includes at least one first physical characteristic measuring device and a data processing device. The first physical characteristic measuring device includes a sensor, a signal processing circuit, and a transmission path. The sensor generates a measurement signal according to the physical characteristics of a location where the first physical characteristic measuring device is located. The signal processing circuit converts the measurement signal into a first processed signal. The transmission path is able to be electrically connected to a second physical characteristic measuring device. The transmission path passes a second processed signal of the second physical characteristic measuring device to the data processing device in response to the first physical characteristic measuring device and the second physical characteristic measuring device being electrically connected to each other.Type: GrantFiled: July 3, 2019Date of Patent: January 25, 2022Assignee: Wistron CorporationInventor: Ting-Yu Lin
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Patent number: 11226242Abstract: An industrial process temperature transmitter for measuring a temperature of a process medium includes a temperature sensing unit, a compensation circuit, an output circuit and a housing. The temperature sensing unit includes a process temperature sensor and a secondary temperature sensor. A temperature signal that is indicative of the temperature of the process medium is produced based on a process temperature signal output from the process temperature sensor and a secondary temperature signal output from the secondary temperature sensor. The compensation circuit compensates the temperature signal for a response time of the temperature measurement to a change in the temperature of the process medium, and outputs a compensated temperature signal. The output circuit produces a temperature output as a function of the compensated temperature signal. The housing is attached to an exterior of the process vessel and contains the secondary temperature sensor.Type: GrantFiled: May 28, 2019Date of Patent: January 18, 2022Assignee: ROSEMOUNT INC.Inventors: Jason Harold Rud, Steve Richard Trimble
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Patent number: 11226299Abstract: A system for determining one or more properties of one or more gases. The system comprises sensors configured to measure thermal conductivity and exothermic responses of a sample at multiple temperatures. Sensor responses to exposure to a gas sample at two or more temperatures are compensated and analyzed by a subsystem. The subsystem is configured to determine a thermal conductivity of the gas sample at each of the two or more temperatures and determine at least one component of the gas sample based at least in part on the thermal conductivity value of the sample at each of the two or more temperatures. Related systems and methods of determining one or more properties of a sample are also disclosed.Type: GrantFiled: July 27, 2020Date of Patent: January 18, 2022Assignee: Nevada Nanotech Systems Inc.Inventors: Benjamin S. Rogers, Christopher J. Dudley, Jesse D. Adams, Ralph G. Whitten, Alexander C. Woods, Vaughn N. Hartung
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Patent number: 11226262Abstract: This device comprises an immobilizing device of a first portion of the shaft, the shaft extending along a first axis, and a movement device of a second portion of the shaft so as to load the shaft in bending. The moving device comprises a first cylinder, a second cylinder, and a connecting device configured to form, between the shaft and one end of the first cylinder, a first connection prohibiting a translation perpendicular to the first axis and allowing a rotation around the first axis, and to form, between the shaft and one end of the second cylinder or between the end of the first cylinder connected to the shaft and one end of the second cylinder, a second connection prohibiting a translation perpendicular to the first axis and allowing a rotation around a second axis parallel to the first axis.Type: GrantFiled: October 23, 2017Date of Patent: January 18, 2022Assignees: MG-VALDUNES, Université de LilleInventors: Florent Brunel, Philippe Dufrénoy, François Demilly
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Patent number: 11226237Abstract: A temperature sensor module with an integrated lid structure for spurious IR-cancellation is disclosed. An improved temperature sensor module that allows detection of a maximum of the relevant IR-radiation from an object's surface of interest as well as generation of additional information about parasitic or spurious IR-radiation that distort the relevant thermal signal in order to enable a cancellation of interfering thermal signal portions is presented. The temperature sensor module includes a temperature sensing element, a sensor-interface control integrated circuit, whereas the temperature sensing element is coupled to the sensor-interface control IC, and a lid structure and a sensor packaging both defining a field of view of the temperature sensor module, wherein the lid structure is formed by a substrate comprising a second integrated temperature sensor connected to the sensor-interface control IC or an external connected processing unit.Type: GrantFiled: October 10, 2018Date of Patent: January 18, 2022Assignee: Integrated Device Technology, Inc.Inventors: Raik Richter, Marko Mailand
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Patent number: 11221257Abstract: The invention relates to a temperature probe (10) comprising a temperature-dependent measuring element (ME), which measuring element (ME) can be contacted via at least a first connecting line (1) and at least a second connecting line (2), the first connecting line (1) having a first and a second portion (T1, T2), and the first and the second portions (T1, T2) consisting of different materials.Type: GrantFiled: December 10, 2015Date of Patent: January 11, 2022Assignee: Endress+Hauser Wetzer GmbH+Co. KGInventors: Alfred Umkehrer, Pavo Vrdoljak, Harald Brundl, Thomas Harle
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Patent number: 11215447Abstract: A transducer for assisting in measuring displacement or strain in an object of interest is described. A plate has at least two end sections for mounting the transducer. It comprises a flexible connection between the two end sections. The flexible connection comprises a plurality of rigid portions and flexible interconnections between the rigid portions for allowing relative movement of the rigid portions with respect to each other. The flexible connection has a central section substantially having a U-shape comprising two rigid portions spaced from each other over a distance and adapted for positioning a strain sensing element at the spacing in between said two rigid portions. The rigid portions and flexible interconnections are arranged so that a displacement applied to the end sections results in a relative displacement at the spacing in the central section that is larger than the relative displacement applied to the end sections.Type: GrantFiled: October 23, 2017Date of Patent: January 4, 2022Assignee: VRIJE UNIVERSITEIT BRUSSELInventors: Urszula Nawrot, Thomas Geernaert, Francis Berghmans, Hugo Thienpont
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Patent number: 11209320Abstract: A temperature sensor that includes an organic-inorganic composite negative temperature coefficient thermistor and a transistor. The organic-inorganic composite negative temperature coefficient thermistor includes a thermistor layer which includes spinel-type semiconductor ceramic composition powder containing Mn, Ni and Fe and an organic polymer component, and a pair of electrode layers. The semiconductor ceramic composition powder has a molar ratio of Mn to Ni of 85/15?Mn/Ni?65/35 and a Fe content of 30 parts by mole or less when a total molar amount of Mn and Ni is regarded as 100 parts by mole, and has a peak with a local maximum value of around 29° to 31° in its X-ray diffraction pattern, a half width of which peak is 0.15 or more. The transistor is electrically connected with either one of the pair of electrode layers.Type: GrantFiled: July 11, 2019Date of Patent: December 28, 2021Assignees: MURATA MANUFACTURING CO., LTD., OSAKA UNIVERSITYInventors: Yasunori Hioki, Tsuyoshi Sekitani, Takafumi Uemura, Tomoaki Onoue